EP1192844A1 - Arrangement for dissipating thermal energy generated by heat source - Google Patents

Arrangement for dissipating thermal energy generated by heat source

Info

Publication number
EP1192844A1
EP1192844A1 EP00944074A EP00944074A EP1192844A1 EP 1192844 A1 EP1192844 A1 EP 1192844A1 EP 00944074 A EP00944074 A EP 00944074A EP 00944074 A EP00944074 A EP 00944074A EP 1192844 A1 EP1192844 A1 EP 1192844A1
Authority
EP
European Patent Office
Prior art keywords
heat
conductor element
arrangement
heat source
thermal energy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00944074A
Other languages
German (de)
French (fr)
Inventor
Timo HEIKKILÄ
Reijo Lehtiniemi
Carl Kabrell
Jukka Rantala
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia Oyj
Original Assignee
Nokia Oyj
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Oyj filed Critical Nokia Oyj
Publication of EP1192844A1 publication Critical patent/EP1192844A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to an arrangement for dissipating thermal energy generated by a heat source, which arrangement comprises a heat conductor element for conducting thermal energy generated by the heat source away from the heat source, the heat conductor element having at least one micro heat pipe module attached to it for distributing thermal energy generated by the heat source in the heat conductor element.
  • Cooling electronic components is an old problem which has become more and more pronounced with increasing integration intensities and power.
  • New methods, such as heat pipes have lately emerged along with conventional convection cooling.
  • a standard heat pipe is typically a copper cylinder several millimetres in diameter and about nine inches in length, emptied of air and partly filled with a working fluid.
  • a heat pipe conducts thermal energy generated by a heat source, such as an electronic component, from one end of the heat pipe to another as latent heat from the change of phase of a working fluid in the heat pipe.
  • the thermal heat generated by the heat source makes the working fluid boil and vaporise in the hot end of the heat pipe, i.e. the vaporiser of the heat pipe. Due to a generated pressure difference, the vapour moves to the other, cold end of the heat pipe, i.e. the condenser of the heat pipe, where the vapour surrenders it latent heat and returns as fluid back to the vaporiser driven by capillary forces.
  • a heat pipe is an extremely efficient heat conductor, its effective thermal conductivity is typically 10 to 100 times better than that of copper.
  • heat pipes have usually been installed in such a manner that for each heat source, such as an electronic component, there is one separate heat pipe conducting heat to a condenser. If one circuit board has several electronic components requiring cooling, placing heat pipes in an efficient manner is difficult, awkward and requires space.
  • micro heat pipe modules which comprise very small micro heat pipes placed side by side and a binding agent. These have been used to even out temperature distribution, especially when the heat source is a local one and surrounded by an area considerably cooler in temperature.
  • the micro heat pipe modules are usually attached between the heat source, such as an electronic component generating thermal energy, and a heat conductor element, such as cooling plates or the body of an apparatus.
  • Micro heat pipe modules have been disclosed in US patent 5,527,588, for instance.
  • the method has its limitations, however.
  • An extra layer between the component and the heat conductor element creates a new material interface. This interface creates a thermal contact resistance which impairs heat conduction from the heat source through the heat conductor element to the cooling air.
  • the radial heat conductivity of the micro heat pipes in the micro heat pipe module is especially poor, because a micro heat pipe has an almost full vacuum and an axial heat flow dominates heat conduction completely. Achieving a good thermal contact when attaching the heat source to the micro heat pipe module is difficult, because through-drilled screws cannot be used as they would puncture the micro heat pipes. In addition, it is impossible to ground the heat source to the heat conductor element through the micro heat pipe module.
  • the object of the invention is achieved by an arrangement which is characterized in that the heat source is attached to an element which is in thermal contact with the heat conductor element and which is made of a heat conducting material and which is arranged to conduct thermal energy from the heat source to the heat conductor element by means of the heat conducting ability of said heat conducting material.
  • the solution of the invention provides the advantage that it improves the conduction of thermal energy from the heat source to directly the heat conductor element, because the micro heat pipe module, whose heat conductivity in the radial direction of the micro heat pipes is extremely poor, does not constitute an obstruction between the heat source and the heat conductor element.
  • the solution of the invention provides the further advantage that with it, it is possible to minimize the maximum heat flow to the micro heat pipe modules, because a part of the heat load is directly conducted to the heat conductor element and the micro heat pipe module can function at a higher thermal energy generated by the heat source.
  • the solution of the invention provides the yet further advantage that the heat source can easily be attached to the element with screws, for instance, because there is no danger of puncturing the micro heat pipes with the screws.
