ES336852A1 - Un metodo de fabricacion de un ensamblaje el cual incluye una pluralidad de porciones semiconductoras aisladas electri-camente. - Google Patents
Un metodo de fabricacion de un ensamblaje el cual incluye una pluralidad de porciones semiconductoras aisladas electri-camente.Info
- Publication number
- ES336852A1 ES336852A1 ES336852A ES336852A ES336852A1 ES 336852 A1 ES336852 A1 ES 336852A1 ES 336852 A ES336852 A ES 336852A ES 336852 A ES336852 A ES 336852A ES 336852 A1 ES336852 A1 ES 336852A1
- Authority
- ES
- Spain
- Prior art keywords
- wafer
- devices
- grooves
- forming
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 6
- 235000012431 wafers Nutrition 0.000 abstract 18
- 239000011521 glass Substances 0.000 abstract 6
- 239000000463 material Substances 0.000 abstract 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 3
- 229910021397 glassy carbon Inorganic materials 0.000 abstract 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 2
- 239000011810 insulating material Substances 0.000 abstract 2
- 238000000151 deposition Methods 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 238000012986 modification Methods 0.000 abstract 1
- 230000004048 modification Effects 0.000 abstract 1
- 239000006060 molten glass Substances 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 229920003002 synthetic resin Polymers 0.000 abstract 1
- 239000000057 synthetic resin Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H3/00—Mechanisms for operating contacts
- H01H3/02—Operating parts, i.e. for operating driving mechanism by a mechanical force external to the switch
- H01H3/0253—Operating parts, i.e. for operating driving mechanism by a mechanical force external to the switch two co-operating contacts actuated independently
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/085—Isolated-integrated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/928—Front and rear surface processing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Formation Of Insulating Films (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Dicing (AREA)
- Element Separation (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US528156A US3381369A (en) | 1966-02-17 | 1966-02-17 | Method of electrically isolating semiconductor circuit components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES336852A1 true ES336852A1 (es) | 1968-04-01 |
Family
ID=24104470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES336852A Expired ES336852A1 (es) | 1966-02-17 | 1967-02-15 | Un metodo de fabricacion de un ensamblaje el cual incluye una pluralidad de porciones semiconductoras aisladas electri-camente. |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3381369A (es) |
| DE (1) | DE1614357B1 (es) |
| ES (1) | ES336852A1 (es) |
| FR (1) | FR1511517A (es) |
| GB (1) | GB1145954A (es) |
| NL (1) | NL6702342A (es) |
| SE (1) | SE334676B (es) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3514849A (en) * | 1964-12-31 | 1970-06-02 | Texas Instruments Inc | Method for making a glass-to-metal seal |
| GB1137286A (en) * | 1965-09-07 | 1968-12-18 | Texas Instruments Inc | Protective element for hermetically enclosed semiconductor devices |
| GB1180908A (en) * | 1966-11-17 | 1970-02-11 | English Electric Co Ltd | Improvements in or relating to processes for Forming an Insulating Coating on Silicon, and to Coated Silicon |
| US3881244A (en) * | 1972-06-02 | 1975-05-06 | Texas Instruments Inc | Method of making a solid state inductor |
| US4169000A (en) * | 1976-09-02 | 1979-09-25 | International Business Machines Corporation | Method of forming an integrated circuit structure with fully-enclosed air isolation |
| EP0011418A1 (en) * | 1978-11-20 | 1980-05-28 | THE GENERAL ELECTRIC COMPANY, p.l.c. | Manufacture of electroluminescent display devices |
| US4335501A (en) * | 1979-10-31 | 1982-06-22 | The General Electric Company Limited | Manufacture of monolithic LED arrays for electroluminescent display devices |
| GB2138205B (en) * | 1983-04-13 | 1986-11-05 | Philips Electronic Associated | Methods of manufacturing a microwave circuit |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3005937A (en) * | 1958-08-21 | 1961-10-24 | Rca Corp | Semiconductor signal translating devices |
| US3158788A (en) * | 1960-08-15 | 1964-11-24 | Fairchild Camera Instr Co | Solid-state circuitry having discrete regions of semi-conductor material isolated by an insulating material |
| US3300832A (en) * | 1963-06-28 | 1967-01-31 | Rca Corp | Method of making composite insulatorsemiconductor wafer |
| FR1399295A (fr) * | 1963-06-28 | 1965-05-14 | Rca Corp | Plaquette composite formée d'un semi-conducteur et d'un isolant et procédé pour sa réalisation |
| US3312879A (en) * | 1964-07-29 | 1967-04-04 | North American Aviation Inc | Semiconductor structure including opposite conductivity segments |
-
1966
- 1966-02-17 US US528156A patent/US3381369A/en not_active Expired - Lifetime
-
1967
- 1967-02-10 GB GB6589/67A patent/GB1145954A/en not_active Expired
- 1967-02-15 ES ES336852A patent/ES336852A1/es not_active Expired
- 1967-02-16 DE DE19671614357D patent/DE1614357B1/de active Pending
- 1967-02-16 FR FR95174A patent/FR1511517A/fr not_active Expired
- 1967-02-16 NL NL6702342A patent/NL6702342A/xx unknown
- 1967-02-16 SE SE02175/67A patent/SE334676B/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| NL6702342A (es) | 1967-08-18 |
| FR1511517A (fr) | 1968-01-26 |
| GB1145954A (en) | 1969-03-19 |
| US3381369A (en) | 1968-05-07 |
| DE1614357B1 (de) | 1971-10-21 |
| SE334676B (es) | 1971-05-03 |
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