FI20031819A0 - Menetelmä ohuiden kalvojen valmistamiseksi kantajanauhalle ja menetelmällä valmistettu tuote - Google Patents

Menetelmä ohuiden kalvojen valmistamiseksi kantajanauhalle ja menetelmällä valmistettu tuote

Info

Publication number
FI20031819A0
FI20031819A0 FI20031819A FI20031819A FI20031819A0 FI 20031819 A0 FI20031819 A0 FI 20031819A0 FI 20031819 A FI20031819 A FI 20031819A FI 20031819 A FI20031819 A FI 20031819A FI 20031819 A0 FI20031819 A0 FI 20031819A0
Authority
FI
Finland
Prior art keywords
thin films
carrier tape
product made
producing thin
producing
Prior art date
Application number
FI20031819A
Other languages
English (en)
Swedish (sv)
Other versions
FI115775B (fi
Inventor
Yrjoe Leppaenen
Original Assignee
Outokumpu Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Outokumpu Oy filed Critical Outokumpu Oy
Priority to FI20031819A priority Critical patent/FI115775B/fi
Publication of FI20031819A0 publication Critical patent/FI20031819A0/fi
Priority to PCT/FI2004/000747 priority patent/WO2005056881A1/en
Application granted granted Critical
Publication of FI115775B publication Critical patent/FI115775B/fi

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
FI20031819A 2003-12-12 2003-12-12 Menetelmä ohuiden kalvojen valmistamiseksi kantajanauhalle FI115775B (fi)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FI20031819A FI115775B (fi) 2003-12-12 2003-12-12 Menetelmä ohuiden kalvojen valmistamiseksi kantajanauhalle
PCT/FI2004/000747 WO2005056881A1 (en) 2003-12-12 2004-12-09 Method of manufacturing thin foils on a carrier web and the product manufactured with this method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20031819 2003-12-12
FI20031819A FI115775B (fi) 2003-12-12 2003-12-12 Menetelmä ohuiden kalvojen valmistamiseksi kantajanauhalle

Publications (2)

Publication Number Publication Date
FI20031819A0 true FI20031819A0 (fi) 2003-12-12
FI115775B FI115775B (fi) 2005-07-15

Family

ID=29763514

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20031819A FI115775B (fi) 2003-12-12 2003-12-12 Menetelmä ohuiden kalvojen valmistamiseksi kantajanauhalle

Country Status (2)

Country Link
FI (1) FI115775B (fi)
WO (1) WO2005056881A1 (fi)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040200061A1 (en) 2003-04-11 2004-10-14 Coleman James P. Conductive pattern and method of making
US7930815B2 (en) 2003-04-11 2011-04-26 Avery Dennison Corporation Conductive pattern and method of making
KR102517417B1 (ko) * 2021-07-09 2023-04-03 주식회사 다이브 반도체용 동박의 제조방법 및 이를 이용한 반도체용 동박

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL170027C (nl) * 1971-05-25 1982-09-16 Galentan Ag Verbetering van een om een vaste as draaibare elektrolyt-verdeelinrichting.
US4053370A (en) * 1975-09-18 1977-10-11 Koito Manufacturing Company Limited Process for the fabrication of printed circuits
GB1543301A (en) * 1976-12-27 1979-04-04 Mitsui Mining & Smelting Co Producing copper-clad laminates by electrodeposition
US5242562A (en) * 1992-05-27 1993-09-07 Gould Inc. Method and apparatus for forming printed circuits
US5685970A (en) * 1992-07-01 1997-11-11 Gould Electronics Inc. Method and apparatus for sequentially metalized polymeric films and products made thereby
JP4439081B2 (ja) * 2000-05-31 2010-03-24 日本電解株式会社 電解銅箔の製造方法とそれに用いる装置

Also Published As

Publication number Publication date
WO2005056881A1 (en) 2005-06-23
FI115775B (fi) 2005-07-15

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