FR1559157A - - Google Patents

Info

Publication number
FR1559157A
FR1559157A FR1559157DA FR1559157A FR 1559157 A FR1559157 A FR 1559157A FR 1559157D A FR1559157D A FR 1559157DA FR 1559157 A FR1559157 A FR 1559157A
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
French (fr)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of FR1559157A publication Critical patent/FR1559157A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
FR1559157D 1967-02-16 1968-02-15 Expired FR1559157A (cg-RX-API-DMAC10.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB743767A GB1194853A (en) 1967-02-16 1967-02-16 A Method of Forming Printed Circuits

Publications (1)

Publication Number Publication Date
FR1559157A true FR1559157A (cg-RX-API-DMAC10.html) 1969-03-07

Family

ID=9833088

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1559157D Expired FR1559157A (cg-RX-API-DMAC10.html) 1967-02-16 1968-02-15

Country Status (4)

Country Link
DE (1) DE1615853A1 (cg-RX-API-DMAC10.html)
FR (1) FR1559157A (cg-RX-API-DMAC10.html)
GB (1) GB1194853A (cg-RX-API-DMAC10.html)
NL (1) NL6801988A (cg-RX-API-DMAC10.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2430165A1 (fr) * 1978-06-29 1980-01-25 Rogers Corp Plaquette a circuit et son procede de fabrication
FR2478420A1 (fr) * 1980-03-14 1981-09-18 Dainippon Screen Mfg Procede de fabrication de cartes a circuit imprime
EP0238929A3 (en) * 1986-03-28 1988-12-21 International Business Machines Corporation Process for providing circuit lines on a substrate
EP0349161A3 (en) * 1988-06-27 1990-05-09 American Telephone And Telegraph Company Printed wiring board fabrication method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3217983C2 (de) * 1982-05-13 1984-03-29 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Verfahren zum Herstellen einer Abdeckmaske

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2430165A1 (fr) * 1978-06-29 1980-01-25 Rogers Corp Plaquette a circuit et son procede de fabrication
FR2478420A1 (fr) * 1980-03-14 1981-09-18 Dainippon Screen Mfg Procede de fabrication de cartes a circuit imprime
EP0238929A3 (en) * 1986-03-28 1988-12-21 International Business Machines Corporation Process for providing circuit lines on a substrate
EP0349161A3 (en) * 1988-06-27 1990-05-09 American Telephone And Telegraph Company Printed wiring board fabrication method

Also Published As

Publication number Publication date
NL6801988A (cg-RX-API-DMAC10.html) 1968-08-19
GB1194853A (en) 1970-06-17
DE1615853A1 (de) 1970-05-21

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Legal Events

Date Code Title Description
ST Notification of lapse