FI20045084A - Menetelmä materiaalin työstämiseksi suuritehotiheyksisellä sähkömagneettisella säteilyllä - Google Patents

Menetelmä materiaalin työstämiseksi suuritehotiheyksisellä sähkömagneettisella säteilyllä Download PDF

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Publication number
FI20045084A
FI20045084A FI20045084A FI20045084A FI20045084A FI 20045084 A FI20045084 A FI 20045084A FI 20045084 A FI20045084 A FI 20045084A FI 20045084 A FI20045084 A FI 20045084A FI 20045084 A FI20045084 A FI 20045084A
Authority
FI
Finland
Prior art keywords
electromagnetic radiation
high power
power frequency
frequency electromagnetic
processing materials
Prior art date
Application number
FI20045084A
Other languages
English (en)
Swedish (sv)
Other versions
FI20045084A0 (fi
FI120082B (fi
Inventor
Antti Salminen
Jari Hovikorpi
Original Assignee
Antti Salminen
Jari Hovikorpi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Antti Salminen, Jari Hovikorpi filed Critical Antti Salminen
Priority to FI20045084A priority Critical patent/FI120082B/fi
Publication of FI20045084A0 publication Critical patent/FI20045084A0/fi
Priority to EP05717340A priority patent/EP1732728A1/en
Priority to PCT/FI2005/050087 priority patent/WO2005087429A1/en
Priority to US10/592,596 priority patent/US20080047933A1/en
Priority to CNA2005800083234A priority patent/CN1946508A/zh
Publication of FI20045084A publication Critical patent/FI20045084A/fi
Application granted granted Critical
Publication of FI120082B publication Critical patent/FI120082B/fi

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
FI20045084A 2004-03-18 2004-03-18 Menetelmä materiaalin työstämiseksi suuritehotiheyksisellä sähkömagneettisella säteilyllä FI120082B (fi)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FI20045084A FI120082B (fi) 2004-03-18 2004-03-18 Menetelmä materiaalin työstämiseksi suuritehotiheyksisellä sähkömagneettisella säteilyllä
EP05717340A EP1732728A1 (en) 2004-03-18 2005-03-16 Method for machining a material with high-power density electromagnetic radiation
PCT/FI2005/050087 WO2005087429A1 (en) 2004-03-18 2005-03-16 Method for machining a material with high-power density electromagnetic radiation
US10/592,596 US20080047933A1 (en) 2004-03-18 2005-03-16 Method For Machining A Material With High-Power Density Electromagnetic Radiation
CNA2005800083234A CN1946508A (zh) 2004-03-18 2005-03-16 用大功率密度电磁辐射来加工材料的方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20045084A FI120082B (fi) 2004-03-18 2004-03-18 Menetelmä materiaalin työstämiseksi suuritehotiheyksisellä sähkömagneettisella säteilyllä
FI20045084 2004-03-18

Publications (3)

Publication Number Publication Date
FI20045084A0 FI20045084A0 (fi) 2004-03-18
FI20045084A true FI20045084A (fi) 2005-09-19
FI120082B FI120082B (fi) 2009-06-30

Family

ID=32039512

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20045084A FI120082B (fi) 2004-03-18 2004-03-18 Menetelmä materiaalin työstämiseksi suuritehotiheyksisellä sähkömagneettisella säteilyllä

Country Status (5)

Country Link
US (1) US20080047933A1 (fi)
EP (1) EP1732728A1 (fi)
CN (1) CN1946508A (fi)
FI (1) FI120082B (fi)
WO (1) WO2005087429A1 (fi)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9346130B2 (en) * 2008-12-17 2016-05-24 Electro Scientific Industries, Inc. Method for laser processing glass with a chamfered edge
US20100252959A1 (en) * 2009-03-27 2010-10-07 Electro Scientific Industries, Inc. Method for improved brittle materials processing
US8706288B2 (en) * 2009-05-21 2014-04-22 Electro Scientific Industries, Inc. Apparatus and method for non-contact sensing of transparent articles
US10357850B2 (en) 2012-09-24 2019-07-23 Electro Scientific Industries, Inc. Method and apparatus for machining a workpiece
US9828277B2 (en) 2012-02-28 2017-11-28 Electro Scientific Industries, Inc. Methods for separation of strengthened glass
US9828278B2 (en) 2012-02-28 2017-11-28 Electro Scientific Industries, Inc. Method and apparatus for separation of strengthened glass and articles produced thereby
JP2015516352A (ja) 2012-02-29 2015-06-11 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 強化ガラスを加工するための方法及び装置並びにこれにより生成された製品
CN102583991A (zh) * 2012-03-12 2012-07-18 深圳光韵达光电科技股份有限公司 一种激光切割玻璃的方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6259058B1 (en) * 1998-12-01 2001-07-10 Accudyne Display And Semiconductor Systems, Inc. Apparatus for separating non-metallic substrates
US6417485B1 (en) * 2000-05-30 2002-07-09 Igor Troitski Method and laser system controlling breakdown process development and space structure of laser radiation for production of high quality laser-induced damage images
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
JP2005268752A (ja) * 2004-02-19 2005-09-29 Canon Inc レーザ割断方法、被割断部材および半導体素子チップ

Also Published As

Publication number Publication date
US20080047933A1 (en) 2008-02-28
EP1732728A1 (en) 2006-12-20
WO2005087429A1 (en) 2005-09-22
FI20045084A0 (fi) 2004-03-18
FI120082B (fi) 2009-06-30
CN1946508A (zh) 2007-04-11

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