FI20155153A - Microelectromechanical structure and device - Google Patents
Microelectromechanical structure and device Download PDFInfo
- Publication number
- FI20155153A FI20155153A FI20155153A FI20155153A FI20155153A FI 20155153 A FI20155153 A FI 20155153A FI 20155153 A FI20155153 A FI 20155153A FI 20155153 A FI20155153 A FI 20155153A FI 20155153 A FI20155153 A FI 20155153A
- Authority
- FI
- Finland
- Prior art keywords
- microelectromechanical structure
- microelectromechanical
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
- B81B3/004—Angular deflection
- B81B3/0045—Improve properties related to angular swinging, e.g. control resonance frequency
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
- B81B3/0056—Adjusting the distance between two elements, at least one of them being movable, e.g. air-gap tuning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0086—Electrical characteristics, e.g. reducing driving voltage, improving resistance to peak voltage
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G5/00—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture
- H01G5/04—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture using variation of effective area of electrode
- H01G5/14—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture using variation of effective area of electrode due to longitudinal movement of electrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0221—Variable capacitors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0271—Resonators; ultrasonic resonators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/06—Devices comprising elements which are movable in relation to each other, e.g. slidable or rotatable
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
- G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
- G01P2015/0814—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for translational movement of the mass, e.g. shuttle type
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Micromachines (AREA)
- Pressure Sensors (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20155153A FI127229B (en) | 2015-03-09 | 2015-03-09 | Microelectromechanical structure and device |
TW105104731A TWI619668B (en) | 2015-03-09 | 2016-02-18 | A microelectromechanical structure and device |
PCT/IB2016/051265 WO2016142832A1 (en) | 2015-03-09 | 2016-03-07 | A microelectromechanical capacitive sensor structure and device |
CN201680014405.8A CN107406250B (en) | 2015-03-09 | 2016-03-07 | Micro electronmechanical capacitive sensor structure and device |
JP2017547502A JP6627883B2 (en) | 2015-03-09 | 2016-03-07 | Structure and device of microelectromechanical capacitance sensor |
EP16711347.1A EP3268305B1 (en) | 2015-03-09 | 2016-03-07 | A microelectromechanical capacitive sensor structure and device |
US15/064,879 US9969606B2 (en) | 2015-03-09 | 2016-03-09 | Microelectromechanical structure and device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20155153A FI127229B (en) | 2015-03-09 | 2015-03-09 | Microelectromechanical structure and device |
Publications (2)
Publication Number | Publication Date |
---|---|
FI20155153A true FI20155153A (en) | 2016-09-10 |
FI127229B FI127229B (en) | 2018-02-15 |
Family
ID=55588322
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20155153A FI127229B (en) | 2015-03-09 | 2015-03-09 | Microelectromechanical structure and device |
Country Status (7)
Country | Link |
---|---|
US (1) | US9969606B2 (en) |
EP (1) | EP3268305B1 (en) |
JP (1) | JP6627883B2 (en) |
CN (1) | CN107406250B (en) |
FI (1) | FI127229B (en) |
TW (1) | TWI619668B (en) |
WO (1) | WO2016142832A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112014596A (en) * | 2019-05-30 | 2020-12-01 | 合肥杰发科技有限公司 | Accelerometer and manufacturing method thereof |
CN112014595A (en) * | 2019-05-30 | 2020-12-01 | 合肥杰发科技有限公司 | Accelerometer and manufacturing method thereof |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017217009B3 (en) | 2017-09-26 | 2018-07-19 | Robert Bosch Gmbh | MEMS device and corresponding operating method |
JP7056099B2 (en) * | 2017-11-28 | 2022-04-19 | セイコーエプソン株式会社 | Physical quantity sensor, physical quantity sensor device, composite sensor device, inertial measurement unit, mobile positioning device, portable electronic device, electronic device and mobile body |
US10712359B2 (en) * | 2018-05-01 | 2020-07-14 | Nxp Usa, Inc. | Flexure with enhanced torsional stiffness and MEMS device incorporating same |
