FR1484521A - Device for mounting components in an electronic circuit - Google Patents

Device for mounting components in an electronic circuit

Info

Publication number
FR1484521A
FR1484521A FR66875A FR66875A FR1484521A FR 1484521 A FR1484521 A FR 1484521A FR 66875 A FR66875 A FR 66875A FR 66875 A FR66875 A FR 66875A FR 1484521 A FR1484521 A FR 1484521A
Authority
FR
France
Prior art keywords
electronic circuit
mounting components
mounting
components
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR66875A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US466574A external-priority patent/US3392256A/en
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Priority to FR66875A priority Critical patent/FR1484521A/en
Application granted granted Critical
Publication of FR1484521A publication Critical patent/FR1484521A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
FR66875A 1965-06-24 1966-06-24 Device for mounting components in an electronic circuit Expired FR1484521A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR66875A FR1484521A (en) 1965-06-24 1966-06-24 Device for mounting components in an electronic circuit

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US466574A US3392256A (en) 1965-06-24 1965-06-24 Method and apparatus for assembling electronic components to printed circuit boards
FR66875A FR1484521A (en) 1965-06-24 1966-06-24 Device for mounting components in an electronic circuit

Publications (1)

Publication Number Publication Date
FR1484521A true FR1484521A (en) 1967-06-09

Family

ID=26171554

Family Applications (1)

Application Number Title Priority Date Filing Date
FR66875A Expired FR1484521A (en) 1965-06-24 1966-06-24 Device for mounting components in an electronic circuit

Country Status (1)

Country Link
FR (1) FR1484521A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0012319A1 (en) * 1978-12-06 1980-06-25 Württembergische Metallwarenfabrik Ag. Method and template for securing components having flat connecting leads onto conductive substrates
EP0023599A2 (en) * 1979-08-06 1981-02-11 Siemens Aktiengesellschaft Soldering clip for microsoldering joints

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0012319A1 (en) * 1978-12-06 1980-06-25 Württembergische Metallwarenfabrik Ag. Method and template for securing components having flat connecting leads onto conductive substrates
EP0023599A2 (en) * 1979-08-06 1981-02-11 Siemens Aktiengesellschaft Soldering clip for microsoldering joints
EP0023599A3 (en) * 1979-08-06 1981-07-15 Siemens Aktiengesellschaft Soldering clip for microsoldering joints

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