FR1387586A - Procédé de fabrication de circuits imprimés protégés par de la matière plastique mince et flexible - Google Patents
Procédé de fabrication de circuits imprimés protégés par de la matière plastique mince et flexibleInfo
- Publication number
- FR1387586A FR1387586A FR967777A FR967777A FR1387586A FR 1387586 A FR1387586 A FR 1387586A FR 967777 A FR967777 A FR 967777A FR 967777 A FR967777 A FR 967777A FR 1387586 A FR1387586 A FR 1387586A
- Authority
- FR
- France
- Prior art keywords
- thin
- manufacturing process
- plastic material
- flexible plastic
- printed circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/58—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising fillers only, e.g. particles, powder, beads, flakes, spheres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/034—Organic insulating material consisting of one material containing halogen
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US267664A US3215574A (en) | 1963-03-25 | 1963-03-25 | Method of making thin flexible plasticsealed printed circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1387586A true FR1387586A (fr) | 1965-01-29 |
Family
ID=23019694
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR967777A Expired FR1387586A (fr) | 1963-03-25 | 1964-03-17 | Procédé de fabrication de circuits imprimés protégés par de la matière plastique mince et flexible |
Country Status (4)
Country | Link |
---|---|
US (1) | US3215574A (fr) |
DE (1) | DE1258940B (fr) |
FR (1) | FR1387586A (fr) |
GB (1) | GB994930A (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0013379A1 (fr) * | 1978-12-26 | 1980-07-23 | Rogers Corporation | Matériau diélectrique, supports de circuit fabriqués en ce matériau et procédé pour la fabrication de ce matériau et de ces supports |
FR2525065A1 (fr) * | 1982-04-08 | 1983-10-14 | Carpano & Pons | Dispositif de connexion et procedes de fabrication |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1366903A (fr) * | 1963-06-04 | 1964-07-17 | Ass Ouvriers Instr Precision | Résistances imprimées et leur procédé de fabrication |
DE1440866B2 (de) * | 1963-12-14 | 1970-05-06 | Balco Filtertechnik GmbH, 33OO Braunschweig | Verfahren zur Herstellung gedruckter Schaltungen zur Verwendung in Schalteranordnungen |
US3391246A (en) * | 1964-03-16 | 1968-07-02 | Westinghouse Electric Corp | Multiconductor flat cables |
US3314033A (en) * | 1965-01-29 | 1967-04-11 | Blh Electronics | Gage units for flame-spray installation |
US3547725A (en) * | 1965-10-14 | 1970-12-15 | Sanders Associates Inc | Method of fabricating an electrical resistance heating pad |
US3448617A (en) * | 1967-05-18 | 1969-06-10 | Gen Electric | Liquid level sensor adapted for use in hydrocarbon fuels |
US3496336A (en) * | 1967-10-25 | 1970-02-17 | Texas Instruments Inc | Electric heater |
FR96297E (fr) * | 1967-11-24 | 1972-06-16 | Gen Electric | Détecteur de niveau de liquides. |
US3584198A (en) * | 1968-02-29 | 1971-06-08 | Matsushita Electric Works Ltd | Flexible electric surface heater |
BE661207A (fr) * | 1968-05-13 | 1965-07-16 | ||
US3729819A (en) * | 1970-01-09 | 1973-05-01 | Nippon Toki Kk | Method and device for fabricating printed wiring or the like |
US4001466A (en) * | 1973-11-27 | 1977-01-04 | Formica International Limited | Process for preparing printed circuits |
US3925138A (en) * | 1973-11-27 | 1975-12-09 | Formica Int | Process for preparing an insulating substrate for use in printed circuits |
US4000348A (en) * | 1974-10-15 | 1976-12-28 | Carlisle Corporation | Flat multiconductor cable and process for manufacture thereof |
US4178404A (en) * | 1978-02-06 | 1979-12-11 | The United States Of America As Represented By The Secretary Of The Navy | Immersed reticle |
