ES3059019T3 - Capacitor seat plate assembly - Google Patents

Capacitor seat plate assembly

Info

Publication number
ES3059019T3
ES3059019T3 ES22180348T ES22180348T ES3059019T3 ES 3059019 T3 ES3059019 T3 ES 3059019T3 ES 22180348 T ES22180348 T ES 22180348T ES 22180348 T ES22180348 T ES 22180348T ES 3059019 T3 ES3059019 T3 ES 3059019T3
Authority
ES
Spain
Prior art keywords
plate assembly
seat plate
capacitor seat
capacitor
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES22180348T
Other languages
English (en)
Inventor
Wanhong Zhang
Runshen Wang
I-Chu Lin
Wei Yan
Yang Du
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Capxon Electronic Technology Co Ltd
Original Assignee
Capxon Electronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202122660389.0U external-priority patent/CN216119923U/zh
Priority claimed from CN202111290336.2A external-priority patent/CN116072423A/zh
Application filed by Capxon Electronic Technology Co Ltd filed Critical Capxon Electronic Technology Co Ltd
Application granted granted Critical
Publication of ES3059019T3 publication Critical patent/ES3059019T3/es
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H01G9/10—Sealing, e.g. of lead-in wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistors by means of a mounting structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/78—Cases; Housings; Encapsulations; Mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H01G2/106—Fixing the capacitor in a housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/06—Mounting in containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2045—Protection against vibrations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
ES22180348T 2021-11-02 2022-06-22 Capacitor seat plate assembly Active ES3059019T3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202122660389.0U CN216119923U (zh) 2021-11-02 2021-11-02 一种抗震电容器座板
CN202111290336.2A CN116072423A (zh) 2021-11-02 2021-11-02 一种抗震电容器座板

Publications (1)

Publication Number Publication Date
ES3059019T3 true ES3059019T3 (en) 2026-03-16

Family

ID=82214156

Family Applications (1)

Application Number Title Priority Date Filing Date
ES22180348T Active ES3059019T3 (en) 2021-11-02 2022-06-22 Capacitor seat plate assembly

Country Status (3)

Country Link
US (1) US11854741B2 (es)
EP (1) EP4174887B1 (es)
ES (1) ES3059019T3 (es)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3460772B2 (ja) * 1996-08-12 2003-10-27 エルナー株式会社 電子部品
JP4345646B2 (ja) * 2004-11-15 2009-10-14 パナソニック株式会社 チップ型アルミ電解コンデンサ
JP2006156860A (ja) * 2004-12-01 2006-06-15 Matsushita Electric Ind Co Ltd チップ型アルミ電解コンデンサ
CN2821824Y (zh) * 2005-07-01 2006-09-27 鸿富锦精密工业（深圳）有限公司 电容隔热装置及应用所述装置的电容
JP5327175B2 (ja) * 2010-09-30 2013-10-30 オムロン株式会社 電解コンデンサ用表面実装ソケット及び電解コンデンサの表面実装方法
JP5802387B2 (ja) * 2010-12-24 2015-10-28 サン電子工業株式会社 チップ形コンデンサ及びその製造方法
JP6142508B2 (ja) * 2012-11-12 2017-06-07 北川工業株式会社 コンデンサホルダ
CN206991951U (zh) * 2017-05-11 2018-02-09 南通新联电子有限公司 贴片式电容器用座板
CN207529815U (zh) * 2017-12-21 2018-06-22 肇庆绿宝石电子科技股份有限公司 一种抗振动电容器基座
WO2019189160A1 (ja) * 2018-03-28 2019-10-03 パナソニックＩｐマネジメント株式会社 座板付きコンデンサ
CN109585172A (zh) 2019-01-17 2019-04-05 赣州市柏瑞凯电子科技有限公司 一种耐振动铝电解电容器
US11908635B2 (en) * 2019-06-06 2024-02-20 Nippon Chemi-Con Corporation Capacitor and method for producing same, and capacitor-mounting method
CN210378760U (zh) 2019-07-31 2020-04-21 浙江天台祥和实业股份有限公司 一种电容器焊接底座

Also Published As

Publication number Publication date
EP4174887C0 (en) 2025-11-19
US20220319780A1 (en) 2022-10-06
EP4174887B1 (en) 2025-11-19
EP4174887A1 (en) 2023-05-03
US11854741B2 (en) 2023-12-26

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