  • the solution of the invention provides the yet further advantage that with it, it is possible to minimize the thermal contact resistance between the heat source and the heat conductor element, because the heat source can be attached with screws through holes drilled directly to the element.
  • the solution of the invention provides the yet further advantage that with it, it is possible to even out the temperature distribution of the heat conductor element at maximum coverage, because the heat conductor element can be substantially entirely covered with micro heat pipe modules with the exception of the element at the heat source.
  • the solution of the invention provides the yet further advantage that electronic components can be directly grounded through the element to the heat conductor element.
  • Figure 2 shows a side view of the arrangement of Figure 1
  • Figure 3 shows an arrangement having a hole in the micro heat pipe module.
  • the figures show an arrangement of the invention for dissipating thermal energy generated by a heat source 1.
  • the heat source 1 can be an electronic component, for instance.
  • the arrangement comprises a heat conductor element 2 for conducting thermal energy generated by the heat source 1 away from the heat source 1.
  • the heat conductor element 2 can be cooling plates or the body of an apparatus, for instance.
  • a circuit board can also act as a heat conductor element 2.
  • At least one micro heat pipe module 3 is attached to the heat conductor element 2 for distributing thermal energy generated by the heat source 1 in the heat conductor element 2. Since the micro heat pipe module 3 is known per se, it will not be described in more detail herein.
  • a heat pipe module can be used instead of the micro heat pipe module 3, if there is enough space.
  • the heat source 1 is attached to an element 4 which is in thermal contact with the heat conductor element 2 and which element 4 is made of a heat conducting material and which element 4 is arranged to conduct thermal energy from the heat source 1 to the heat conductor element 2 by means of the heat conducting ability of said heat conducting material.
  • Figure 1 shows an arrangement having two micro heat pipe modules 3 with an intermediate space 5 between them.
  • the element 4 which is in thermal contact with the heat conductor element 2 is installed in this intermediate space 5.
  • the element 4 fills the intermediate space 5 substantially entirely. Such an arrangement provides good heat conductivity between the element 4 and the micro heat pipe modules 3.
  • Figure 3 shows an arrangement where the micro heat pipe module 3 has a hole 6 and the element 4 which is in thermal contact with the heat conductor element 2 is installed in the hole 6. There can be more than one of these holes 6.
  • the element 4 fills the hole. 6 substantially entirely.
  • Such an arrangement provides good heat conductivity between the element 4 and the micro heat pipe modules 3. It is also possible for the arrangement to have several micro heat pipe modules 3, as shown in Figure 1 , and that at least one of them has the hole 6 described in the arrangement shown in Figure 3.
  • the element 4 which is in thermal contact with the heat conductor element 2 is preferably seamlessly attached to the heat conductor element 2, i.e. the element 4 and the heat conductor element 2 constitute one and the same part. Arrangements of this kind are presented in the figures. In such an arrangement, there is no interface between the element 4 and the heat conductor element 2 and consequently, heat conduction is good between the element 4 and the heat conductor element 2.
  • the element 4 is a separate part which is in thermal contact with the heat conductor element 2, which means that heat can conduct from the element 4 to the heat conductor element 2.
  • thermal grease or a corresponding material improving heat conduction can be used between the element 4 and the heat conductor element 2.
  • the heat conducting material is preferably a copper metal or an aluminium metal.
  • the heat conductor element 2 shown in the figures is preferably equipped with cooling fins 7 which improves the cooling of the heat conductor element 2, i.e. the conduction of thermal energy from the heat conductor element 2 to the surrounding area.
  • the micro heat pipe modules 3 are sunk in recesses 8 in the heat conductor element 2.
  • the recesses 8 can be machined, for instance, in the heat conductor element 2.
  • the recesses 8 can, for instance, be made such that they correspond substantially to the dimensions and shape of the micro heat pipe modules 3, which provides good conductivity between the micro heat pipe modules 3 and the heat conductor element 2.
  • the heat source 1 is attached with screws 9 to the element 4.
  • the heat source 1 can, if necessary, be grounded with the screws

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to an arrangement for dissipating thermal energy generated by a heat source (1), which arrangement comprises a heat conductor element (2) for conducting thermal energy generated by the heat source (1) away from the heat source (1), the heat conductor element (2) having at least one micro heat pipe module (3) attached to it for distributing thermal energy generated by the heat source (1) in the heat conductor element (2). The heat source (1) is attached to an element (4) which is made of a heat conducting material and which is in thermal contact with the heat conductor element (2) and which is arranged to conduct thermal energy from the heat source (1) to the heat conductor element (2) by means of the heat conducting ability of said heat conducting material.

