FR1599169A - - Google Patents
Info
- Publication number
- FR1599169A FR1599169A FR1599169DA FR1599169A FR 1599169 A FR1599169 A FR 1599169A FR 1599169D A FR1599169D A FR 1599169DA FR 1599169 A FR1599169 A FR 1599169A
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D88/00—Three-dimensional [3D] integrated devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/834—Interconnections on sidewalls of chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/20—Configurations of stacked chips
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19671591105 DE1591105A1 (de) | 1967-12-06 | 1967-12-06 | Verfahren zum Herstellen von Festkoerperschaltungen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR1599169A true FR1599169A (https=) | 1970-07-15 |
Family
ID=5680111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR1599169D Expired FR1599169A (https=) | 1967-12-06 | 1968-12-06 |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE1591105A1 (https=) |
| FR (1) | FR1599169A (https=) |
| GB (1) | GB1212279A (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0206696A3 (en) * | 1985-06-17 | 1988-08-10 | Fujitsu Limited | Multi-layer semiconductor device |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4500905A (en) * | 1981-09-30 | 1985-02-19 | Tokyo Shibaura Denki Kabushiki Kaisha | Stacked semiconductor device with sloping sides |
| DE3235839A1 (de) * | 1982-09-28 | 1984-03-29 | Siemens AG, 1000 Berlin und 8000 München | Halbleiterschaltung |
| DK0660967T3 (da) * | 1992-09-14 | 2001-08-13 | Shellcase Ltd | Fremgangsmåde til fremstilling af integrerede kredsløbsanordninger |
| IL106892A0 (en) * | 1993-09-02 | 1993-12-28 | Pierre Badehi | Methods and apparatus for producing integrated circuit devices |
| IL108359A (en) * | 1994-01-17 | 2001-04-30 | Shellcase Ltd | Method and apparatus for producing integrated circuit devices |
| US6117707A (en) * | 1994-07-13 | 2000-09-12 | Shellcase Ltd. | Methods of producing integrated circuit devices |
| US5596226A (en) * | 1994-09-06 | 1997-01-21 | International Business Machines Corporation | Semiconductor chip having a chip metal layer and a transfer metal and corresponding electronic module |
| US5521434A (en) * | 1994-10-17 | 1996-05-28 | International Business Machines Corporation | Semiconductor chip and electronic module with integrated surface interconnects/components |
| US12426228B2 (en) | 2022-08-25 | 2025-09-23 | International Business Machines Corporation | SRAM with staggered stacked FET |
-
1967
- 1967-12-06 DE DE19671591105 patent/DE1591105A1/de active Pending
-
1968
- 1968-12-05 GB GB57772/68A patent/GB1212279A/en not_active Expired
- 1968-12-06 FR FR1599169D patent/FR1599169A/fr not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0206696A3 (en) * | 1985-06-17 | 1988-08-10 | Fujitsu Limited | Multi-layer semiconductor device |
| US5051865A (en) * | 1985-06-17 | 1991-09-24 | Fujitsu Limited | Multi-layer semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| GB1212279A (en) | 1970-11-11 |
| DE1591105A1 (de) | 1970-09-24 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |