FI20050747A - Laserlaitteisto - Google Patents

Laserlaitteisto Download PDF

Info

Publication number
FI20050747A
FI20050747A FI20050747A FI20050747A FI20050747A FI 20050747 A FI20050747 A FI 20050747A FI 20050747 A FI20050747 A FI 20050747A FI 20050747 A FI20050747 A FI 20050747A FI 20050747 A FI20050747 A FI 20050747A
Authority
FI
Finland
Prior art keywords
laser devices
laser
devices
Prior art date
Application number
FI20050747A
Other languages
English (en)
Swedish (sv)
Other versions
FI20050747A0 (fi
FI119209B (fi
Inventor
Jari Ruuttu
Original Assignee
Picodeon Ltd Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Picodeon Ltd Oy filed Critical Picodeon Ltd Oy
Publication of FI20050747A0 publication Critical patent/FI20050747A0/fi
Priority to FI20050747A priority Critical patent/FI119209B/fi
Priority to FI20050758A priority patent/FI118937B/fi
Priority to FI20060182A priority patent/FI20060182L/fi
Priority to PCT/FI2006/000250 priority patent/WO2007006849A1/en
Priority to US11/988,663 priority patent/US20100181706A1/en
Priority to PCT/FI2006/000251 priority patent/WO2007006850A2/en
Priority to EP06778480A priority patent/EP1938143A4/en
Priority to EP06778481A priority patent/EP1910013A2/en
Priority to US11/988,676 priority patent/US20080317083A1/en
Publication of FI20050747A publication Critical patent/FI20050747A/fi
Application granted granted Critical
Publication of FI119209B publication Critical patent/FI119209B/fi

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/09—Processes or apparatus for excitation, e.g. pumping
    • H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
    • H01S3/094—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
    • H01S3/0941—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light of a laser diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Lasers (AREA)
FI20050747A 2005-07-13 2005-07-13 Laserlaitteisto FI119209B (fi)

Priority Applications (9)

Application Number Priority Date Filing Date Title
FI20050747A FI119209B (fi) 2005-07-13 2005-07-13 Laserlaitteisto
FI20050758A FI118937B (fi) 2005-07-13 2005-07-15 Diodipumppu
FI20060182A FI20060182L (fi) 2005-07-13 2006-02-23 Ablaatiotekniikkaan liittyvä pinnankäsittelytekniikka ja pinnankäsittelylaitteisto
US11/988,663 US20100181706A1 (en) 2005-07-13 2006-07-13 Radiation Arrangement
PCT/FI2006/000250 WO2007006849A1 (en) 2005-07-13 2006-07-13 Diode pump
PCT/FI2006/000251 WO2007006850A2 (en) 2005-07-13 2006-07-13 Radiation arrangement
EP06778480A EP1938143A4 (en) 2005-07-13 2006-07-13 DIODE PUMP
EP06778481A EP1910013A2 (en) 2005-07-13 2006-07-13 Radiation arrangement
US11/988,676 US20080317083A1 (en) 2005-07-13 2006-07-13 Diode Pump

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20050747 2005-07-13
FI20050747A FI119209B (fi) 2005-07-13 2005-07-13 Laserlaitteisto

Publications (3)

Publication Number Publication Date
FI20050747A0 FI20050747A0 (fi) 2005-07-13
FI20050747A true FI20050747A (fi) 2007-01-14
FI119209B FI119209B (fi) 2008-08-29

Family

ID=34803207

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20050747A FI119209B (fi) 2005-07-13 2005-07-13 Laserlaitteisto

Country Status (1)

Country Link
FI (1) FI119209B (fi)

Also Published As

Publication number Publication date
FI20050747A0 (fi) 2005-07-13
FI119209B (fi) 2008-08-29

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Legal Events

Date Code Title Description
PC Transfer of assignment of patent

Owner name: EURO-AMERICAN DIAMOND LTD OY

Free format text: EURO-AMERICAN DIAMOND LTD OY

PC Transfer of assignment of patent

Owner name: PICODEON LTD OY

Free format text: PICODEON LTD OY

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