ES325151A1 - Procedimiento para efectuar conexiones en circuitos impresos de capas multiples. - Google Patents

Procedimiento para efectuar conexiones en circuitos impresos de capas multiples.

Info

Publication number
ES325151A1
ES325151A1 ES0325151A ES325151A ES325151A1 ES 325151 A1 ES325151 A1 ES 325151A1 ES 0325151 A ES0325151 A ES 0325151A ES 325151 A ES325151 A ES 325151A ES 325151 A1 ES325151 A1 ES 325151A1
Authority
ES
Spain
Prior art keywords
translation
machine
legally binding
google translate
printed circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES0325151A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BAE Systems Electronics Ltd
Original Assignee
Marconi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marconi Co Ltd filed Critical Marconi Co Ltd
Publication of ES325151A1 publication Critical patent/ES325151A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H05K2201/10318—Surface mounted metallic pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10893—Grouped leads, i.e. element comprising multiple leads distributed around but not through a common insulator

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
ES0325151A 1965-04-05 1966-04-05 Procedimiento para efectuar conexiones en circuitos impresos de capas multiples. Expired ES325151A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB14359/65A GB1098846A (en) 1965-04-05 1965-04-05 Improvements in or relating to multi-layer printed circuit arrangements

Publications (1)

Publication Number Publication Date
ES325151A1 true ES325151A1 (es) 1967-02-16

Family

ID=10039778

Family Applications (1)

Application Number Title Priority Date Filing Date
ES0325151A Expired ES325151A1 (es) 1965-04-05 1966-04-05 Procedimiento para efectuar conexiones en circuitos impresos de capas multiples.

Country Status (6)

Country Link
US (1) US3375323A (es)
DE (1) DE1273028B (es)
ES (1) ES325151A1 (es)
GB (1) GB1098846A (es)
NL (1) NL6604464A (es)
SE (1) SE307984B (es)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3516156A (en) * 1967-12-11 1970-06-23 Ibm Circuit package assembly process
US4647133A (en) * 1985-04-18 1987-03-03 Innovus Electrical interconnect system
EP0256778A3 (en) * 1986-08-08 1989-03-08 Ronald Krajewski Multi-layer printed circuit structure
US6307161B1 (en) * 1996-09-10 2001-10-23 Formfactor, Inc. Partially-overcoated elongate contact structures

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1767072U (de) * 1957-08-22 1958-05-22 Siemens Ag Anordnung zur beschaltung von loetfahnen.
DE1188157B (de) * 1961-04-21 1965-03-04 Litton Industries Inc Verfahren zur Herstellung einer geschichteten, gedruckten Schaltungsplatte

Also Published As

Publication number Publication date
NL6604464A (es) 1966-10-06
SE307984B (es) 1969-01-27
US3375323A (en) 1968-03-26
GB1098846A (en) 1968-01-10
DE1273028B (de) 1968-07-18

Similar Documents

Publication Publication Date Title
DK117579B (da) Fremgangsmåde til fremstilling af elektrisk ledende forbindelser mellem flere lag i en lamineret kredsløbsplade.
ES196297U (es) Un dispositivo semiconductor.
GB911718A (en) Multiplanar printed circuits and methods for their manufacture
DK125903B (da) Fremgangsmåde til fremstilling af ledende tværforbindelser gennem et isolerende emne i forbindelse med fremstilling af trykte kredsløb på emnets overflader.
ES316541A1 (es) Un dispositivo electrico del tipo de red semiconductora o de circuito integrado.
GB1282371A (en) Coaxial circuit construction and method of making
ES325151A1 (es) Procedimiento para efectuar conexiones en circuitos impresos de capas multiples.
DK119668B (da) Fremgangsmåde til fremstilling af et isolerende legeme med et flertal af ledende gennemføringer.
ES182331U (es) Disposicion de circuito electrico impreso.
AT278052B (de) Verbundfolie, bestehend aus einer mehrlagigen elektrisch lietfähigen Schicht
ES331088A1 (es) Un metodo de fabricar un dispositivo semiconductor.
ES168698U (es) Un dispositivo semiconductor compuesto.
ES320796A1 (es) Un metodo de fabricacion de un sistema electrico.
ES397216A1 (es) Un metodo para obtener un material laminar electricamente semiconductor para formar una capa de pantalla en los cableselectricos.
ES374491A1 (es) Un dispositivo de lamina aislante flexible sobre el cual esta situado un diseno de pistas conductoras.
ES360558A1 (es) Un sistema de conexiones electricas para un circuito inte- grado.
FI51711C (fi) Menetelmä eristyskerroksen valmistamiseksi sähköjohtimilla.
DK132730C (da) Fremgangsmade til fremstilling af flerlagede, trykte kredslob med elektriske forbindelser mellem lagene
ES355623A1 (es) Un metodo rapido para fabricar paneles de circuito impreso.
ES204614A1 (es) Un procedimiento para limitar los efectos de la fusión en las instalaciones eléctricas a losaparatos en que se produzcan
ES315620A1 (es) Un dispositivo semiconductor para circuitos de ultrafrecuencia.
JPS51147289A (en) Semiconductor device
ES305611A3 (es) Perfeccionamientos en la construcciën de transformadores de impedancia para muy altas frecuencias
ES389397A1 (es) Procedimiento para fabricar circuitos impresos.
ES321577A1 (es) Unas mejoras en la fabricaciën de circuitos impresos