FR1528320A - Resin-sealed semiconductor and process for its manufacture - Google Patents
Resin-sealed semiconductor and process for its manufactureInfo
- Publication number
- FR1528320A FR1528320A FR111185A FR111185A FR1528320A FR 1528320 A FR1528320 A FR 1528320A FR 111185 A FR111185 A FR 111185A FR 111185 A FR111185 A FR 111185A FR 1528320 A FR1528320 A FR 1528320A
- Authority
- FR
- France
- Prior art keywords
- manufacture
- resin
- sealed semiconductor
- sealed
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR111185A FR1528320A (en) | 1966-06-20 | 1967-06-20 | Resin-sealed semiconductor and process for its manufacture |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3955166 | 1966-06-20 | ||
FR111185A FR1528320A (en) | 1966-06-20 | 1967-06-20 | Resin-sealed semiconductor and process for its manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1528320A true FR1528320A (en) | 1968-06-07 |
Family
ID=26177486
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR111185A Expired FR1528320A (en) | 1966-06-20 | 1967-06-20 | Resin-sealed semiconductor and process for its manufacture |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR1528320A (en) |
-
1967
- 1967-06-20 FR FR111185A patent/FR1528320A/en not_active Expired
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