FR2010734A1 - - Google Patents

Info

Publication number
FR2010734A1
FR2010734A1 FR6919146A FR6919146A FR2010734A1 FR 2010734 A1 FR2010734 A1 FR 2010734A1 FR 6919146 A FR6919146 A FR 6919146A FR 6919146 A FR6919146 A FR 6919146A FR 2010734 A1 FR2010734 A1 FR 2010734A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR6919146A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zuse KG
Original Assignee
Zuse KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zuse KG filed Critical Zuse KG
Publication of FR2010734A1 publication Critical patent/FR2010734A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/023—Stackable modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1435—Expandable constructions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Combinations Of Printed Boards (AREA)
FR6919146A 1968-06-12 1969-06-10 Withdrawn FR2010734A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19681765575 DE1765575B1 (de) 1968-06-12 1968-06-12 Schaltungsplatten baueinheit

Publications (1)

Publication Number Publication Date
FR2010734A1 true FR2010734A1 (fr) 1970-02-20

Family

ID=5698503

Family Applications (1)

Application Number Title Priority Date Filing Date
FR6919146A Withdrawn FR2010734A1 (fr) 1968-06-12 1969-06-10

Country Status (5)

Country Link
US (1) US3593064A (fr)
DE (1) DE1765575B1 (fr)
FR (1) FR2010734A1 (fr)
GB (1) GB1283363A (fr)
SE (1) SE341768B (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2664459A1 (fr) * 1990-07-06 1992-01-10 Eg G Carte electronique etanche et le module electronique multicartes obtenu.

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4149220A (en) * 1976-02-19 1979-04-10 Chrysler Corporation Arrangement for mounting a transducer on a housing
US4155402A (en) * 1977-01-03 1979-05-22 Sperry Rand Corporation Compliant mat cooling
US4281361A (en) * 1980-03-17 1981-07-28 The United States Of America As Represented By The Secretary Of The Navy Simplified multilayer circuit board
US4371912A (en) * 1980-10-01 1983-02-01 Motorola, Inc. Method of mounting interrelated components
GB2124432B (en) * 1982-05-11 1986-04-23 Plessey Co Plc Printed circuit board rack
GB2145571B (en) * 1983-08-23 1987-05-20 Standard Telephones Cables Ltd Electronic component module
US4689721A (en) * 1986-01-10 1987-08-25 Trw Inc. Dual printed circuit board module
US4771365A (en) * 1987-10-30 1988-09-13 Honeywell Inc. Passive cooled electronic chassis
DE3826460A1 (de) * 1988-08-04 1990-02-08 Juergen Dipl Ing Pickenhan Kompakte modulare leiterplatteneinheit
US5020586A (en) * 1989-09-08 1991-06-04 Hewlett-Packard Company Air-cooled heat exchanger for electronic circuit modules
US5155905A (en) * 1991-05-03 1992-10-20 Ltv Aerospace And Defense Company Method and apparatus for attaching a circuit component to a printed circuit board
US5479320A (en) * 1991-12-31 1995-12-26 Compaq Computer Corporation Board-to-board connector including an insulative spacer having a conducting surface and U-shaped contacts
US5208729A (en) * 1992-02-14 1993-05-04 International Business Machines Corporation Multi-chip module
US5323292A (en) * 1992-10-06 1994-06-21 Hewlett-Packard Company Integrated multi-chip module having a conformal chip/heat exchanger interface
DE4326207A1 (de) * 1992-10-06 1994-04-07 Hewlett Packard Co Mechanisch schwimmendes Mehr-Chip-Substrat
US5430611A (en) * 1993-07-06 1995-07-04 Hewlett-Packard Company Spring-biased heat sink assembly for a plurality of integrated circuits on a substrate
US5662163A (en) * 1995-11-29 1997-09-02 Silicon Graphics, Inc. Readily removable heat sink assembly
US6657296B2 (en) * 2001-09-25 2003-12-02 Siliconware Precision Industries Co., Ltd. Semicondctor package
US20080084675A1 (en) * 2006-10-05 2008-04-10 Amirali Muhammad H Structure for holding a printed circuit board assembly
US7922523B2 (en) * 2009-07-20 2011-04-12 Sony Ericcson Mobile Communications Ab Vertically stackable sockets for chip modules
CN102548217B (zh) * 2010-12-14 2014-10-01 富葵精密组件(深圳)有限公司 固持装置
US20130050939A1 (en) * 2011-08-28 2013-02-28 Purewave Networks, Inc. Methods and system for effectively removing heat from a wireless base station
US9046906B1 (en) * 2012-02-10 2015-06-02 APlus Mobile Inc. Highly survivable and rugged computer assembly
US10691184B1 (en) * 2018-11-29 2020-06-23 Hewlett Packard Enterprise Development Lp Heat sink assemblies having removable portions
US11832400B2 (en) * 2020-06-23 2023-11-28 Terra Ferma, Llc Ruggedized programmable power switch

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB944039A (en) * 1959-02-21 1963-12-11 Philips Electrical Ind Ltd Improvements in or relating to supporting plates for printed circuits
FR1267025A (fr) * 1959-09-17 1961-07-17 Ncr Co élément électrique enrobé et procédé de scellement et de protection de ses organes
US3141998A (en) * 1960-02-24 1964-07-21 Harry G Silkman Cooled modular electronic package
US3267333A (en) * 1964-02-28 1966-08-16 Lockheed Aircraft Corp Modular electronic package
US3264326A (en) * 1964-04-29 1966-08-02 American Home Prod 17beta-substituted-3alpha-amino-5alpha-androstanes
FR1503163A (fr) * 1965-12-04 1967-11-24 Bbc Brown Boveri & Cie Cadre de guidage destiné à recevoir une plaque imprimée portant des composants électroniques
US3459998A (en) * 1967-08-15 1969-08-05 Bell Telephone Labor Inc Modular circuit assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2664459A1 (fr) * 1990-07-06 1992-01-10 Eg G Carte electronique etanche et le module electronique multicartes obtenu.

Also Published As

Publication number Publication date
SE341768B (fr) 1972-01-10
DE1765575B1 (de) 1971-05-27
GB1283363A (en) 1972-07-26
US3593064A (en) 1971-07-13

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Legal Events

Date Code Title Description
TP Transmission of property
ST Notification of lapse