FI20050592A0 - Förfarande för framställning av mikromekaniska komponenter - Google Patents

Förfarande för framställning av mikromekaniska komponenter

Info

Publication number
FI20050592A0
FI20050592A0 FI20050592A FI20050592A FI20050592A0 FI 20050592 A0 FI20050592 A0 FI 20050592A0 FI 20050592 A FI20050592 A FI 20050592A FI 20050592 A FI20050592 A FI 20050592A FI 20050592 A0 FI20050592 A0 FI 20050592A0
Authority
FI
Finland
Prior art keywords
preparation
micromechanical components
micromechanical
components
Prior art date
Application number
FI20050592A
Other languages
English (en)
Finnish (fi)
Other versions
FI20050592A (sv
FI121539B (sv
Inventor
Jyrki Kiihamaeki
Hannu Kattelus
Original Assignee
Valtion Teknillinen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valtion Teknillinen filed Critical Valtion Teknillinen
Priority to FI20050592A priority Critical patent/FI121539B/sv
Publication of FI20050592A0 publication Critical patent/FI20050592A0/sv
Priority to PCT/FI2006/000174 priority patent/WO2006128958A2/en
Priority to CN2006800194918A priority patent/CN101351400B/zh
Priority to GB0724114A priority patent/GB2441465B/en
Priority to US11/920,687 priority patent/US7882741B2/en
Publication of FI20050592A publication Critical patent/FI20050592A/sv
Priority to HK08109828.1A priority patent/HK1118528A1/xx
Priority to US12/884,823 priority patent/US8236694B2/en
Application granted granted Critical
Publication of FI121539B publication Critical patent/FI121539B/sv

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00555—Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
    • B81C1/00611—Processes for the planarisation of structures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/0072—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks of microelectro-mechanical resonators or networks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0118—Processes for the planarization of structures
    • B81C2201/0125—Blanket removal, e.g. polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
FI20050592A 2005-06-03 2005-06-03 Förfarande för framställning av mikromekaniska komponenter och en kiselmikromekanisk struktur framställd med dylikt förfarande samt användning av denna FI121539B (sv)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FI20050592A FI121539B (sv) 2005-06-03 2005-06-03 Förfarande för framställning av mikromekaniska komponenter och en kiselmikromekanisk struktur framställd med dylikt förfarande samt användning av denna
PCT/FI2006/000174 WO2006128958A2 (en) 2005-06-03 2006-06-02 Method for manufacturing micromechanical components
CN2006800194918A CN101351400B (zh) 2005-06-03 2006-06-02 制造微机械部件的方法
GB0724114A GB2441465B (en) 2005-06-03 2006-06-02 Method for manufacturing micromechanical components
US11/920,687 US7882741B2 (en) 2005-06-03 2006-06-02 Method for manufacturing micromechanical components
HK08109828.1A HK1118528A1 (en) 2005-06-03 2008-09-04 Method for manufacturing micromechanical components
US12/884,823 US8236694B2 (en) 2005-06-03 2010-09-17 Method for manufacturing micromechanical components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20050592A FI121539B (sv) 2005-06-03 2005-06-03 Förfarande för framställning av mikromekaniska komponenter och en kiselmikromekanisk struktur framställd med dylikt förfarande samt användning av denna
FI20050592 2005-06-03

Publications (3)

Publication Number Publication Date
FI20050592A0 true FI20050592A0 (sv) 2005-06-03
FI20050592A FI20050592A (sv) 2006-12-04
FI121539B FI121539B (sv) 2010-12-31

Family

ID=34778315

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20050592A FI121539B (sv) 2005-06-03 2005-06-03 Förfarande för framställning av mikromekaniska komponenter och en kiselmikromekanisk struktur framställd med dylikt förfarande samt användning av denna

Country Status (6)

Country Link
US (2) US7882741B2 (sv)
CN (1) CN101351400B (sv)
FI (1) FI121539B (sv)
GB (1) GB2441465B (sv)
HK (1) HK1118528A1 (sv)
WO (1) WO2006128958A2 (sv)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4737140B2 (ja) * 2006-10-20 2011-07-27 セイコーエプソン株式会社 Ｍｅｍｓデバイスおよびその製造方法
US8828772B2 (en) * 2012-03-05 2014-09-09 Taiwan Semiconductor Manufacturing Co., Ltd. High aspect ratio MEMS devices and methods for forming the same

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5563343A (en) * 1993-05-26 1996-10-08 Cornell Research Foundation, Inc. Microelectromechanical lateral accelerometer
FR2732467B1 (fr) * 1995-02-10 1999-09-17 Bosch Gmbh Robert Capteur d'acceleration et procede de fabrication d'un tel capteur
DE19537814B4 (de) * 1995-10-11 2009-11-19 Robert Bosch Gmbh Sensor und Verfahren zur Herstellung eines Sensors
JP3430771B2 (ja) * 1996-02-05 2003-07-28 株式会社デンソー 半導体力学量センサの製造方法
EP0822415B1 (en) 1996-07-31 2003-03-26 STMicroelectronics S.r.l. Semiconductor integrated capacitive acceleration sensor and relative fabrication method
US5804084A (en) * 1996-10-11 1998-09-08 Sandia Corporation Use of chemical mechanical polishing in micromachining
US5939633A (en) * 1997-06-18 1999-08-17 Analog Devices, Inc. Apparatus and method for multi-axis capacitive sensing
US6393913B1 (en) * 2000-02-08 2002-05-28 Sandia Corporation Microelectromechanical dual-mass resonator structure
JP2002131331A (ja) * 2000-10-24 2002-05-09 Denso Corp 半導体力学量センサ
EP1472507B1 (en) * 2002-02-06 2011-05-11 Analog Devices, Inc. Micromachined gyroscope
US6770506B2 (en) * 2002-12-23 2004-08-03 Motorola, Inc. Release etch method for micromachined sensors
US6845670B1 (en) * 2003-07-08 2005-01-25 Freescale Semiconductor, Inc. Single proof mass, 3 axis MEMS transducer

Also Published As

Publication number Publication date
FI20050592A (sv) 2006-12-04
WO2006128958A2 (en) 2006-12-07
CN101351400A (zh) 2009-01-21
GB0724114D0 (en) 2008-01-30
US20090206423A1 (en) 2009-08-20
GB2441465A (en) 2008-03-05
FI121539B (sv) 2010-12-31
GB2441465B (en) 2011-03-09
CN101351400B (zh) 2013-04-24
US8236694B2 (en) 2012-08-07
WO2006128958A3 (en) 2007-04-05
US20110070675A1 (en) 2011-03-24
HK1118528A1 (en) 2009-02-13
US7882741B2 (en) 2011-02-08

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