FR1389727A - Thermoelectric devices and method for making such devices - Google Patents

Thermoelectric devices and method for making such devices

Info

Publication number
FR1389727A
FR1389727A FR964004A FR964004A FR1389727A FR 1389727 A FR1389727 A FR 1389727A FR 964004 A FR964004 A FR 964004A FR 964004 A FR964004 A FR 964004A FR 1389727 A FR1389727 A FR 1389727A
Authority
FR
France
Prior art keywords
devices
making
thermoelectric
thermoelectric devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR964004A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Radio Corporation of America
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp, Radio Corporation of America filed Critical RCA Corp
Priority to FR964004A priority Critical patent/FR1389727A/en
Application granted granted Critical
Publication of FR1389727A publication Critical patent/FR1389727A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/8556—Thermoelectric active materials comprising inorganic compositions comprising compounds containing germanium or silicon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
FR964004A 1963-02-19 1964-02-17 Thermoelectric devices and method for making such devices Expired FR1389727A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR964004A FR1389727A (en) 1963-02-19 1964-02-17 Thermoelectric devices and method for making such devices

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US25965563A 1963-02-19 1963-02-19
US25963163A 1963-02-19 1963-02-19
FR964004A FR1389727A (en) 1963-02-19 1964-02-17 Thermoelectric devices and method for making such devices

Publications (1)

Publication Number Publication Date
FR1389727A true FR1389727A (en) 1965-02-19

Family

ID=27247777

Family Applications (1)

Application Number Title Priority Date Filing Date
FR964004A Expired FR1389727A (en) 1963-02-19 1964-02-17 Thermoelectric devices and method for making such devices

Country Status (1)

Country Link
FR (1) FR1389727A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3470033A (en) * 1967-04-01 1969-09-30 Siemens Ag Thermoelectric device comprising silicon alloy thermocouple legs bonded by a solder composed of palladium alloy

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3470033A (en) * 1967-04-01 1969-09-30 Siemens Ag Thermoelectric device comprising silicon alloy thermocouple legs bonded by a solder composed of palladium alloy

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