ES2758538T3 - Data storage medium with part piece - Google Patents

Abstract

Method for manufacturing a data storage support (1), in particular a chip card, comprising the following steps: - providing a card-shaped data storage support body (2) with a first thickness (22) , as well as a front side (15) and a back side (16), - reduce the first thickness (22) of the body (2) of the data storage medium to a second thickness (23) in a pre-established area (14) on the front side (15) of the body (2) of the data storage medium and - cut the body (2) of the data storage medium in the pre-established area (14) to generate a first partial part (3) of the body (2) of the data storage medium, so that the first partial part (3) fits into a passage opening (18) of the body (2) of the data storage medium generated by the cut and can move in the opening (18) in passing, characterized by the step of displacing the first partial part (3) inside the opening (18) for passage in the direction of the front side (15) of the body (2) of the data storage medium, so that the first part (3) is aligned with the front side (15 ) of the body (2) of the data storage medium.

Description

DESCRIPTION

Data storage medium with part piece

The present invention relates to a method of manufacturing a data storage medium with a removable part thereof, as well as such a data storage medium, in particular a chip card, preferably a so-called combined SIM card .

Chip cards of different sizes are known, in particular in the form of SIM cards for mobile phone terminal devices. The different sizes of SIM cards are known in particular as mini-SIM ("2FF", "Second Form Factor", second form factor), micro-SIM ("3FF", "Third Form Factor", third factor form) and nano-SIM ("4FF", "Fourth Form Factor", fourth form factor) and are used, for example, for different types of mobile phones. A mobile phone user receives a SIM card suitable for their mobile phone in general as a part of a chip card in the form of a bank card (ID-1) to be removed by breaking. To simplify manufacturing and handling, combined SIM cards are known in which several of the aforementioned form factors are pre-punched into a card body for removal by snapping or pressing.

The different form factors can have, in addition to different length and width dimensions, also different thicknesses. For example, if a nano-SIM is to be provided in a combined SIM, the problem arises that the nano-SIM, according to the specification, has a lower thickness than other form factors. The smallest thickness can be achieved by milling the front side of the chip card, since a cavity to accommodate a chip module must still be milled there. However, if such a combined SIM does not require the nano-SIM, but rather a larger form factor, the contact surfaces of the chip module are in a depression on the front side of the card. This can lead to the contacts of the mobile phone getting stuck in the depression. If the thickness of the card body from the back side is reduced to avoid depression on the front side, for example by milling, the back side already printed is destroyed in this area, or the card body not yet printed cannot be printed correctly in this area. From WO 2013/098518 A1 it is known to carry out the manufacture of a card with two different thicknesses by milling the back of the card. A partial piece of the card can be detached from the card body thanks to surrounding notches.

DE 102012 001776 A1 describes a card body with a removable mini chip card. To minimize breakout forces, a surrounding slot is provided and the minichip card is held by narrow ribs to the card body. The ribs can also be additionally combined with notches.

The aim of the present invention is to propose a data storage medium with a partial piece of reduced thickness, as well as a method for its manufacture, such that the handling and manufacture of the data storage medium are improved in relation to the disadvantages previously mentioned. This objective is achieved by a method for manufacturing a data storage medium, as well as by a data storage medium with the characteristics of the independent claims. Preferred configurations and refinements are indicated in the dependent claims. In a method of manufacturing a data storage medium, in particular a chip card, there is first provided a card-shaped data storage medium body, having a first thickness, as well as a front side and a back side. The first thickness is reduced to a second thickness in a preset area on the front side of the body of the data storage medium, which can be accomplished by removing material, for example, by milling, from the front side in the preset area. The rear side and, optionally, the front side of the body of the data storage medium can be printed before or after the thickness reduction.

