FI885350A0 - MJUKLOEDBART TUNNSKIKT I EN-ELLER FLERSKIKTIG METALLISERING. - Google Patents
MJUKLOEDBART TUNNSKIKT I EN-ELLER FLERSKIKTIG METALLISERING.Info
- Publication number
- FI885350A0 FI885350A0 FI885350A FI885350A FI885350A0 FI 885350 A0 FI885350 A0 FI 885350A0 FI 885350 A FI885350 A FI 885350A FI 885350 A FI885350 A FI 885350A FI 885350 A0 FI885350 A0 FI 885350A0
- Authority
- FI
- Finland
- Prior art keywords
- tunnskikt
- mjukloedbart
- metallisering
- flerskiktig
- eller
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DD30916687A DD274967A3 (en) | 1987-11-18 | 1987-11-18 | Solderable thin film in a single or multi-layer metallization |
Publications (2)
Publication Number | Publication Date |
---|---|
FI885350A0 true FI885350A0 (en) | 1988-11-18 |
FI885350A FI885350A (en) | 1989-05-19 |
Family
ID=5594019
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI885350A FI885350A (en) | 1987-11-18 | 1988-11-18 | MJUKLOEDBART TUNNSKIKT I EN-ELLER FLERSKIKTIG METALLISERING. |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0316950A3 (en) |
DD (1) | DD274967A3 (en) |
DK (1) | DK643688A (en) |
FI (1) | FI885350A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5476726A (en) * | 1992-01-22 | 1995-12-19 | Hitachi, Ltd. | Circuit board with metal layer for solder bonding and electronic circuit device employing the same |
US6222271B1 (en) | 1997-07-15 | 2001-04-24 | Micron Technology, Inc. | Method of using hydrogen gas in sputter deposition of aluminum-containing films and aluminum-containing films derived therefrom |
US5969423A (en) | 1997-07-15 | 1999-10-19 | Micron Technology, Inc. | Aluminum-containing films derived from using hydrogen and oxygen gas in sputter deposition |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4463059A (en) * | 1982-06-30 | 1984-07-31 | International Business Machines Corporation | Layered metal film structures for LSI chip carriers adapted for solder bonding and wire bonding |
JPS60214544A (en) * | 1984-04-06 | 1985-10-26 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Method of bonding by contacting metal with insulating material |
-
1987
- 1987-11-18 DD DD30916687A patent/DD274967A3/en not_active IP Right Cessation
-
1988
- 1988-11-17 DK DK643688A patent/DK643688A/en not_active Application Discontinuation
- 1988-11-18 EP EP19880119241 patent/EP0316950A3/en not_active Withdrawn
- 1988-11-18 FI FI885350A patent/FI885350A/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0316950A2 (en) | 1989-05-24 |
DK643688A (en) | 1989-05-19 |
FI885350A (en) | 1989-05-19 |
DD274967A3 (en) | 1990-01-10 |
EP0316950A3 (en) | 1990-12-05 |
DK643688D0 (en) | 1988-11-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM | Patent lapsed |
Owner name: VEB ELEKTRONISCHE BAUELEMENTE " CARL VON |