Description

ARRANGEMENT FOR DISSIPATING THERMAL ENERGY GENERATED BY HEAT
SOURCE
BACKGROUND OF THE INVENTION
The invention relates to an arrangement for dissipating thermal energy generated by a heat source, which arrangement comprises a heat conductor element for conducting thermal energy generated by the heat source away from the heat source, the heat conductor element having at least one micro heat pipe module attached to it for distributing thermal energy generated by the heat source in the heat conductor element. Cooling electronic components is an old problem which has become more and more pronounced with increasing integration intensities and power. New methods, such as heat pipes, have lately emerged along with conventional convection cooling. A standard heat pipe is typically a copper cylinder several millimetres in diameter and about nine inches in length, emptied of air and partly filled with a working fluid.
A heat pipe conducts thermal energy generated by a heat source, such as an electronic component, from one end of the heat pipe to another as latent heat from the change of phase of a working fluid in the heat pipe. The thermal heat generated by the heat source makes the working fluid boil and vaporise in the hot end of the heat pipe, i.e. the vaporiser of the heat pipe. Due to a generated pressure difference, the vapour moves to the other, cold end of the heat pipe, i.e. the condenser of the heat pipe, where the vapour surrenders it latent heat and returns as fluid back to the vaporiser driven by capillary forces. A heat pipe is an extremely efficient heat conductor, its effective thermal conductivity is typically 10 to 100 times better than that of copper.
Until now, heat pipes have usually been installed in such a manner that for each heat source, such as an electronic component, there is one separate heat pipe conducting heat to a condenser. If one circuit board has several electronic components requiring cooling, placing heat pipes in an efficient manner is difficult, awkward and requires space.
This problem has been solved by means of micro heat pipe modules which comprise very small micro heat pipes placed side by side and a binding agent. These have been used to even out temperature distribution, especially when the heat source is a local one and surrounded by an area considerably cooler in temperature. The micro heat pipe modules are usually attached between the heat source, such as an electronic component generating thermal energy, and a heat conductor element, such as cooling plates or the body of an apparatus. Micro heat pipe modules have been disclosed in US patent 5,527,588, for instance.
The method has its limitations, however. An extra layer between the component and the heat conductor element creates a new material interface. This interface creates a thermal contact resistance which impairs heat conduction from the heat source through the heat conductor element to the cooling air. In addition, the radial heat conductivity of the micro heat pipes in the micro heat pipe module is especially poor, because a micro heat pipe has an almost full vacuum and an axial heat flow dominates heat conduction completely. Achieving a good thermal contact when attaching the heat source to the micro heat pipe module is difficult, because through-drilled screws cannot be used as they would puncture the micro heat pipes. In addition, it is impossible to ground the heat source to the heat conductor element through the micro heat pipe module.
BRIEF DESCRIPTION OF THE INVENTION
It is thus an object of the invention to develop an arrangement for dissipating thermal energy generated by a heat source so as to solve the above problems.
The object of the invention is achieved by an arrangement which is characterized in that the heat source is attached to an element which is in thermal contact with the heat conductor element and which is made of a heat conducting material and which is arranged to conduct thermal energy from the heat source to the heat conductor element by means of the heat conducting ability of said heat conducting material.
Preferred embodiments of the invention are set forth in the dependent claims. The invention is based on the fact that since the heat source is installed on an element which is made of a heat conducting material and which is in thermal contact with a heat conductor element, thermal energy can directly conduct from the heat source to the heat conductor element.
The solution of the invention provides the advantage that it improves the conduction of thermal energy from the heat source to directly the heat conductor element, because the micro heat pipe module, whose heat conductivity in the radial direction of the micro heat pipes is extremely poor, does not constitute an obstruction between the heat source and the heat conductor element. The solution of the invention provides the further advantage that with it, it is possible to minimize the maximum heat flow to the micro heat pipe modules, because a part of the heat load is directly conducted to the heat conductor element and the micro heat pipe module can function at a higher thermal energy generated by the heat source. The solution of the invention provides the yet further advantage that the heat source can easily be attached to the element with screws, for instance, because there is no danger of puncturing the micro heat pipes with the screws.
The solution of the invention provides the yet further advantage that with it, it is possible to minimize the thermal contact resistance between the heat source and the heat conductor element, because the heat source can be attached with screws through holes drilled directly to the element.
