FI8044U1 - Elektroniikkakomponentin jäähdytyselementti - Google Patents

Elektroniikkakomponentin jäähdytyselementti

Info

Publication number
FI8044U1
FI8044U1 FI20080124U FIU20080124U FI8044U1 FI 8044 U1 FI8044 U1 FI 8044U1 FI 20080124 U FI20080124 U FI 20080124U FI U20080124 U FIU20080124 U FI U20080124U FI 8044 U1 FI8044 U1 FI 8044U1
Authority
FI
Finland
Prior art keywords
cooling element
electronics component
electronics
component
cooling
Prior art date
Application number
FI20080124U
Other languages
English (en)
Finnish (fi)
Swedish (sv)
Inventor
Juhani Helosvuori
Markku Talja
Pertti Sevaekivi
Original Assignee
Abb Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abb Oy filed Critical Abb Oy
Priority to FI20080124U priority Critical patent/FI8044U1/fi
Publication of FIU20080124U0 publication Critical patent/FIU20080124U0/fi
Application granted granted Critical
Publication of FI8044U1 publication Critical patent/FI8044U1/fi
Priority to DE202009004630U priority patent/DE202009004630U1/de

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FI20080124U 2008-04-11 2008-04-11 Elektroniikkakomponentin jäähdytyselementti FI8044U1 (fi)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FI20080124U FI8044U1 (fi) 2008-04-11 2008-04-11 Elektroniikkakomponentin jäähdytyselementti
DE202009004630U DE202009004630U1 (de) 2008-04-11 2009-04-03 Kühlelement einer elektronischen Komponente

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20080124U FI8044U1 (fi) 2008-04-11 2008-04-11 Elektroniikkakomponentin jäähdytyselementti

Publications (2)

Publication Number Publication Date
FIU20080124U0 FIU20080124U0 (fi) 2008-04-11
FI8044U1 true FI8044U1 (fi) 2008-10-20

Family

ID=39386041

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20080124U FI8044U1 (fi) 2008-04-11 2008-04-11 Elektroniikkakomponentin jäähdytyselementti

Country Status (2)

Country Link
DE (1) DE202009004630U1 (de)
FI (1) FI8044U1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4053487B1 (de) * 2021-03-01 2024-08-28 ABB Schweiz AG Wärmeübertragungsvorrichtung

Also Published As

Publication number Publication date
FIU20080124U0 (fi) 2008-04-11
DE202009004630U1 (de) 2009-08-06

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