FI20106360A - Menetelmä ultraäänianturin valmistamiseksi - Google Patents

Menetelmä ultraäänianturin valmistamiseksi Download PDF

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Publication number
FI20106360A
FI20106360A FI20106360A FI20106360A FI20106360A FI 20106360 A FI20106360 A FI 20106360A FI 20106360 A FI20106360 A FI 20106360A FI 20106360 A FI20106360 A FI 20106360A FI 20106360 A FI20106360 A FI 20106360A
Authority
FI
Finland
Prior art keywords
sensor
ultrasound
producing
ultrasonic sensor
ultrasound transmitter
Prior art date
Application number
FI20106360A
Other languages
English (en)
Swedish (sv)
Other versions
FI20106360A0 (fi
Inventor
Markku Ylilammi
Aarne Oja
Jaakko Saarilahti
Original Assignee
Teknologian Tutkimuskeskus Vtt Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teknologian Tutkimuskeskus Vtt Oy filed Critical Teknologian Tutkimuskeskus Vtt Oy
Priority to FI20106360A priority Critical patent/FI20106360A/fi
Publication of FI20106360A0 publication Critical patent/FI20106360A0/fi
Priority to PCT/FI2011/051082 priority patent/WO2012085334A1/en
Publication of FI20106360A publication Critical patent/FI20106360A/fi

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/30Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H10N30/302Sensors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22Details, e.g. general constructional or apparatus details
    • G01N29/24Probes
    • G01N29/2437Piezoelectric probes
    • G01N29/245Ceramic probes, e.g. lead zirconate titanate [PZT] probes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0644Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B81B3/0021Transducers for transforming electrical into mechanical energy or vice versa
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01HMEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H15/00Measuring mechanical or acoustic impedance
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01HMEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H3/00Measuring characteristics of vibrations by using a detector in a fluid
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01HMEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H9/00Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means
    • G01H9/008Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means by using ultrasonic waves
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L11/00Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by means not provided for in group G01L7/00 or G01L9/00
    • G01L11/04Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by means not provided for in group G01L7/00 or G01L9/00 by acoustic means
    • G01L11/06Ultrasonic means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/02Analysing fluids
    • G01N29/036Analysing fluids by measuring frequency or resonance of acoustic waves
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00Arrangements or instruments for measuring magnetic variables
    • G01R33/02Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/028Electrodynamic magnetometers
    • G01R33/0286Electrodynamic magnetometers comprising microelectromechanical systems [MEMS]
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00Piezoelectric transducers; Electrostrictive transducers
    • H04R17/02Microphones
    • H04R17/025Microphones using a piezoelectric polymer
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/005Electrostatic transducers using semiconductor materials
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Health & Medical Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Signal Processing (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Measuring Fluid Pressure (AREA)
FI20106360A 2010-12-21 2010-12-21 Menetelmä ultraäänianturin valmistamiseksi FI20106360A (fi)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FI20106360A FI20106360A (fi) 2010-12-21 2010-12-21 Menetelmä ultraäänianturin valmistamiseksi
PCT/FI2011/051082 WO2012085334A1 (en) 2010-12-21 2011-12-07 Method for manufacturing an ultrasonic sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20106360A FI20106360A (fi) 2010-12-21 2010-12-21 Menetelmä ultraäänianturin valmistamiseksi

Publications (2)

Publication Number Publication Date
FI20106360A0 FI20106360A0 (fi) 2010-12-21
FI20106360A true FI20106360A (fi) 2012-06-22

Family

ID=43415050

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20106360A FI20106360A (fi) 2010-12-21 2010-12-21 Menetelmä ultraäänianturin valmistamiseksi

Country Status (2)

Country Link
FI (1) FI20106360A (fi)
WO (1) WO2012085334A1 (fi)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI470190B (zh) * 2012-11-22 2015-01-21 Tung Thih Electronic Co Ltd Assembly equipment, automatic assembly system and automatic assembly of ultrasonic sensors
FI20165896A (fi) * 2016-11-24 2018-05-25 Teknologian Tutkimuskeskus Vtt Oy Anturi
CN109954526B (zh) * 2019-04-22 2021-12-03 京东方科技集团股份有限公司 一种微流控器件及其制作方法
CN110681560B (zh) * 2019-09-10 2020-11-03 武汉大学 具有亥姆霍兹谐振腔的mems超声定位传感器
CN112097968A (zh) * 2020-08-24 2020-12-18 电子科技大学 一种光纤压力和加速度传感器及其安装标定方法
CN112683428B (zh) * 2020-11-26 2022-07-01 南京高华科技股份有限公司 一种mems电感式压力传感器及其制备方法
CN112786775B (zh) * 2021-01-04 2022-11-11 国网内蒙古东部电力有限公司电力科学研究院 无源自供能用压电纳米阵列传感器及其制备方法
CN115073169A (zh) * 2022-06-24 2022-09-20 西安理工大学 一种高能量低损耗的(1-x)NBT-SBT-xBKT无铅陶瓷材料及其制备方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6216538B1 (en) * 1992-12-02 2001-04-17 Hitachi, Ltd. Particle handling apparatus for handling particles in fluid by acoustic radiation pressure
DE102005037086A1 (de) * 2005-08-03 2007-02-08 Hauni Maschinenbau Ag Überwachung eines Leimbilds auf einem Umhüllungsstreifen
FI20075879A0 (fi) * 2007-12-05 2007-12-05 Valtion Teknillinen Laite paineen, äänenpaineen vaihtelun, magneettikentän, kiihtyvyyden, tärinän ja kaasun koostumuksen mittaamiseksi

Also Published As

Publication number Publication date
FI20106360A0 (fi) 2010-12-21
WO2012085334A1 (en) 2012-06-28

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Owner name: TEKNOLOGIAN TUTKIMUSKESKUS VTT

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