The solution of the invention provides the yet further advantage that with it, it is possible to even out the temperature distribution of the heat conductor element at maximum coverage, because the heat conductor element can be substantially entirely covered with micro heat pipe modules with the exception of the element at the heat source.
The solution of the invention provides the yet further advantage that electronic components can be directly grounded through the element to the heat conductor element.
BRIEF DESCRIPTION OF THE FIGURES
In the following, the invention will be described in greater detail by means of preferred embodiments and with reference to the attached drawings in which Figure 1 shows a top view of an arrangement having two micro heat pipe modules,
Figure 2 shows a side view of the arrangement of Figure 1 , and Figure 3 shows an arrangement having a hole in the micro heat pipe module. DETAILED DESCRIPTION OF THE INVENTION
The figures show an arrangement of the invention for dissipating thermal energy generated by a heat source 1. The heat source 1 can be an electronic component, for instance. The arrangement comprises a heat conductor element 2 for conducting thermal energy generated by the heat source 1 away from the heat source 1. The heat conductor element 2 can be cooling plates or the body of an apparatus, for instance. A circuit board can also act as a heat conductor element 2. At least one micro heat pipe module 3 is attached to the heat conductor element 2 for distributing thermal energy generated by the heat source 1 in the heat conductor element 2. Since the micro heat pipe module 3 is known per se, it will not be described in more detail herein. A heat pipe module can be used instead of the micro heat pipe module 3, if there is enough space.
The heat source 1 is attached to an element 4 which is in thermal contact with the heat conductor element 2 and which element 4 is made of a heat conducting material and which element 4 is arranged to conduct thermal energy from the heat source 1 to the heat conductor element 2 by means of the heat conducting ability of said heat conducting material.
Figure 1 shows an arrangement having two micro heat pipe modules 3 with an intermediate space 5 between them. The element 4 which is in thermal contact with the heat conductor element 2 is installed in this intermediate space 5. Alternatively, there can be more than two micro heat pipe modules 3. In the arrangement shown in Figure 1 , the element 4 fills the intermediate space 5 substantially entirely. Such an arrangement provides good heat conductivity between the element 4 and the micro heat pipe modules 3.
Figure 3 shows an arrangement where the micro heat pipe module 3 has a hole 6 and the element 4 which is in thermal contact with the heat conductor element 2 is installed in the hole 6. There can be more than one of these holes 6. In the arrangement shown in Figure 3, the element 4 fills the hole. 6 substantially entirely. Such an arrangement provides good heat conductivity between the element 4 and the micro heat pipe modules 3. It is also possible for the arrangement to have several micro heat pipe modules 3, as shown in Figure 1 , and that at least one of them has the hole 6 described in the arrangement shown in Figure 3.
The element 4 which is in thermal contact with the heat conductor element 2 is preferably seamlessly attached to the heat conductor element 2, i.e. the element 4 and the heat conductor element 2 constitute one and the same part. Arrangements of this kind are presented in the figures. In such an arrangement, there is no interface between the element 4 and the heat conductor element 2 and consequently, heat conduction is good between the element 4 and the heat conductor element 2.
It is entirely possible that the element 4 is a separate part which is in thermal contact with the heat conductor element 2, which means that heat can conduct from the element 4 to the heat conductor element 2. In such a case, thermal grease or a corresponding material improving heat conduction can be used between the element 4 and the heat conductor element 2.
The heat conducting material is preferably a copper metal or an aluminium metal.
The heat conductor element 2 shown in the figures is preferably equipped with cooling fins 7 which improves the cooling of the heat conductor element 2, i.e. the conduction of thermal energy from the heat conductor element 2 to the surrounding area.
In the arrangements shown in the figures, the micro heat pipe modules 3 are sunk in recesses 8 in the heat conductor element 2. The recesses 8 can be machined, for instance, in the heat conductor element 2. The recesses 8 can, for instance, be made such that they correspond substantially to the dimensions and shape of the micro heat pipe modules 3, which provides good conductivity between the micro heat pipe modules 3 and the heat conductor element 2.
In the figures, the heat source 1 is attached with screws 9 to the element 4. The heat source 1 can, if necessary, be grounded with the screws
9 to the heat conductor element 2 or through the element 4 to the heat conductor element 2. A good contact is also achieved between the heat source and the heat conductor element 2 by means of the screws.
It is obvious to a person skilled in the art that while technology advances, the basic idea of the invention can be implemented in many different ways. The invention and its embodiments are thus not restricted to the examples described above, but can vary within the scope of the claims.

