FR1294742A - Improvements to the surface treatment of metallic copper - Google Patents

Improvements to the surface treatment of metallic copper

Info

Publication number
FR1294742A
FR1294742A FR849523A FR849523A FR1294742A FR 1294742 A FR1294742 A FR 1294742A FR 849523 A FR849523 A FR 849523A FR 849523 A FR849523 A FR 849523A FR 1294742 A FR1294742 A FR 1294742A
Authority
FR
France
Prior art keywords
surface treatment
metallic copper
metallic
copper
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR849523A
Other languages
French (fr)
Inventor
Edmund Leopold De Rothschild
Leopold David De Rothschild
Evelyn Robert Adria Rothschild
David Richard Colville
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rothschild & Sons Nv
ROTHSCHILDS CONTINUATION Ltd S
Original Assignee
Rothschild & Sons Nv
ROTHSCHILDS CONTINUATION Ltd S
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rothschild & Sons Nv, ROTHSCHILDS CONTINUATION Ltd S filed Critical Rothschild & Sons Nv
Priority to FR849523A priority Critical patent/FR1294742A/en
Application granted granted Critical
Publication of FR1294742A publication Critical patent/FR1294742A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/34—Anodisation of metals or alloys not provided for in groups C25D11/04 - C25D11/32
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
FR849523A 1960-01-15 1961-01-12 Improvements to the surface treatment of metallic copper Expired FR1294742A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR849523A FR1294742A (en) 1960-01-15 1961-01-12 Improvements to the surface treatment of metallic copper

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB162360 1960-01-15
FR849523A FR1294742A (en) 1960-01-15 1961-01-12 Improvements to the surface treatment of metallic copper

Publications (1)

Publication Number Publication Date
FR1294742A true FR1294742A (en) 1962-06-01

Family

ID=26188895

Family Applications (1)

Application Number Title Priority Date Filing Date
FR849523A Expired FR1294742A (en) 1960-01-15 1961-01-12 Improvements to the surface treatment of metallic copper

Country Status (1)

Country Link
FR (1) FR1294742A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3389061A (en) * 1963-06-04 1968-06-18 Ass Ouvriers Instr Precision Anodization of a copper-nickelmanganese alloy
WO2020148308A1 (en) * 2019-01-15 2020-07-23 Atotech Deutschland Gmbh Method of forming copper oxide on a copper surface

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3389061A (en) * 1963-06-04 1968-06-18 Ass Ouvriers Instr Precision Anodization of a copper-nickelmanganese alloy
WO2020148308A1 (en) * 2019-01-15 2020-07-23 Atotech Deutschland Gmbh Method of forming copper oxide on a copper surface
CN113316663A (en) * 2019-01-15 2021-08-27 德国艾托特克公司 Method for forming copper oxide on copper surface
JP2022517368A (en) * 2019-01-15 2022-03-08 アトテック ドイチェランド ゲーエムベーハー How to form copper oxide on a copper surface

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