FR1602768A - Accurate alignment of multilayer unfired - ceramic sheets - Google Patents

Accurate alignment of multilayer unfired - ceramic sheets

Info

Publication number
FR1602768A
FR1602768A FR1602768DA FR1602768A FR 1602768 A FR1602768 A FR 1602768A FR 1602768D A FR1602768D A FR 1602768DA FR 1602768 A FR1602768 A FR 1602768A
Authority
FR
France
Prior art keywords
unfired
multilayer
accurate alignment
holes
ceramic sheets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
French (fr)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of FR1602768A publication Critical patent/FR1602768A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

Opaque unfired sheets of ceramic material (pref. printed integrated circuits), are stacked using an appt. comprising a fixed receptacle, a rotatory charge plate having fixing devices for the opaque sheet to be positioned, which is pierced at 2 points in its frame to take micro-lamps beneath it, a suction plate connected to vacuum, having holes in its rim corresponding to the micro-lamps positions whose position can be adjusted vertically and horizontally in two directions with motors and a fixed plate with optical devices for viewing the innerlamps through the holes when accurately positioned.
FR1602768D 1968-12-20 1968-12-20 Accurate alignment of multilayer unfired - ceramic sheets Expired FR1602768A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR6009641 1968-12-20

Publications (1)

Publication Number Publication Date
FR1602768A true FR1602768A (en) 1971-01-25

Family

ID=8970875

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1602768D Expired FR1602768A (en) 1968-12-20 1968-12-20 Accurate alignment of multilayer unfired - ceramic sheets

Country Status (1)

Country Link
FR (1) FR1602768A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1988005205A1 (en) * 1986-12-29 1988-07-14 Hughes Aircraft Company X-y--z positioning stage
EP0342639A2 (en) * 1988-05-18 1989-11-23 Svg Lithography Systems, Inc. Microlithographic apparatus
US4891526A (en) * 1986-12-29 1990-01-02 Hughes Aircraft Company X-Y-θ-Z positioning stage
CN104270902A (en) * 2014-10-31 2015-01-07 广东威创视讯科技股份有限公司 PCB (Printed Circuit Board) positioning device and SMT (Surface Mount Technology) system

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1988005205A1 (en) * 1986-12-29 1988-07-14 Hughes Aircraft Company X-y--z positioning stage
US4891526A (en) * 1986-12-29 1990-01-02 Hughes Aircraft Company X-Y-θ-Z positioning stage
EP0342639A2 (en) * 1988-05-18 1989-11-23 Svg Lithography Systems, Inc. Microlithographic apparatus
CN104270902A (en) * 2014-10-31 2015-01-07 广东威创视讯科技股份有限公司 PCB (Printed Circuit Board) positioning device and SMT (Surface Mount Technology) system
CN104270902B (en) * 2014-10-31 2017-07-18 广东威创视讯科技股份有限公司 A kind of PCB positioners and SMT system

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Legal Events

Date Code Title Description
ST Notification of lapse