To generate a removable first part, the body of the data storage medium is cut in the preset area, so that the first part fits into a through opening of the body of the data storage medium generated by cutting and can move in the passage opening. The cutting of the body of the data storage medium takes place within the preset area, however it can take place exactly along the edges, so that the preset area has the same length and width dimensions as the first part. to generate. Alternatively and vice versa, the body of the data storage medium can also be cut first and then the thickness of the body of the data medium can be reduced.

The first part is then moved into the through opening toward the front side of the body of the data storage medium so that the first part is aligned with the front side of the body of the data storage medium. Since the first part part is arranged in the passage opening of the body of the data storage medium so that it is aligned with the side anterior to the body of the data storage medium, the generated data storage medium has a flat front side and a depression in the area of the first part on the rear side. The flat front side is advantageous compared to a depression on the front side, since the contacts of a mobile telephone terminal device can slide on the front side of the data storage medium, on which the contact surfaces are preferably located of a chip module, without danger of getting stuck in a depression. However, since the thickness of the data storage medium in the preset area is not reduced from the rear side, but from the front side with a subsequent offset of the first part towards the front side, the impression is not destroyed from the back side.

Preferably, the method comprises the step of printing at least the back and / or the front side of the body of the data storage medium, in a matter of time, before the thickness of the body of the data storage medium is reduced on the preset zone. As mentioned, the printing on the back side is not destroyed, since the thickness reduction takes place from the front side. However, a destruction of the printing in the pre-established area on the front side does not disturb, since, in any case, a chip module is advantageously implanted in the body of the data storage medium that can completely cover the surface of the first part piece or, if the contact surfaces are smaller than the surface of the first part piece, then only a small edge around the chip module contact surfaces is unprinted.

Preferably, the cutting of the body of the data storage medium to generate the first partial part takes place from the front side of the body of the data storage medium. This preferably occurs by means of a special die-cutting tool and a punch, which are configured to hold the generated part in the die-cut through opening by removing the die-cutting blade and displacing it towards the front side of the body of the data storage medium. In this way, the first partial part is generated and displaced in one stage.

Preferably, the data storage medium comprises a chip module that is placed in the first part. Therefore, the manufacturing process preferably further comprises the steps of generating a cavity for a chip module on the front side of the body of the data storage medium in the preset area and the placement of a chip module in the cavity. This preferably takes place before the first part is moved towards the front side of the body of the data storage medium. In other words, the first partial piece moves together with the chip module implanted in the passage opening of the body of the data storage medium, whereby it is achieved, in particular, that the contact surfaces of the chip module are aligned with the front side of the data storage medium. The contact surfaces can completely cover the surface of the first partial piece or cover only a part.

In a preferred embodiment, the first original thickness of the body of the data storage medium in the pre-established area is reduced by a maximum percentage of 30%, preferably between 15% and 25%. In other words, the second thickness is at least 70%, preferably between 75% and 85% of the first thickness.

Preferably, in addition to the first, a second and / or a third removable part is also generated from the body of the data storage medium, such that the second part advantageously surrounds the first part and the third part surrounds the first and, optionally, the second partial piece. Preferably, the second part piece has a length of 15.0 mm, a width of 12.0 mm and a thickness of 0.80 mm, while the third part piece preferably has a length of 25.0 mm, a width of 15.0 mm and a thickness of 0.80 mm. The first partial piece preferably has a length of 12.30 mm, a width of 8.80 mm and a thickness of 0.67 mm and the body of the data storage medium, a length of 85.60 mm, a width of 53.98 mm and a thickness of 0.80 mm. All dimensions include a tolerance of / - 0.1mm.

Preferably, in this way, form factors according to the standard are provided, such that the data storage medium is preferably a chip card in ID-1 format according to ISO / IEC 7810: 2003 and the first part is a nano-SIM ( 4FF) according to E ^t SI TS 102 221 V11.0.0. The second partial piece is preferably a micro-SIM (mini-UICC; 3FF) according to ETSI TS 102 221 V9.0.0 and the third partial piece is a mini-SIM (UICC; ID-000; 2FF) according to ISO / IeC 7810: 2003 . Preferably, the data storage medium has all four form factors. However, the second and / or the third part can be dispensed with. In another convenient variant, the data storage medium itself is in the form of a third part and contains a second and / or a first part; here the partial piece that constitutes the largest form factor is missing.

