Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
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Filing date
Publication date
Application filed by Texas Instruments IncfiledCriticalTexas Instruments Inc
Publication of ES379215A1publicationCriticalpatent/ES379215A1/en
Production Of Multi-Layered Print Wiring Board
(AREA)
Die Bonding
(AREA)
Abstract
A semiconductor device comprising a metal film that makes ohmic contact with a semiconductor surface portion of said semiconductor device, said film consisting of tungsten. (Machine-translation by Google Translate, not legally binding)
ES379215A1968-03-041970-04-30A semiconductor device. (Machine-translation by Google Translate, not legally binding)
ExpiredES379215A1
(en)