FR1230256A - Method and apparatus for machining materials - Google Patents

Method and apparatus for machining materials

Info

Publication number
FR1230256A
FR1230256A FR800223A FR800223A FR1230256A FR 1230256 A FR1230256 A FR 1230256A FR 800223 A FR800223 A FR 800223A FR 800223 A FR800223 A FR 800223A FR 1230256 A FR1230256 A FR 1230256A
Authority
FR
France
Prior art keywords
machining materials
machining
materials
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR800223A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hammond Machinery Builders Inc
Original Assignee
Hammond Machinery Builders Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hammond Machinery Builders Inc filed Critical Hammond Machinery Builders Inc
Application granted granted Critical
Publication of FR1230256A publication Critical patent/FR1230256A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/12—Single-purpose machines or devices for grinding travelling elongated stock, e.g. strip-shaped work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
FR800223A 1958-07-17 1959-07-16 Method and apparatus for machining materials Expired FR1230256A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US1230256XA 1958-07-17 1958-07-17

Publications (1)

Publication Number Publication Date
FR1230256A true FR1230256A (en) 1960-09-14

Family

ID=22406302

Family Applications (1)

Application Number Title Priority Date Filing Date
FR800223A Expired FR1230256A (en) 1958-07-17 1959-07-16 Method and apparatus for machining materials

Country Status (1)

Country Link
FR (1) FR1230256A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2497715A1 (en) * 1981-01-09 1982-07-16 Ramiere Jean Distributor for decorative laths - incorporates staple distributor for magazine, former, feed corridor, transporter and rotating drum
US5803797A (en) * 1996-11-26 1998-09-08 Micron Technology, Inc. Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck
US5809987A (en) * 1996-11-26 1998-09-22 Micron Technology,Inc. Apparatus for reducing damage to wafer cutting blades during wafer dicing
CN109434727A (en) * 2019-01-12 2019-03-08 王伟 Clamping tooling is used in a kind of auto repair maintenance

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2497715A1 (en) * 1981-01-09 1982-07-16 Ramiere Jean Distributor for decorative laths - incorporates staple distributor for magazine, former, feed corridor, transporter and rotating drum
US5803797A (en) * 1996-11-26 1998-09-08 Micron Technology, Inc. Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck
US5809987A (en) * 1996-11-26 1998-09-22 Micron Technology,Inc. Apparatus for reducing damage to wafer cutting blades during wafer dicing
US5888127A (en) * 1996-11-26 1999-03-30 Micron Technology, Inc. Apparatus to hold and remove an integrated circuit chip on a cutting chuck
US5953590A (en) * 1996-11-26 1999-09-14 Micron Technology, Inc. Method and apparatus to hold integrated circuit chips onto a chuck and to simultaneously remove multiple integrated circuit chips from a cutting chuck
US5950613A (en) * 1996-11-26 1999-09-14 Micron Technology, Inc. Apparatus and method for reducing damage to wafer cutting blades during wafer dicing
US6024631A (en) * 1996-11-26 2000-02-15 Micron Technology, Inc. Method and apparatus to hold integrated circuit chips onto a chuck and to simultaneously remove multiple integrated circuit chips from a cutting chuck
US6067977A (en) * 1996-11-26 2000-05-30 Micron Technology, Inc. Apparatus and method for reducing damage to wafer cutting blades during wafer dicing
US6112740A (en) * 1996-11-26 2000-09-05 Micron Technology, Inc. Method for reducing damage to wafer cutting blades during wafer dicing
US6253758B1 (en) 1996-11-26 2001-07-03 Micron Technology, Inc. Apparatus for reducing damage to wafer cutting blades during wafer dicing
US6253755B1 (en) 1996-11-26 2001-07-03 Micron Technology, Inc. Method for reducing damage to wafer cutting blades during wafer dicing
US6295978B1 (en) 1996-11-26 2001-10-02 Micron Technology, Inc. Method for reducing damage to wafer cutting blades during wafer dicing
CN109434727A (en) * 2019-01-12 2019-03-08 王伟 Clamping tooling is used in a kind of auto repair maintenance
CN109434727B (en) * 2019-01-12 2024-02-20 王伟 Clamping tool for automobile maintenance

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