ES537385A0 - DISPOSAL OF A SEMICONDUCTOR PILL WITHOUT CASE-FREE POWER AND DIPPED IN A BOILING COOLING LIQUID - Google Patents
DISPOSAL OF A SEMICONDUCTOR PILL WITHOUT CASE-FREE POWER AND DIPPED IN A BOILING COOLING LIQUIDInfo
- Publication number
- ES537385A0 ES537385A0 ES537385A ES537385A ES537385A0 ES 537385 A0 ES537385 A0 ES 537385A0 ES 537385 A ES537385 A ES 537385A ES 537385 A ES537385 A ES 537385A ES 537385 A0 ES537385 A0 ES 537385A0
- Authority
- ES
- Spain
- Prior art keywords
- dipped
- disposal
- case
- cooling liquid
- boiling cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3342102A DE3342102C2 (en) | 1983-11-18 | 1983-11-18 | Structure of stackable, housing-less power semiconductors for evaporative cooling |
Publications (2)
Publication Number | Publication Date |
---|---|
ES8600570A1 ES8600570A1 (en) | 1985-10-16 |
ES537385A0 true ES537385A0 (en) | 1985-10-16 |
Family
ID=6214908
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES537385A Granted ES537385A0 (en) | 1983-11-18 | 1984-11-05 | DISPOSAL OF A SEMICONDUCTOR PILL WITHOUT CASE-FREE POWER AND DIPPED IN A BOILING COOLING LIQUID |
Country Status (4)
Country | Link |
---|---|
AT (1) | AT391775B (en) |
CH (1) | CH665730A5 (en) |
DE (1) | DE3342102C2 (en) |
ES (1) | ES537385A0 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5040051A (en) * | 1988-12-05 | 1991-08-13 | Sundstrand Corporation | Hydrostatic clamp and method for compression type power semiconductors |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2907780A1 (en) * | 1979-02-28 | 1980-09-11 | Alsthom Atlantique | Support box for cooled power semiconductor - has cylindrical anode and cathode held together by polygonal plates with three parallel holding bolts |
-
1983
- 1983-11-18 DE DE3342102A patent/DE3342102C2/en not_active Expired
-
1984
- 1984-11-05 ES ES537385A patent/ES537385A0/en active Granted
- 1984-11-16 AT AT0363484A patent/AT391775B/en not_active IP Right Cessation
- 1984-11-16 CH CH5493/84A patent/CH665730A5/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CH665730A5 (en) | 1988-05-31 |
DE3342102C2 (en) | 1986-06-19 |
ATA363484A (en) | 1990-05-15 |
ES8600570A1 (en) | 1985-10-16 |
AT391775B (en) | 1990-11-26 |
DE3342102A1 (en) | 1985-05-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FD1A | Patent lapsed |
Effective date: 19970303 |