GB2522954B - High temperature multilayer flexible printed wiring board - Google Patents

High temperature multilayer flexible printed wiring board

Info

Publication number
GB2522954B
GB2522954B GB1419574.7A GB201419574A GB2522954B GB 2522954 B GB2522954 B GB 2522954B GB 201419574 A GB201419574 A GB 201419574A GB 2522954 B GB2522954 B GB 2522954B
Authority
GB
United Kingdom
Prior art keywords
high temperature
wiring board
printed wiring
flexible printed
multilayer flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB1419574.7A
Other versions
GB201419574D0 (en
GB2522954A (en
Inventor
A Nelson Robert
L Dubois Raymond
A Collier Michael
E Keating James
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ftg Circuits Inc
Original Assignee
Ftg Circuits Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/527,124 external-priority patent/US20150122532A1/en
Application filed by Ftg Circuits Inc filed Critical Ftg Circuits Inc
Publication of GB201419574D0 publication Critical patent/GB201419574D0/en
Publication of GB2522954A publication Critical patent/GB2522954A/en
Application granted granted Critical
Publication of GB2522954B publication Critical patent/GB2522954B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
GB1419574.7A 2013-11-04 2014-11-03 High temperature multilayer flexible printed wiring board Active GB2522954B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361899628P 2013-11-04 2013-11-04
US14/527,124 US20150122532A1 (en) 2013-11-04 2014-10-29 High temperature multilayer flexible printed wiring board

Publications (3)

Publication Number Publication Date
GB201419574D0 GB201419574D0 (en) 2014-12-17
GB2522954A GB2522954A (en) 2015-08-12
GB2522954B true GB2522954B (en) 2018-08-08

Family

ID=52118636

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1419574.7A Active GB2522954B (en) 2013-11-04 2014-11-03 High temperature multilayer flexible printed wiring board

Country Status (1)

Country Link
GB (1) GB2522954B (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3215574A (en) * 1963-03-25 1965-11-02 Hughes Aircraft Co Method of making thin flexible plasticsealed printed circuits
US4800461A (en) * 1987-11-02 1989-01-24 Teledyne Industries, Inc. Multilayer combined rigid and flex printed circuits
JPH01244851A (en) * 1988-03-28 1989-09-29 Matsushita Electric Works Ltd Manufacture of electric laminate
US5629497A (en) * 1994-10-04 1997-05-13 Cmk Corporation Printed wiring board and method of manufacturing in which a basefilm including conductive circuits is covered by a cured polyimide resin lay
US5633480A (en) * 1994-10-04 1997-05-27 Cmk Corporation Printed wiring board having a cover lay laminated on a polyimide resin base film containing conductive circuits
US5877940A (en) * 1993-12-02 1999-03-02 Teledyne Industries Inc. Fabrication multilayer combined rigid/flex printed circuit board
US5997983A (en) * 1997-05-30 1999-12-07 Teledyneindustries, Inc. Rigid/flex printed circuit board using angled prepreg
WO2008003545A1 (en) * 2006-07-04 2008-01-10 Continental Automotive Gmbh Flexible conductor and use of a glass fiber material and a resin for the flexible conductor
US20130192882A1 (en) * 2012-01-27 2013-08-01 Kyocera Slc Technologies Corporation Wiring board and mounting structure using the same

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3215574A (en) * 1963-03-25 1965-11-02 Hughes Aircraft Co Method of making thin flexible plasticsealed printed circuits
US4800461A (en) * 1987-11-02 1989-01-24 Teledyne Industries, Inc. Multilayer combined rigid and flex printed circuits
JPH01244851A (en) * 1988-03-28 1989-09-29 Matsushita Electric Works Ltd Manufacture of electric laminate
US5877940A (en) * 1993-12-02 1999-03-02 Teledyne Industries Inc. Fabrication multilayer combined rigid/flex printed circuit board
US5629497A (en) * 1994-10-04 1997-05-13 Cmk Corporation Printed wiring board and method of manufacturing in which a basefilm including conductive circuits is covered by a cured polyimide resin lay
US5633480A (en) * 1994-10-04 1997-05-27 Cmk Corporation Printed wiring board having a cover lay laminated on a polyimide resin base film containing conductive circuits
US5997983A (en) * 1997-05-30 1999-12-07 Teledyneindustries, Inc. Rigid/flex printed circuit board using angled prepreg
WO2008003545A1 (en) * 2006-07-04 2008-01-10 Continental Automotive Gmbh Flexible conductor and use of a glass fiber material and a resin for the flexible conductor
US20130192882A1 (en) * 2012-01-27 2013-08-01 Kyocera Slc Technologies Corporation Wiring board and mounting structure using the same

Also Published As

Publication number Publication date
GB201419574D0 (en) 2014-12-17
GB2522954A (en) 2015-08-12

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)

Free format text: REGISTERED BETWEEN 20170126 AND 20170201