Claims

1. An arrangement for dissipating thermal energy generated by a heat source (1), which arrangement comprises a heat conductor element (2) for conducting thermal energy generated by the heat source (1) away from the heat source (1), the heat conductor element (2) having at least one micro heat pipe module (3) attached to it for distributing thermal energy generated by the heat source (1) in the heat conductor element (2), characterized in that the heat source (1 ) is attached to an element (4) which is made of a heat conducting material and which is in thermal contact with the heat conductor element (2) and which is arranged to conduct thermal energy from the heat source (1) to the heat conductor element (2) by means of the heat conducting ability of said heat conducting material.
2. An arrangement as claimed in claim 1, characterized in that it has at least two micro heat pipe modules (3) having an intermediate space (5) between them, and that the element (4) which is in thermal contact with the heat conductor element (2) is installed in the intermediate space (5).
3. An arrangement as claimed in claim 2, characterized in that the element (4) fills the intermediate space (5) substantially entirely.
4. An arrangement as claimed in claim 1, characterized in that the micro heat pipe module (3) has a hole (6) and that the element (4) which is in thermal contact with the heat conductor element (2) is installed in the hole (6).
5. An arrangement as claimed in claim 4, characterized in that the element (4) fills the hole (6) substantially entirely.
6. An arrangement as claimed in claim 1, characterized in that the element (4) which is in thermal contact with the heat conductor element (2) is seamlessly attached to the heat conductor element (2).
7. An arrangement as claimed in claim 1, characterized in that the heat conductor element (2) is equipped with cooling fins (7).
8. An arrangement as claimed in claim 1, characterized in that the micro heat pipe module (3) is sunk in a recess (8) in the heat conductor element (2).
9. An arrangement as claimed in claim 1, characterized in that the heat conducting material is a copper metal.
10. An arrangement as claimed in claim 1, characterized in that the heat conducting material is an aluminium metal.
EP00944074A 1999-07-01 2000-06-29 Arrangement for dissipating thermal energy generated by heat source Withdrawn EP1192844A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FI991510 1999-07-01
FI991510A FI991510A (en) 1999-07-01 1999-07-01 Arrangements for the dissipation of heat energy generated by a heat source a
PCT/FI2000/000597 WO2001003485A1 (en) 1999-07-01 2000-06-29 Arrangement for dissipating thermal energy generated by heat source

Publications (1)

Publication Number Publication Date
EP1192844A1 true EP1192844A1 (en) 2002-04-03

Family

ID=8555007

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00944074A Withdrawn EP1192844A1 (en) 1999-07-01 2000-06-29 Arrangement for dissipating thermal energy generated by heat source

Country Status (5)

Country Link
US (1) US20020117292A1 (en)
EP (1) EP1192844A1 (en)
AU (1) AU5831000A (en)
FI (1) FI991510A (en)
WO (1) WO2001003485A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7299860B2 (en) * 2005-12-30 2007-11-27 Igor Victorovich Touzov Integral fastener heat pipe

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3311421B2 (en) * 1993-04-02 2002-08-05 古河電気工業株式会社 High density heat dissipation type circuit board
JPH0853100A (en) * 1994-08-10 1996-02-27 Mitsubishi Electric Corp Honeycomb sandwhich panel with heat pipe embedded in it
US5598632A (en) * 1994-10-06 1997-02-04 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method for producing micro heat panels
US6133631A (en) * 1997-05-30 2000-10-17 Hewlett-Packard Company Semiconductor package lid with internal heat pipe

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO0103485A1 *

Also Published As

Publication number Publication date
WO2001003485A1 (en) 2001-01-11
AU5831000A (en) 2001-01-22
FI991510A (en) 2001-01-02
US20020117292A1 (en) 2002-08-29

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