FI991506A - A method of making sensor elements and a sensor element - Google Patents

A method of making sensor elements and a sensor element Download PDF

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Publication number
FI991506A
FI991506A FI991506A FI991506A FI991506A FI 991506 A FI991506 A FI 991506A FI 991506 A FI991506 A FI 991506A FI 991506 A FI991506 A FI 991506A FI 991506 A FI991506 A FI 991506A
Authority
FI
Finland
Prior art keywords
sensor
making
sensor element
elements
sensor elements
Prior art date
Application number
FI991506A
Other languages
Finnish (fi)
Swedish (sv)
Other versions
FI108986B (en
Inventor
Heikki Raeisaenen
Original Assignee
Emfitech Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Emfitech Oy filed Critical Emfitech Oy
Priority to FI991506A priority Critical patent/FI108986B/en
Priority to FI991987A priority patent/FI108987B/en
Priority to PCT/FI2000/000607 priority patent/WO2001002823A1/en
Priority to US10/018,413 priority patent/US6996891B1/en
Priority to EP00945970A priority patent/EP1192434B1/en
Publication of FI991506A publication Critical patent/FI991506A/en
Application granted granted Critical
Publication of FI108986B publication Critical patent/FI108986B/en
Priority to US10/996,263 priority patent/US7685696B2/en
Priority to US12/622,721 priority patent/US7954385B2/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
    • G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
    • G01L1/146—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors for measuring force distributions, e.g. using force arrays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49007—Indicating transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49075—Electromagnet, transformer or inductor including permanent magnet or core
    • Y10T29/49078—Laminated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/49798—Dividing sequentially from leading end, e.g., by cutting or breaking
FI991506A 1999-07-01 1999-07-01 Process for producing a sensor element and a sensor element FI108986B (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FI991506A FI108986B (en) 1999-07-01 1999-07-01 Process for producing a sensor element and a sensor element
FI991987A FI108987B (en) 1999-07-01 1999-09-17 Method for production of a pickup element and said pickup element
PCT/FI2000/000607 WO2001002823A1 (en) 1999-07-01 2000-07-03 Method for the manufacture of a sensor element, and a sensor element
US10/018,413 US6996891B1 (en) 1999-07-01 2000-07-03 Method for the manufacture of a sensor element
EP00945970A EP1192434B1 (en) 1999-07-01 2000-07-03 Method for the manufacture of a sensor element, and a sensor element
US10/996,263 US7685696B2 (en) 1999-07-01 2004-11-23 Method of manufacturing an electromechanical sensor element
US12/622,721 US7954385B2 (en) 1999-07-01 2009-11-20 Method and system for using a sensor element for identifying an object

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI991506A FI108986B (en) 1999-07-01 1999-07-01 Process for producing a sensor element and a sensor element

Publications (2)

Publication Number Publication Date
FI991506A true FI991506A (en) 2001-01-02
FI108986B FI108986B (en) 2002-04-30

Family

ID=8555004

Family Applications (1)

Application Number Title Priority Date Filing Date
FI991506A FI108986B (en) 1999-07-01 1999-07-01 Process for producing a sensor element and a sensor element

Country Status (4)

Country Link
US (3) US6996891B1 (en)
EP (1) EP1192434B1 (en)
FI (1) FI108986B (en)
WO (1) WO2001002823A1 (en)

