FR1555176A - - Google Patents
Info
- Publication number
- FR1555176A FR1555176A FR1555176DA FR1555176A FR 1555176 A FR1555176 A FR 1555176A FR 1555176D A FR1555176D A FR 1555176DA FR 1555176 A FR1555176 A FR 1555176A
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/30—
-
- H10P95/00—
-
- H10W72/073—
-
- H10W72/07336—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US61863867A | 1967-02-27 | 1967-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR1555176A true FR1555176A (enExample) | 1969-01-24 |
Family
ID=24478504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR1555176D Expired FR1555176A (enExample) | 1967-02-27 | 1968-02-26 |
Country Status (4)
| Country | Link |
|---|---|
| BE (1) | BE711076A (enExample) |
| FR (1) | FR1555176A (enExample) |
| GB (1) | GB1149606A (enExample) |
| NL (1) | NL6802104A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH662007A5 (en) * | 1983-12-21 | 1987-08-31 | Bbc Brown Boveri & Cie | Method of soldering semiconductor components |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS586143A (ja) * | 1981-07-02 | 1983-01-13 | Matsushita Electronics Corp | 半導体装置 |
| GB2102833B (en) * | 1981-07-31 | 1984-08-01 | Philips Electronic Associated | Lead-indium-silver alloy for use in semiconductor devices |
| JPS60119777A (ja) * | 1983-11-30 | 1985-06-27 | Mitsubishi Electric Corp | ゲ−トタ−ンオフサイリスタ |
| DE19606101A1 (de) * | 1996-02-19 | 1997-08-21 | Siemens Ag | Halbleiterkörper mit Lotmaterialschicht |
| JP2002118202A (ja) * | 2000-10-05 | 2002-04-19 | Sanyo Electric Co Ltd | 放熱基板および半導体モジュール |
| JP2007194514A (ja) * | 2006-01-23 | 2007-08-02 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
| CN119133096B (zh) * | 2024-09-12 | 2025-02-28 | 江南大学 | 一种铜-铝或铝-铝的互连结构及方法 |
-
1968
- 1968-01-30 GB GB4779/68A patent/GB1149606A/en not_active Expired
- 1968-02-14 NL NL6802104A patent/NL6802104A/xx unknown
- 1968-02-21 BE BE711076D patent/BE711076A/xx unknown
- 1968-02-26 FR FR1555176D patent/FR1555176A/fr not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH662007A5 (en) * | 1983-12-21 | 1987-08-31 | Bbc Brown Boveri & Cie | Method of soldering semiconductor components |
Also Published As
| Publication number | Publication date |
|---|---|
| BE711076A (enExample) | 1968-08-21 |
| GB1149606A (en) | 1969-04-23 |
| NL6802104A (enExample) | 1968-08-28 |