FR1187704A - Welding process - Google Patents
Welding processInfo
- Publication number
- FR1187704A FR1187704A FR1187704DA FR1187704A FR 1187704 A FR1187704 A FR 1187704A FR 1187704D A FR1187704D A FR 1187704DA FR 1187704 A FR1187704 A FR 1187704A
- Authority
- FR
- France
- Prior art keywords
- welding process
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
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- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
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- H01L2224/45001—Core members of the connector
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB941757 | 1957-03-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1187704A true FR1187704A (en) | 1959-09-15 |
Family
ID=9871572
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1187704D Expired FR1187704A (en) | 1957-03-22 | 1957-05-04 | Welding process |
Country Status (2)
Country | Link |
---|---|
FR (1) | FR1187704A (en) |
GB (1) | GB821551A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3171067A (en) * | 1960-02-19 | 1965-02-23 | Texas Instruments Inc | Base washer contact for transistor and method of fabricating same |
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1956
- 1956-05-04 GB GB13954/56A patent/GB821551A/en not_active Expired
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1957
- 1957-05-04 FR FR1187704D patent/FR1187704A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB821551A (en) | 1959-10-07 |
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