FR1592313A - - Google Patents
Info
- Publication number
- FR1592313A FR1592313A FR1592313DA FR1592313A FR 1592313 A FR1592313 A FR 1592313A FR 1592313D A FR1592313D A FR 1592313DA FR 1592313 A FR1592313 A FR 1592313A
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/461—Leadframes specially adapted for cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
- Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
- Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49828—Progressively advancing of work assembly station or assembled portion of work
- Y10T29/49829—Advancing work to successive stations [i.e., assembly line]
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US68658967A | 1967-11-29 | 1967-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR1592313A true FR1592313A (https=) | 1970-05-11 |
Family
ID=24756931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR1592313D Expired FR1592313A (https=) | 1967-11-29 | 1968-11-19 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3581387A (https=) |
| DE (1) | DE1801073B2 (https=) |
| FR (1) | FR1592313A (https=) |
| GB (1) | GB1181336A (https=) |
| NL (1) | NL6817115A (https=) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1157498B (de) * | 1959-09-29 | 1963-11-14 | Stig Martin Lindblad | Loesbare Befestigungseinrichtung fuer Kraftfahrzeug-Sicherheitsgurte u. dgl. |
| US3763403A (en) * | 1972-03-01 | 1973-10-02 | Gen Electric | Isolated heat-sink semiconductor device |
| US4012765A (en) * | 1975-09-24 | 1977-03-15 | Motorola, Inc. | Lead frame for plastic encapsulated semiconductor assemblies |
| DE2608250C3 (de) * | 1976-02-28 | 1985-06-05 | Telefunken electronic GmbH, 7100 Heilbronn | Verfahren zum Thermokompressions-Verbinden von auf Halbleiterkörpern befindlichen Metall-Anschlußkontakten mit zugeordneten Gehäuseanschlußteilen und Vorrichtung zur Durchführung des Verfahrens |
| DE2714145C2 (de) * | 1976-03-31 | 1985-01-10 | Mitsubishi Denki K.K., Tokio/Tokyo | Gestanzte Metallträgerplatte für die Herstellung von kunststoffummantelten Halbleiterbauelementen |
| JPS58209147A (ja) * | 1982-05-31 | 1983-12-06 | Toshiba Corp | 樹脂封止型半導体装置 |
| IT1213139B (it) * | 1984-02-17 | 1989-12-14 | Ates Componenti Elettron | Componente elettronico integrato di tipo "single-in-line" eprocedimento per la sua fabbricazione. |
| US6159770A (en) * | 1995-11-08 | 2000-12-12 | Fujitsu Limited | Method and apparatus for fabricating semiconductor device |
| EP1664817A1 (en) * | 2003-09-16 | 2006-06-07 | Koninklijke Philips Electronics N.V. | A method of manufacturing an electronic device and an electronic device |
| US7602054B2 (en) * | 2005-10-05 | 2009-10-13 | Semiconductor Components Industries, L.L.C. | Method of forming a molded array package device having an exposed tab and structure |
-
1967
- 1967-11-29 US US3581387D patent/US3581387A/en not_active Expired - Lifetime
-
1968
- 1968-09-13 GB GB4361368A patent/GB1181336A/en not_active Expired
- 1968-10-01 DE DE19681801073 patent/DE1801073B2/de active Pending
- 1968-11-19 FR FR1592313D patent/FR1592313A/fr not_active Expired
- 1968-11-29 NL NL6817115A patent/NL6817115A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US3581387A (en) | 1971-06-01 |
| GB1181336A (en) | 1970-02-11 |
| DE1801073B2 (de) | 1973-04-19 |
| NL6817115A (https=) | 1969-06-02 |
| DE1801073A1 (de) | 1970-03-26 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |