FR1274695A - Ensembles de circuits imprimés - Google Patents

Ensembles de circuits imprimés

Info

Publication number
FR1274695A
FR1274695A FR839790A FR839790A FR1274695A FR 1274695 A FR1274695 A FR 1274695A FR 839790 A FR839790 A FR 839790A FR 839790 A FR839790 A FR 839790A FR 1274695 A FR1274695 A FR 1274695A
Authority
FR
France
Prior art keywords
pcb assemblies
pcb
assemblies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR839790A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Application granted granted Critical
Publication of FR1274695A publication Critical patent/FR1274695A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49163—Manufacturing circuit on or in base with sintering of base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12063—Nonparticulate metal component
    • Y10T428/1209—Plural particulate metal components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12389—All metal or with adjacent metals having variation in thickness
    • Y10T428/12396—Discontinuous surface component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Powder Metallurgy (AREA)
  • Manufacturing Of Printed Wiring (AREA)
FR839790A 1959-10-19 1960-09-28 Ensembles de circuits imprimés Expired FR1274695A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US847290A US3075280A (en) 1959-10-19 1959-10-19 Method of making printed wiring assemblies

Publications (1)

Publication Number Publication Date
FR1274695A true FR1274695A (fr) 1961-10-27

Family

ID=25300273

Family Applications (1)

Application Number Title Priority Date Filing Date
FR839790A Expired FR1274695A (fr) 1959-10-19 1960-09-28 Ensembles de circuits imprimés

Country Status (5)

Country Link
US (1) US3075280A (fr)
BE (1) BE595982A (fr)
DE (1) DE1202854B (fr)
FR (1) FR1274695A (fr)
GB (1) GB922963A (fr)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3200298A (en) * 1963-05-27 1965-08-10 United Aircraft Corp Multilayer ceramic circuitry
US3800020A (en) * 1972-03-23 1974-03-26 Cramer P Co Method of making a circuit board
US3849877A (en) * 1973-08-22 1974-11-26 Nasa Method for making conductors for ferrite memory arrays
DE3023905C2 (de) * 1980-06-26 1982-09-09 Adam Opel AG, 6090 Rüsselsheim Armaturentafel für Fahrzeuge, insbesondere Kraftfahrzeuge, und Verfahren zur Herstellung einer solchen
KR840009026A (ko) * 1983-03-02 1984-12-20 아아르 미첼(외2) 데니스 전기 전도체를 절연 기판에 접착하는 방법
US6591496B2 (en) * 2001-08-28 2003-07-15 3M Innovative Properties Company Method for making embedded electrical traces
US7160583B2 (en) * 2004-12-03 2007-01-09 3M Innovative Properties Company Microfabrication using patterned topography and self-assembled monolayers
WO2007061448A2 (fr) * 2005-05-18 2007-05-31 President And Fellows Of Harvard College Fabrication de passages conducteurs, microcircuits et microstructures dans des reseaux microfluidiques
US7871670B2 (en) * 2005-08-10 2011-01-18 3M Innovative Properties Company Microfabrication using replicated patterned topography and self-assembled monolayers
US8764996B2 (en) * 2006-10-18 2014-07-01 3M Innovative Properties Company Methods of patterning a material on polymeric substrates
US20080095988A1 (en) * 2006-10-18 2008-04-24 3M Innovative Properties Company Methods of patterning a deposit metal on a polymeric substrate
US7968804B2 (en) 2006-12-20 2011-06-28 3M Innovative Properties Company Methods of patterning a deposit metal on a substrate
WO2018092798A1 (fr) * 2016-11-18 2018-05-24 矢崎総業株式会社 Procédé de formation de corps de circuit et corps de circuit
US10272836B2 (en) 2017-06-28 2019-04-30 Honda Motor Co., Ltd. Smart functional leather for steering wheel and dash board
US10953793B2 (en) 2017-06-28 2021-03-23 Honda Motor Co., Ltd. Haptic function leather component and method of making the same
US10742061B2 (en) 2017-06-28 2020-08-11 Honda Motor Co., Ltd. Smart functional leather for recharging a portable electronic device
US11665830B2 (en) 2017-06-28 2023-05-30 Honda Motor Co., Ltd. Method of making smart functional leather
US10682952B2 (en) 2017-06-28 2020-06-16 Honda Motor Co., Ltd. Embossed smart functional premium natural leather
US11225191B2 (en) 2017-06-28 2022-01-18 Honda Motor Co., Ltd. Smart leather with wireless power
US11751337B2 (en) 2019-04-26 2023-09-05 Honda Motor Co., Ltd. Wireless power of in-mold electronics and the application within a vehicle

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1895519A (en) * 1929-06-06 1933-01-31 Orville S Peters Method of preparing carbon resistance stacks
US2172243A (en) * 1938-06-16 1939-09-05 Bay State Abrasive Products Co Manufacture of abrasive wheels
US2447541A (en) * 1945-01-29 1948-08-24 Sabee Method of making plastic structure
DE808052C (de) * 1949-04-29 1951-07-09 N S F Nuernberger Schraubenfab Verfahren zum Aufbringen leitender Metallschichten auf isolierende Traegerkoerper
US2721153A (en) * 1949-06-02 1955-10-18 Ward Blenkinsop & Co Ltd Production of conducting layers upon electrical resistors
US2578209A (en) * 1949-11-30 1951-12-11 Art Electrotype Company Method of making molds for electrotypes
US2700719A (en) * 1951-09-08 1955-01-25 Coler Potentiometer device
US2777162A (en) * 1952-10-29 1957-01-15 Western Electric Co Pressing punch and die
NL210738A (fr) * 1955-09-21

Also Published As

Publication number Publication date
GB922963A (en) 1963-04-03
US3075280A (en) 1963-01-29
BE595982A (fr) 1961-02-01
DE1202854B (de) 1965-10-14

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