FR1325089A - Semiconductor surface treatment - Google Patents
Semiconductor surface treatmentInfo
- Publication number
- FR1325089A FR1325089A FR891369A FR891369A FR1325089A FR 1325089 A FR1325089 A FR 1325089A FR 891369 A FR891369 A FR 891369A FR 891369 A FR891369 A FR 891369A FR 1325089 A FR1325089 A FR 1325089A
- Authority
- FR
- France
- Prior art keywords
- surface treatment
- semiconductor surface
- semiconductor
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR891369A FR1325089A (en) | 1961-04-27 | 1962-03-16 | Semiconductor surface treatment |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10598461A | 1961-04-27 | 1961-04-27 | |
FR891369A FR1325089A (en) | 1961-04-27 | 1962-03-16 | Semiconductor surface treatment |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1325089A true FR1325089A (en) | 1963-04-26 |
Family
ID=26194818
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR891369A Expired FR1325089A (en) | 1961-04-27 | 1962-03-16 | Semiconductor surface treatment |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR1325089A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2366773A1 (en) * | 1976-10-01 | 1978-04-28 | Eurofarad | Encapsulation of electronic components with thermoplastic coatings - using low viscosity wax to seal a resin base coating of high viscosity |
-
1962
- 1962-03-16 FR FR891369A patent/FR1325089A/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2366773A1 (en) * | 1976-10-01 | 1978-04-28 | Eurofarad | Encapsulation of electronic components with thermoplastic coatings - using low viscosity wax to seal a resin base coating of high viscosity |
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