The cutting of the body of the data storage medium to generate the first partial part and, optionally, to generate the second and / or third removable part of the body of the data storage medium, preferably takes place by means of die-cutting. In this sense, the partial pieces can perfectly fit a in the other or a groove may be provided, such that the part pieces are joined together by ribs. Preferably the smaller form factors are die cut first, in other words, die cut from the inside out, as this facilitates handling and compliance with tolerances.

The invention is described below by way of example based on the accompanying schematic drawings. They show: Figure 1, a data storage medium in the form of a chip card in top view,

Figure 2 a section through the data storage medium of Figure 1,

FIG. 3 a top view of the data storage medium of FIG. 1 without the chip module and FIGS. 4a to 4f, selected process steps for manufacturing the data storage medium of FIG. 1, in sectional representation schematic.

In figure 1 a data storage medium 1 is represented in the form of a chip card, the body 2 of which comprises several partial parts 3, 4, 5, 6. The body 2 of the data storage medium is preferably made of ABS (injection molded acrylonitrile butadiene styrene), although it may also be manufactured in another way and / or from other materials, for example, by multilayer lamination. In the present embodiment, it is a combined SIM card, in which the partial parts 3, 4, 5, 6 constitute standardized form factors. Data storage medium 1 is a full-size 6 SIM card in ID-1 format according to ISO / IEC 7810: 2003. In the exemplary embodiment, the first part 3 is a nano-SIM (4FF) according to ETSI TS 102221 V11.0.0. The second part piece 4 is a micro-SIM (mini-UICC; 3FF) according to ETSI TS 102221 V9.0.0 and the third part part 5 is a mini-SIM (UICC; ID-000; 2FF) according to ISO / IEC 7810: 2003 .

The third partial piece 5 can be removed from the body 2 of the card and is connected to it by ribs 10 with nominal break points, such that between the third partial piece 5 and the rest of the card body 2 a slot 9 which is generated by a corresponding die cutting tool. The nano-SIM 3, the micro-SIM 4 and the mini-SIM 5 are respectively embedded within each other. In other words, the respectively larger form factor comprises a through opening into which the respectively smaller form format is embedded. A user can extract the appropriate form factor for his terminal device from the card body 2. Advantageously, a removed smaller form factor can be snapped back into the corresponding passage opening of the immediately larger form factor if, for example, by mistake, too small a form factor was removed. Advantageously and in particular, a part piece 3 can be put back into a part piece 4 and a part piece 4 into a part piece 5.

The first part 3 in the form of the nano-SIM has a chip module with a chip 8 and contact surfaces 7. As recognized in the sectional representation of FIG. 2, the surface of the first part 3, in Particularly the contact surfaces 7 of the chip module, is aligned with the front side 15 of the chip card 1.

However, according to the specification it is permissible for the surface of the chip module to be offset by - 0.1 mm from the front side of the chip card 1. On the contrary, on the rear side 16 in the area of the first part 3 there is a depression 17, since the first part 3 was displaced after die-cutting in the direction of the front side 15, as described in detail in continuation. The first part 3 therefore has a reduced thickness 23 compared to the thickness 22 of the other form factors. The first thickness 22 is 0.68mm to 0.84mm, preferably 0.80mm, while the second thickness 23 is less and is 0.60mm to 0.70mm, preferably 0.64mm . In figure 2, the limits of the part pieces 3, 4, 5 are indicated by dotted lines.

Figure 3 shows a top view of a card body 2 after reducing the thickness, where the two-level cavity 11, 12 for the chip module 7, 8 is also shown, although the module 7, 8 itself chip has been omitted for clarity. