FR1548545A - - Google Patents
Info
- Publication number
- FR1548545A FR1548545A FR1548545DA FR1548545A FR 1548545 A FR1548545 A FR 1548545A FR 1548545D A FR1548545D A FR 1548545DA FR 1548545 A FR1548545 A FR 1548545A
- Authority
- FR
- France
- Prior art keywords
- base
- collector
- region
- layer
- oct
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010410 layer Substances 0.000 abstract 4
- 230000015556 catabolic process Effects 0.000 abstract 2
- 239000012535 impurity Substances 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 229910001020 Au alloy Inorganic materials 0.000 abstract 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 abstract 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract 1
- 229910052796 boron Inorganic materials 0.000 abstract 1
- 238000009792 diffusion process Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052698 phosphorus Inorganic materials 0.000 abstract 1
- 239000011574 phosphorus Substances 0.000 abstract 1
- 239000002344 surface layer Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/73—Bipolar junction transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05556—Shape in side view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Bipolar Integrated Circuits (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB4753566A GB1209141A (en) | 1966-10-24 | 1966-10-24 | Improvements in and relating to transistors |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1548545A true FR1548545A (no) | 1968-12-06 |
Family
ID=10445329
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1548545D Expired FR1548545A (no) | 1966-10-24 | 1967-10-24 |
Country Status (8)
Country | Link |
---|---|
BE (1) | BE705522A (no) |
BR (1) | BR6794091D0 (no) |
CH (1) | CH487507A (no) |
DE (1) | DE1614287A1 (no) |
FR (1) | FR1548545A (no) |
GB (1) | GB1209141A (no) |
NL (1) | NL6714395A (no) |
SE (1) | SE319239B (no) |
-
1966
- 1966-10-24 GB GB4753566A patent/GB1209141A/en not_active Expired
-
1967
- 1967-10-20 SE SE14408/67A patent/SE319239B/xx unknown
- 1967-10-23 CH CH1477367A patent/CH487507A/de not_active IP Right Cessation
- 1967-10-23 BR BR19409167A patent/BR6794091D0/pt unknown
- 1967-10-23 BE BE705522D patent/BE705522A/xx unknown
- 1967-10-24 FR FR1548545D patent/FR1548545A/fr not_active Expired
- 1967-10-24 DE DE19671614287 patent/DE1614287A1/de active Pending
- 1967-10-24 NL NL6714395A patent/NL6714395A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
BE705522A (no) | 1968-04-23 |
CH487507A (de) | 1970-03-15 |
GB1209141A (en) | 1970-10-21 |
BR6794091D0 (pt) | 1973-01-11 |
DE1614287A1 (de) | 1970-06-25 |
NL6714395A (no) | 1968-04-25 |
SE319239B (no) | 1970-01-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB1300174A (en) | Improvements in transistors | |
GB935017A (en) | Compound transistor | |
GB1197403A (en) | Improvements relating to Semiconductor Devices | |
GB1306817A (en) | Semiconductor devices | |
GB1301345A (no) | ||
US3532945A (en) | Semiconductor devices having a low capacitance junction | |
GB1154891A (en) | Semiconductor Devices and Methods of Manufacture | |
GB1058240A (en) | Semiconductor device | |
GB1073551A (en) | Integrated circuit comprising a diode and method of making the same | |
GB949646A (en) | Improvements in or relating to semiconductor devices | |
GB1217472A (en) | Integrated circuits | |
GB1369357A (en) | Semiconductive devices | |
GB1334745A (en) | Semiconductor devices | |
US3836996A (en) | Semiconductor darlington circuit | |
GB1455260A (en) | Semiconductor devices | |
GB1076371A (en) | Semiconductor device with auxiliary junction for enhancing breakdown voltage of primary junction | |
FR1548545A (no) | ||
GB1071294A (en) | Improvements in and relating to the manufacture of transistors | |
GB1161978A (en) | Semiconductor Integrated Circuit including a Bidirectional Transistor and Method of Making the Same | |
GB1268406A (en) | Improvements in and relating to pressure sensitive semiconductor devices and method of manufacturing the same | |
GB1337906A (en) | Integrated semiconductor structure | |
GB1270498A (en) | Semiconductor devices | |
GB1207305A (en) | Improvements in transistors | |
GB1074287A (en) | Improvements in and relating to semiconductor devices | |
GB1292667A (en) | Improvements in or relating to semiconductor devices and to methods of making them |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |