FR1312664A - Procédé de fabrication d'une ou de plusieurs électrodes de contact de redressement - Google Patents

Procédé de fabrication d'une ou de plusieurs électrodes de contact de redressement

Info

Publication number
FR1312664A
FR1312664A FR882136A FR882136A FR1312664A FR 1312664 A FR1312664 A FR 1312664A FR 882136 A FR882136 A FR 882136A FR 882136 A FR882136 A FR 882136A FR 1312664 A FR1312664 A FR 1312664A
Authority
FR
France
Prior art keywords
manufacturing
contact electrodes
rectifying contact
rectifying
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR882136A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Micronas GmbH
Original Assignee
TDK Micronas GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Micronas GmbH filed Critical TDK Micronas GmbH
Priority to FR882136A priority Critical patent/FR1312664A/fr
Application granted granted Critical
Publication of FR1312664A publication Critical patent/FR1312664A/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291Oxides or nitrides or carbides, e.g. ceramics, glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
FR882136A 1961-05-12 1961-12-15 Procédé de fabrication d'une ou de plusieurs électrodes de contact de redressement Expired FR1312664A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR882136A FR1312664A (fr) 1961-05-12 1961-12-15 Procédé de fabrication d'une ou de plusieurs électrodes de contact de redressement

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEJ0019907 1961-05-12
FR882136A FR1312664A (fr) 1961-05-12 1961-12-15 Procédé de fabrication d'une ou de plusieurs électrodes de contact de redressement

Publications (1)

Publication Number Publication Date
FR1312664A true FR1312664A (fr) 1962-12-21

Family

ID=25982303

Family Applications (1)

Application Number Title Priority Date Filing Date
FR882136A Expired FR1312664A (fr) 1961-05-12 1961-12-15 Procédé de fabrication d'une ou de plusieurs électrodes de contact de redressement

Country Status (1)

Country Link
FR (1) FR1312664A (fr)

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