JPS58152794U (ja) * | 1982-04-06 | 1983-10-13 | 東京特殊電線株式会社 | 面状発熱体 |
DE3221500A1 (de) * | 1982-06-07 | 1983-12-08 | Max-E. Dipl.-Ing. 7320 Göppingen Reeb | Identifizierungsanordnung in form eines an einem gegenstand anbringbaren gebildes und verfahren zur herstellung |
US5294290A (en) * | 1982-06-07 | 1994-03-15 | Reeb Max E | Computer and electromagnetic energy based mass production method for the continuous flow make of planar electrical circuits |
US4960490A (en) * | 1983-06-13 | 1990-10-02 | Minnesota Mining And Manufacturing Company | Method of making multiple-connector adhesive tape |
US4690845A (en) * | 1984-02-22 | 1987-09-01 | Gila River Products, Inc. | Method and apparatus for laminating flexible printed circuits |
US4548859A (en) * | 1984-10-12 | 1985-10-22 | The Boeing Company | Breather material and method of coating fabric with silicone rubber |
JPH06103783B2 (ja) * | 1987-03-16 | 1994-12-14 | 日本シイエムケイ株式会社 | プリント配線板のソルダーレジスト用印刷インク |
US4824511A (en) * | 1987-10-19 | 1989-04-25 | E. I. Du Pont De Nemours And Company | Multilayer circuit board with fluoropolymer interlayers |
US4861648A (en) * | 1988-03-14 | 1989-08-29 | Gila River Products, Inc. | Materials for laminating flexible printed circuits |
US6687969B1 (en) | 1997-05-16 | 2004-02-10 | Micron Technology, Inc. | Methods of fixturing flexible substrates and methods of processing flexible substrates |
US5972152A (en) * | 1997-05-16 | 1999-10-26 | Micron Communications, Inc. | Methods of fixturing flexible circuit substrates and a processing carrier, processing a flexible circuit and processing a flexible circuit substrate relative to a processing carrier |
DE19812880A1 (de) * | 1998-03-24 | 1999-09-30 | Bayer Ag | Formteil und flexible Folie mit geschützter Leiterbahn und Verfahren zu ihrer Herstellung |
US7326463B2 (en) * | 2001-02-15 | 2008-02-05 | Integral Technologies, Inc. | Conductive circuits or cables manufactured from conductive loaded resin-based materials |
JP3610400B2 (ja) * | 2003-03-31 | 2005-01-12 | 日本航空電子工業株式会社 | 電気接続部品 |
TWI354523B (en) * | 2007-05-25 | 2011-12-11 | Princo Corp | Method for manufacturing metal lines in multi-laye |
US8815333B2 (en) | 2007-12-05 | 2014-08-26 | Princo Middle East Fze | Manufacturing method of metal structure in multi-layer substrate |
GB2522954B (en) * | 2013-11-04 | 2018-08-08 | Ftg Circuits Inc | High temperature multilayer flexible printed wiring board |
JP6275200B2 (ja) * | 2016-06-16 | 2018-02-07 | 日本化薬株式会社 | 高周波回路に適した両面回路用基板 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3086071A (en) * | 1959-08-28 | 1963-04-16 | Hughes Aircraft Co | Flexible electrical cable and method of making the same |
US3135823A (en) * | 1960-06-28 | 1964-06-02 | Pritikin Nathan | Metallic element embedding process and product |
-
1963
- 1963-03-25 US US267664A patent/US3215574A/en not_active Expired - Lifetime
-
1964
- 1964-02-29 DE DEH51884A patent/DE1258940B/de active Pending
- 1964-03-13 GB GB10824/64A patent/GB994930A/en not_active Expired
- 1964-03-17 FR FR967777A patent/FR1387586A/fr not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0013379A1 (fr) * | 1978-12-26 | 1980-07-23 | Rogers Corporation | Matériau diélectrique, supports de circuit fabriqués en ce matériau et procédé pour la fabrication de ce matériau et de ces supports |
FR2525065A1 (fr) * | 1982-04-08 | 1983-10-14 | Carpano & Pons | Dispositif de connexion et procedes de fabrication |
Also Published As
Publication number | Publication date |
---|---|
DE1258940B (de) | 1968-01-18 |
US3215574A (en) | 1965-11-02 |
GB994930A (en) | 1965-06-10 |
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