US10794701B2 (en) | 2018-05-01 | 2020-10-06 | Nxp Usa, Inc. | Inertial sensor with single proof mass and multiple sense axis capability |
CN109490576A (en) * | 2018-12-19 | 2019-03-19 | 成都力创云科技有限公司 | Based on a kind of fully differential capacitor MEMS acceleration by SOI |
JP2023520750A (en) * | 2020-03-03 | 2023-05-19 | インフィコン インコーポレイティド | Systems and methods for monitoring semiconductor processes |
JP7389767B2 (en) | 2021-02-26 | 2023-11-30 | 株式会社東芝 | Sensors and electronic devices |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3960502B2 (en) * | 1999-03-16 | 2007-08-15 | 学校法人立命館 | Capacitive sensor |
JP4063057B2 (en) * | 2002-11-20 | 2008-03-19 | 株式会社デンソー | Capacitive acceleration sensor |
WO2004077073A1 (en) | 2003-02-24 | 2004-09-10 | University Of Florida | Integrated monolithic tri-axial micromachined accelerometer |
US7469588B2 (en) | 2006-05-16 | 2008-12-30 | Honeywell International Inc. | MEMS vertical comb drive with improved vibration performance |
WO2008120256A1 (en) * | 2007-04-03 | 2008-10-09 | Stmicroelectronics S.R.L. | Capacitive position sensing in an electrostatic micromotor |
EP1998345A1 (en) | 2007-05-31 | 2008-12-03 | Infineon Technologies SensoNor AS | Method of manufacturing capacitive elements for a capacitive device |
US7690254B2 (en) | 2007-07-26 | 2010-04-06 | Honeywell International Inc. | Sensor with position-independent drive electrodes in multi-layer silicon on insulator substrate |
EP2257821B1 (en) * | 2008-03-26 | 2012-10-24 | Hewlett-Packard Development Company, L.P. | Capacitive sensor having cyclic and absolute electrode sets |
JP2010286471A (en) * | 2009-05-15 | 2010-12-24 | Seiko Epson Corp | Mems sensor and electronic apparatus |
CN101871952B (en) * | 2010-06-11 | 2012-07-11 | 瑞声声学科技(深圳)有限公司 | MEMS (Micro Electro Mechanical System) acceleration sensor |
AT11920U3 (en) | 2010-08-12 | 2012-03-15 | Oesterreichische Akademie Der Wissenschaften | METHOD FOR PRODUCING A MEMS DEVICE WITH HIGH ASPECT RATIO, AND CONVERTER AND CONDENSER |
US20120048019A1 (en) * | 2010-08-26 | 2012-03-01 | Hanqin Zhou | Highly sensitive capacitive sensor and methods of manufacturing the same |
EP3059595B1 (en) * | 2012-01-12 | 2018-07-04 | Murata Electronics Oy | Acceleration sensor structure and use thereof |
US20130229747A1 (en) * | 2012-03-01 | 2013-09-05 | Agilent Technologies, Inc. | Balanced voltage variable capacitor device |
EP2861524A4 (en) | 2012-06-13 | 2016-07-06 | Purdue Research Foundation | Microelectromechanical system and methods of use |
JP5783201B2 (en) * | 2013-03-27 | 2015-09-24 | 株式会社デンソー | Capacitive physical quantity sensor |
FI126199B (en) * | 2013-06-28 | 2016-08-15 | Murata Manufacturing Co | CAPACITIVE MICROMECHANICAL SENSOR STRUCTURE AND MICROMECHANICAL ACCELERATOR SENSOR |
CN203631322U (en) * | 2013-12-25 | 2014-06-04 | 歌尔声学股份有限公司 | Capacitor and capacitance type sensor comprising same |
-
2015
- 2015-03-09 FI FI20155153A patent/FI127229B/en active IP Right Grant
-
2016
- 2016-02-18 TW TW105104731A patent/TWI619668B/en active
- 2016-03-07 CN CN201680014405.8A patent/CN107406250B/en active Active
- 2016-03-07 WO PCT/IB2016/051265 patent/WO2016142832A1/en active Application Filing
- 2016-03-07 JP JP2017547502A patent/JP6627883B2/en active Active
- 2016-03-07 EP EP16711347.1A patent/EP3268305B1/en active Active
- 2016-03-09 US US15/064,879 patent/US9969606B2/en active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112014596A (en) * | 2019-05-30 | 2020-12-01 | 合肥杰发科技有限公司 | Accelerometer and manufacturing method thereof |
CN112014595A (en) * | 2019-05-30 | 2020-12-01 | 合肥杰发科技有限公司 | Accelerometer and manufacturing method thereof |
CN112014595B (en) * | 2019-05-30 | 2022-10-28 | 武汉杰开科技有限公司 | Accelerometer and manufacturing method thereof |
CN112014596B (en) * | 2019-05-30 | 2022-10-28 | 武汉杰开科技有限公司 | Accelerometer and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
FI127229B (en) | 2018-02-15 |
EP3268305A1 (en) | 2018-01-17 |
JP6627883B2 (en) | 2020-01-08 |
TW201704141A (en) | 2017-02-01 |
CN107406250A (en) | 2017-11-28 |
WO2016142832A1 (en) | 2016-09-15 |
US9969606B2 (en) | 2018-05-15 |
EP3268305B1 (en) | 2021-05-19 |
CN107406250B (en) | 2019-10-01 |
TWI619668B (en) | 2018-04-01 |
US20160264401A1 (en) | 2016-09-15 |
JP2018514397A (en) | 2018-06-07 |
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