ES8708111A1 - Preformed circuit panel assembly - Google Patents

Preformed circuit panel assembly

Info

Publication number
ES8708111A1
ES8708111A1 ES554491A ES554491A ES8708111A1 ES 8708111 A1 ES8708111 A1 ES 8708111A1 ES 554491 A ES554491 A ES 554491A ES 554491 A ES554491 A ES 554491A ES 8708111 A1 ES8708111 A1 ES 8708111A1
Authority
ES
Spain
Prior art keywords
substrate
layer
circuitry
circuit panel
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES554491A
Other languages
Spanish (es)
Other versions
ES554491A0 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Publication of ES8708111A1 publication Critical patent/ES8708111A1/en
Publication of ES554491A0 publication Critical patent/ES554491A0/en
Expired legal-status Critical Current

Links

Landscapes

  • Combinations Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

A circuit panel assembly for use in interconnecting electrical components 20, 21 has circuitry in the form of electrical traces 14 defined on a substrate 11. A layer of anisotropically conductive adhesive 24 surface mounts the components 20, 21 onto the circuitry. Circuit panel assemblies having single 11 or multiple substrate 111, 111a, 111b, 111c layers can be employed. The substrates can be rigid, such as metal, or can be flexible films, and a flexible dielectric coating 111a, 111b, 111c deposited over the circuitry on one substrate layer can form the substrate for the next layer of circuitry. The anisotropic adhesive layer 24 is deposited over an entire component connecting area 15 to mechanically secure the components 20, 21 to a substrate 11, but the adhesive 24 is electrically conductive only perpendicularly to the layer so that laterally adjacent component leads are not shorted. A method for fabricating a continuous strip of flexible single and multilayer 310, 334 panel assemblies is also disclosed.
ES554491A 1985-04-30 1986-04-29 Preformed circuit panel assembly Expired ES8708111A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US72871485A 1985-04-30 1985-04-30
US72889585A 1985-04-30 1985-04-30
US72889685A 1985-04-30 1985-04-30
US72889485A 1985-04-30 1985-04-30

Publications (2)

Publication Number Publication Date
ES8708111A1 true ES8708111A1 (en) 1987-09-01
ES554491A0 ES554491A0 (en) 1987-09-01

Family

ID=27505579

Family Applications (1)

Application Number Title Priority Date Filing Date
ES554491A Expired ES8708111A1 (en) 1985-04-30 1986-04-29 Preformed circuit panel assembly

Country Status (1)

Country Link
ES (1) ES8708111A1 (en)

Also Published As

Publication number Publication date
ES554491A0 (en) 1987-09-01

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Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 19980401