FI991510A - Arrangements for the dissipation of heat energy generated by a heat source a - Google Patents

Arrangements for the dissipation of heat energy generated by a heat source a Download PDF

Info

Publication number
FI991510A
FI991510A FI991510A FI991510A FI991510A FI 991510 A FI991510 A FI 991510A FI 991510 A FI991510 A FI 991510A FI 991510 A FI991510 A FI 991510A FI 991510 A FI991510 A FI 991510A
Authority
FI
Finland
Prior art keywords
dissipation
arrangements
energy generated
heat
heat source
Prior art date
Application number
FI991510A
Other languages
Finnish (fi)
Swedish (sv)
Inventor
Timo Heikkilae
Carl Axel Ingemar Kabrell
Reijo Lehtiniemi
Jukka Rantala
Original Assignee
Nokia Networks Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Networks Oy filed Critical Nokia Networks Oy
Priority to FI991510A priority Critical patent/FI991510A/en
Priority to EP00944074A priority patent/EP1192844A1/en
Priority to AU58310/00A priority patent/AU5831000A/en
Priority to PCT/FI2000/000597 priority patent/WO2001003485A1/en
Publication of FI991510A publication Critical patent/FI991510A/en
Priority to US10/026,656 priority patent/US20020117292A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
FI991510A 1999-07-01 1999-07-01 Arrangements for the dissipation of heat energy generated by a heat source a FI991510A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FI991510A FI991510A (en) 1999-07-01 1999-07-01 Arrangements for the dissipation of heat energy generated by a heat source a
EP00944074A EP1192844A1 (en) 1999-07-01 2000-06-29 Arrangement for dissipating thermal energy generated by heat source
AU58310/00A AU5831000A (en) 1999-07-01 2000-06-29 Arrangement for dissipating thermal energy generated by heat source
PCT/FI2000/000597 WO2001003485A1 (en) 1999-07-01 2000-06-29 Arrangement for dissipating thermal energy generated by heat source
US10/026,656 US20020117292A1 (en) 1999-07-01 2001-12-27 Arrangement for dissipating thermal energy generated by heat source

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI991510A FI991510A (en) 1999-07-01 1999-07-01 Arrangements for the dissipation of heat energy generated by a heat source a

Publications (1)

Publication Number Publication Date
FI991510A true FI991510A (en) 2001-01-02

Family

ID=8555007

Family Applications (1)

Application Number Title Priority Date Filing Date
FI991510A FI991510A (en) 1999-07-01 1999-07-01 Arrangements for the dissipation of heat energy generated by a heat source a

Country Status (5)

Country Link
US (1) US20020117292A1 (en)
EP (1) EP1192844A1 (en)
AU (1) AU5831000A (en)
FI (1) FI991510A (en)
WO (1) WO2001003485A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7299860B2 (en) * 2005-12-30 2007-11-27 Igor Victorovich Touzov Integral fastener heat pipe

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3311421B2 (en) * 1993-04-02 2002-08-05 古河電気工業株式会社 High density heat dissipation type circuit board
JPH0853100A (en) * 1994-08-10 1996-02-27 Mitsubishi Electric Corp Honeycomb sandwhich panel with heat pipe embedded in it
US5598632A (en) * 1994-10-06 1997-02-04 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method for producing micro heat panels
US6133631A (en) * 1997-05-30 2000-10-17 Hewlett-Packard Company Semiconductor package lid with internal heat pipe

Also Published As

Publication number Publication date
EP1192844A1 (en) 2002-04-03
US20020117292A1 (en) 2002-08-29
WO2001003485A1 (en) 2001-01-11
AU5831000A (en) 2001-01-22

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