FI981802A - Ohutkalvo-elektroluminesenssi-laite ja menetelmä sen valmistamiseksi - Google Patents
Ohutkalvo-elektroluminesenssi-laite ja menetelmä sen valmistamiseksi Download PDFInfo
- Publication number
- FI981802A FI981802A FI981802A FI981802A FI981802A FI 981802 A FI981802 A FI 981802A FI 981802 A FI981802 A FI 981802A FI 981802 A FI981802 A FI 981802A FI 981802 A FI981802 A FI 981802A
- Authority
- FI
- Finland
- Prior art keywords
- making
- thin film
- film electroluminescence
- electroluminescence apparatus
- thin
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
- H05B33/145—Arrangements of the electroluminescent material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI981802A FI105643B (fi) | 1998-08-21 | 1998-08-21 | Ohutkalvo-elektroluminesenssilaite ja menetelmä sen valmistamiseksi |
DE1999139658 DE19939658A1 (de) | 1998-08-21 | 1999-08-20 | Elektrolumineszente Dünnfilmvorrichtung und Verfahren zu deren Herstellung |
JP11233749A JP2000068072A (ja) | 1998-08-21 | 1999-08-20 | 薄膜エレクトロルミネッセンスデバイスとその製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI981802 | 1998-08-21 | ||
FI981802A FI105643B (fi) | 1998-08-21 | 1998-08-21 | Ohutkalvo-elektroluminesenssilaite ja menetelmä sen valmistamiseksi |
Publications (3)
Publication Number | Publication Date |
---|---|
FI981802A0 FI981802A0 (fi) | 1998-08-21 |
FI981802A true FI981802A (fi) | 2000-02-22 |
FI105643B FI105643B (fi) | 2000-09-15 |
Family
ID=8552342
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI981802A FI105643B (fi) | 1998-08-21 | 1998-08-21 | Ohutkalvo-elektroluminesenssilaite ja menetelmä sen valmistamiseksi |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2000068072A (fi) |
DE (1) | DE19939658A1 (fi) |
FI (1) | FI105643B (fi) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6620723B1 (en) | 2000-06-27 | 2003-09-16 | Applied Materials, Inc. | Formation of boride barrier layers using chemisorption techniques |
US7732327B2 (en) | 2000-06-28 | 2010-06-08 | Applied Materials, Inc. | Vapor deposition of tungsten materials |
US7964505B2 (en) | 2005-01-19 | 2011-06-21 | Applied Materials, Inc. | Atomic layer deposition of tungsten materials |
US6551929B1 (en) | 2000-06-28 | 2003-04-22 | Applied Materials, Inc. | Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques |
US7405158B2 (en) | 2000-06-28 | 2008-07-29 | Applied Materials, Inc. | Methods for depositing tungsten layers employing atomic layer deposition techniques |
US6765178B2 (en) | 2000-12-29 | 2004-07-20 | Applied Materials, Inc. | Chamber for uniform substrate heating |
US6825447B2 (en) | 2000-12-29 | 2004-11-30 | Applied Materials, Inc. | Apparatus and method for uniform substrate heating and contaminate collection |
US6951804B2 (en) | 2001-02-02 | 2005-10-04 | Applied Materials, Inc. | Formation of a tantalum-nitride layer |
US6660126B2 (en) | 2001-03-02 | 2003-12-09 | Applied Materials, Inc. | Lid assembly for a processing system to facilitate sequential deposition techniques |
US6878206B2 (en) | 2001-07-16 | 2005-04-12 | Applied Materials, Inc. | Lid assembly for a processing system to facilitate sequential deposition techniques |
US6734020B2 (en) | 2001-03-07 | 2004-05-11 | Applied Materials, Inc. | Valve control system for atomic layer deposition chamber |
US7211144B2 (en) | 2001-07-13 | 2007-05-01 | Applied Materials, Inc. | Pulsed nucleation deposition of tungsten layers |
US6916398B2 (en) | 2001-10-26 | 2005-07-12 | Applied Materials, Inc. | Gas delivery apparatus and method for atomic layer deposition |
US7780785B2 (en) | 2001-10-26 | 2010-08-24 | Applied Materials, Inc. | Gas delivery apparatus for atomic layer deposition |
US6729824B2 (en) | 2001-12-14 | 2004-05-04 | Applied Materials, Inc. | Dual robot processing system |
US6620670B2 (en) | 2002-01-18 | 2003-09-16 | Applied Materials, Inc. | Process conditions and precursors for atomic layer deposition (ALD) of AL2O3 |
US6911391B2 (en) | 2002-01-26 | 2005-06-28 | Applied Materials, Inc. | Integration of titanium and titanium nitride layers |
US6998014B2 (en) | 2002-01-26 | 2006-02-14 | Applied Materials, Inc. | Apparatus and method for plasma assisted deposition |
US6827978B2 (en) | 2002-02-11 | 2004-12-07 | Applied Materials, Inc. | Deposition of tungsten films |
US6833161B2 (en) | 2002-02-26 | 2004-12-21 | Applied Materials, Inc. | Cyclical deposition of tungsten nitride for metal oxide gate electrode |
US6720027B2 (en) | 2002-04-08 | 2004-04-13 | Applied Materials, Inc. | Cyclical deposition of a variable content titanium silicon nitride layer |
US7279432B2 (en) | 2002-04-16 | 2007-10-09 | Applied Materials, Inc. | System and method for forming an integrated barrier layer |
CN100566480C (zh) * | 2002-12-20 | 2009-12-02 | 伊菲雷知识产权公司 | 用于厚膜介电电致发光显示器的阻挡层 |
-
1998
- 1998-08-21 FI FI981802A patent/FI105643B/fi not_active IP Right Cessation
-
1999
- 1999-08-20 DE DE1999139658 patent/DE19939658A1/de not_active Withdrawn
- 1999-08-20 JP JP11233749A patent/JP2000068072A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
FI981802A0 (fi) | 1998-08-21 |
JP2000068072A (ja) | 2000-03-03 |
FI105643B (fi) | 2000-09-15 |
DE19939658A1 (de) | 2000-03-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Transfer of assignment of patent |
Owner name: BENEQ OY |
|
MA | Patent expired |