ES410251A1 - Electric rectifier arrangements - Google Patents

Electric rectifier arrangements

Info

Publication number
ES410251A1
ES410251A1 ES410251A ES410251A ES410251A1 ES 410251 A1 ES410251 A1 ES 410251A1 ES 410251 A ES410251 A ES 410251A ES 410251 A ES410251 A ES 410251A ES 410251 A1 ES410251 A1 ES 410251A1
Authority
ES
Spain
Prior art keywords
plate
rectifier
contact surface
metal cap
cooling plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES410251A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of ES410251A1 publication Critical patent/ES410251A1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01018—Argon [Ar]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Rectifiers (AREA)
  • Synchronous Machinery (AREA)
  • Insulating Bodies (AREA)

Abstract

Rectifier arrangement, at least with a flat cooler plate and at least with a flat cooler plate and at least with a rectifier, one of whose poles is electrically connected with the cooler plate, and with at least one supply conductor, which is connected to the other pole of the rectifier, characterized in that the rectifiers have a disk-shaped housing with two metallic contact surfaces, because each rectifier is arranged between a metal cap and the cooling plate, because the metal cap is connected mechanically with the cooling plate in two places because these places are located close to the casing, because one contact surface is applied to the cooling plate, because between the other contact surface and the metal cap at least one pressure spring is arranged and because means are provided, which electrically isolate the other contact surface act in front of the refrigerator plate. (Machine-translation by Google Translate, not legally binding)
ES410251A 1972-04-25 1972-12-30 Electric rectifier arrangements Expired ES410251A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2220288A DE2220288A1 (en) 1972-04-25 1972-04-25 RECTIFIER ARRANGEMENT

Publications (1)

Publication Number Publication Date
ES410251A1 true ES410251A1 (en) 1975-12-01

Family

ID=5843229

Family Applications (1)

Application Number Title Priority Date Filing Date
ES410251A Expired ES410251A1 (en) 1972-04-25 1972-12-30 Electric rectifier arrangements

Country Status (6)

Country Link
JP (1) JPS53499B2 (en)
DE (1) DE2220288A1 (en)
ES (1) ES410251A1 (en)
FR (1) FR2181644B1 (en)
GB (1) GB1366294A (en)
IT (1) IT983975B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8421499D0 (en) * 1984-08-24 1984-09-26 British Telecomm Heat sink

Also Published As

Publication number Publication date
DE2220288A1 (en) 1973-11-15
FR2181644B1 (en) 1978-08-04
JPS4921626A (en) 1974-02-26
FR2181644A1 (en) 1973-12-07
IT983975B (en) 1974-11-11
JPS53499B2 (en) 1978-01-09
GB1366294A (en) 1974-09-11

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