FI20080541A0 - Järjestely ja menetelmä valaistuslaitteiston yhteydessä - Google Patents
Järjestely ja menetelmä valaistuslaitteiston yhteydessäInfo
- Publication number
- FI20080541A0 FI20080541A0 FI20080541A FI20080541A FI20080541A0 FI 20080541 A0 FI20080541 A0 FI 20080541A0 FI 20080541 A FI20080541 A FI 20080541A FI 20080541 A FI20080541 A FI 20080541A FI 20080541 A0 FI20080541 A0 FI 20080541A0
- Authority
- FI
- Finland
- Prior art keywords
- arrangement
- connection
- lighting equipment
- lighting
- equipment
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66B—ELEVATORS; ESCALATORS OR MOVING WALKWAYS
- B66B11/00—Main component parts of lifts in, or associated with, buildings or other structures
- B66B11/02—Cages, i.e. cars
- B66B11/0226—Constructional features, e.g. walls assembly, decorative panels, comfort equipment, thermal or sound insulation
- B66B11/0233—Lighting systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Civil Engineering (AREA)
- Mechanical Engineering (AREA)
- Structural Engineering (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20080541A FI122908B (fi) | 2008-09-26 | 2008-09-26 | Järjestely ja menetelmä LED -valonlähteen jäähdyttämiseksi, kuljetusjärjestelmän valaistusjärjestely sekä LED -valaisin |
PCT/FI2009/000084 WO2010034873A1 (en) | 2008-09-26 | 2009-09-15 | Arrangement and method in connection with a lighting apparatus |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20080541 | 2008-09-26 | ||
FI20080541A FI122908B (fi) | 2008-09-26 | 2008-09-26 | Järjestely ja menetelmä LED -valonlähteen jäähdyttämiseksi, kuljetusjärjestelmän valaistusjärjestely sekä LED -valaisin |
Publications (3)
Publication Number | Publication Date |
---|---|
FI20080541A0 true FI20080541A0 (fi) | 2008-09-26 |
FI20080541A FI20080541A (fi) | 2010-03-27 |
FI122908B FI122908B (fi) | 2012-08-31 |
Family
ID=39852202
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20080541A FI122908B (fi) | 2008-09-26 | 2008-09-26 | Järjestely ja menetelmä LED -valonlähteen jäähdyttämiseksi, kuljetusjärjestelmän valaistusjärjestely sekä LED -valaisin |
Country Status (2)
Country | Link |
---|---|
FI (1) | FI122908B (fi) |
WO (1) | WO2010034873A1 (fi) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015159126A1 (en) * | 2014-04-16 | 2015-10-22 | Stefan Kreidler | Flexible led |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6045240A (en) * | 1996-06-27 | 2000-04-04 | Relume Corporation | LED lamp assembly with means to conduct heat away from the LEDS |
JP2004140150A (ja) * | 2002-08-20 | 2004-05-13 | Tanaka Kikinzoku Kogyo Kk | 発光ダイオードデバイス用の基板 |
US20040188593A1 (en) * | 2003-03-20 | 2004-09-30 | Patrick Mullins | Photosensor control unit |
US8622578B2 (en) * | 2005-03-30 | 2014-01-07 | Koninklijke Philips N.V. | Flexible LED array |
US20070247852A1 (en) * | 2006-04-21 | 2007-10-25 | Xiaoping Wang | Multi chip LED lamp |
JP2007314271A (ja) * | 2006-05-24 | 2007-12-06 | Royal Lighting Co Ltd | Ledランプ使用の非常灯 |
-
2008
- 2008-09-26 FI FI20080541A patent/FI122908B/fi not_active IP Right Cessation
-
2009
- 2009-09-15 WO PCT/FI2009/000084 patent/WO2010034873A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
FI122908B (fi) | 2012-08-31 |
FI20080541A (fi) | 2010-03-27 |
WO2010034873A1 (en) | 2010-04-01 |
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