FI981783A - Menetelmä ja lämmönsiirrin lämmönlähteen generoiman lämpöenergian muualle johtamiseksi työaineeseen olomuodon muutoksessa sitoutuvan lämpöenergian avulla - Google Patents
Menetelmä ja lämmönsiirrin lämmönlähteen generoiman lämpöenergian muualle johtamiseksi työaineeseen olomuodon muutoksessa sitoutuvan lämpöenergian avulla Download PDFInfo
- Publication number
- FI981783A FI981783A FI981783A FI981783A FI981783A FI 981783 A FI981783 A FI 981783A FI 981783 A FI981783 A FI 981783A FI 981783 A FI981783 A FI 981783A FI 981783 A FI981783 A FI 981783A
- Authority
- FI
- Finland
- Prior art keywords
- heat
- heat energy
- phase change
- working medium
- dissolved
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/025—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having non-capillary condensate return means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI981783A FI981783A (fi) | 1998-08-19 | 1998-08-19 | Menetelmä ja lämmönsiirrin lämmönlähteen generoiman lämpöenergian muualle johtamiseksi työaineeseen olomuodon muutoksessa sitoutuvan lämpöenergian avulla |
AU53748/99A AU5374899A (en) | 1998-08-19 | 1999-08-17 | Heat exchanger for conducting elsewhere heat energy generated by heat source |
PCT/FI1999/000683 WO2000011423A1 (fr) | 1998-08-19 | 1999-08-17 | Echangeur thermique pour transmission d'energie thermique generee par une source de chaleur |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI981783A FI981783A (fi) | 1998-08-19 | 1998-08-19 | Menetelmä ja lämmönsiirrin lämmönlähteen generoiman lämpöenergian muualle johtamiseksi työaineeseen olomuodon muutoksessa sitoutuvan lämpöenergian avulla |
Publications (2)
Publication Number | Publication Date |
---|---|
FI981783A0 FI981783A0 (fi) | 1998-08-19 |
FI981783A true FI981783A (fi) | 2000-02-20 |
Family
ID=8552331
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI981783A FI981783A (fi) | 1998-08-19 | 1998-08-19 | Menetelmä ja lämmönsiirrin lämmönlähteen generoiman lämpöenergian muualle johtamiseksi työaineeseen olomuodon muutoksessa sitoutuvan lämpöenergian avulla |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU5374899A (fr) |
FI (1) | FI981783A (fr) |
WO (1) | WO2000011423A1 (fr) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FI68462C (fi) * | 1983-04-12 | 1985-09-10 | Heinz Ekman | Radiator |
SU1372177A1 (ru) * | 1986-06-18 | 1988-02-07 | Предприятие П/Я В-8117 | Двухфазный термосифон |
JPH02130948A (ja) * | 1988-11-11 | 1990-05-18 | Mitsubishi Electric Corp | 半導体冷却装置 |
US5198889A (en) * | 1990-06-30 | 1993-03-30 | Kabushiki Kaisha Toshiba | Cooling apparatus |
NL9400082A (nl) * | 1994-01-18 | 1995-09-01 | Wall Martinus C Van Der | Warmtepijp koelelement. |
IL115109A0 (en) * | 1995-08-30 | 1995-12-08 | Refmed Cryo Medical Products L | Heat pipe |
-
1998
- 1998-08-19 FI FI981783A patent/FI981783A/fi unknown
-
1999
- 1999-08-17 WO PCT/FI1999/000683 patent/WO2000011423A1/fr active Application Filing
- 1999-08-17 AU AU53748/99A patent/AU5374899A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
AU5374899A (en) | 2000-03-14 |
FI981783A0 (fi) | 1998-08-19 |
WO2000011423A1 (fr) | 2000-03-02 |
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