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FI118622B (en) 2002-01-17 2008-01-15 Band Oy B Musical instrument converter and method of making it
US7727181B2 (en) 2002-10-09 2010-06-01 Abbott Diabetes Care Inc. Fluid delivery device with autocalibration
US7679407B2 (en) 2003-04-28 2010-03-16 Abbott Diabetes Care Inc. Method and apparatus for providing peak detection circuitry for data communication systems
US7183930B2 (en) 2003-07-18 2007-02-27 Intelligent Mechatronic Systems Inc. Occupant heartbeat detection and monitoring system
US7299082B2 (en) * 2003-10-31 2007-11-20 Abbott Diabetes Care, Inc. Method of calibrating an analyte-measurement device, and associated methods, devices and systems
US20070135697A1 (en) * 2004-04-19 2007-06-14 Therasense, Inc. Method and apparatus for providing sensor guard for data monitoring and detection systems
US20060076103A1 (en) * 2004-10-08 2006-04-13 Tactex Controls Inc. Method for manufacturing sensors having wavy elements
US9636450B2 (en) 2007-02-19 2017-05-02 Udo Hoss Pump system modular components for delivering medication and analyte sensing at seperate insertion sites
US20100331646A1 (en) * 2009-06-30 2010-12-30 Abbott Diabetes Care Inc. Health Management Devices and Methods
CA2601441A1 (en) 2005-03-21 2006-09-28 Abbott Diabetes Care Inc. Method and system for providing integrated medication infusion and analyte monitoring system
FI119794B (en) * 2005-04-28 2009-03-13 Panphonics Oy Electrostatic converter, method of its connection and method of manufacture
US7768408B2 (en) 2005-05-17 2010-08-03 Abbott Diabetes Care Inc. Method and system for providing data management in data monitoring system
JP4868347B2 (en) * 2005-09-12 2012-02-01 国立大学法人 東京大学 Tactile sensor module and tactile sensor mounting method
US8880138B2 (en) 2005-09-30 2014-11-04 Abbott Diabetes Care Inc. Device for channeling fluid and methods of use
US7583190B2 (en) 2005-10-31 2009-09-01 Abbott Diabetes Care Inc. Method and apparatus for providing data communication in data monitoring and management systems
DE102006039858A1 (en) * 2006-01-02 2007-07-12 Ceramtec Ag Innovative Ceramic Engineering Monolithic bending element
US7885698B2 (en) 2006-02-28 2011-02-08 Abbott Diabetes Care Inc. Method and system for providing continuous calibration of implantable analyte sensors
US7826879B2 (en) 2006-02-28 2010-11-02 Abbott Diabetes Care Inc. Analyte sensors and methods of use
US8579853B2 (en) 2006-10-31 2013-11-12 Abbott Diabetes Care Inc. Infusion devices and methods
JP5044196B2 (en) * 2006-11-13 2012-10-10 アイシン精機株式会社 Piezoelectric sensor and manufacturing method thereof
US8625824B2 (en) * 2007-09-04 2014-01-07 Industrial Technology Research Institute Flat speaker unit and speaker device therewith
WO2010009172A1 (en) 2008-07-14 2010-01-21 Abbott Diabetes Care Inc. Closed loop control system interface and methods
US8467972B2 (en) 2009-04-28 2013-06-18 Abbott Diabetes Care Inc. Closed loop blood glucose control algorithm analysis
DK3689237T3 (en) 2009-07-23 2021-08-16 Abbott Diabetes Care Inc Method of preparation and system for continuous analyte measurement
US8621942B2 (en) * 2009-08-03 2014-01-07 Atmel Corporation Force sensor with compressible electrode
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DE102010063555A1 (en) * 2010-12-20 2012-06-21 Robert Bosch Gmbh Device for transmitting and / or receiving an ultrasonic signal
KR101480752B1 (en) * 2012-03-30 2015-01-09 한국과학기술원 Apparatus for measuring surface shape
EP2953012B1 (en) * 2013-01-29 2018-04-18 Suzhou Institute of Nano-tech and Nano-bionics (SINANO) Chinese Academy of Sciences Electronic skin, preparation method and use thereof
WO2015102745A1 (en) 2013-12-31 2015-07-09 Abbott Diabetes Care Inc. Self-powered analyte sensor and devices using the same
WO2017053728A1 (en) 2015-09-23 2017-03-30 Emfit, Corp. Heart rate monitoring device, system, and method for increasing performance improvement efficiency
DE102015015879A1 (en) * 2015-12-09 2017-06-14 Molibso Entwicklungs- Und Vertriebs Gmbh Measuring arrangement for the examination of sliding boards
US10473539B2 (en) 2016-06-30 2019-11-12 Tekscan, Inc. Stretchable force sensor having undulating patterned electrodes
JP6953513B2 (en) * 2016-08-05 2021-10-27 スティーブン アラン マーシュ， Micro pressure sensor
US10183862B2 (en) * 2016-09-14 2019-01-22 GM Global Technology Operations LLC Method of strain gauge fabrication using a transfer substrate
CN107991354B (en) * 2016-10-26 2020-02-14 英属维京群岛商艾格生科技股份有限公司 Substrate structure of biological sensing test piece and manufacturing method of biological sensing test piece
CN108231993B (en) * 2017-03-22 2022-07-05 苏州贝骨新材料科技有限公司 Polarization method and application of piezoelectric electret material component
EP3946017A4 (en) 2019-03-31 2022-12-07 Emfit Corp. Wearable sensor and healthcare management system using a wearable sensor
US10823626B2 (en) 2019-04-01 2020-11-03 General Electric Company Strain sensor printing
CN111765995A (en) * 2020-07-06 2020-10-13 东华大学 Self-driven antibacterial flexible electronic skin and preparation method thereof

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Also Published As

Publication number Publication date
US7685696B2 (en) 2010-03-30
US7954385B2 (en) 2011-06-07
US6996891B1 (en) 2006-02-14
EP1192434A1 (en) 2002-04-03
US20100107780A1 (en) 2010-05-06
EP1192434B1 (en) 2012-08-29
US20050093401A1 (en) 2005-05-05
WO2001002823A1 (en) 2001-01-11
FI108986B (en) 2002-04-30

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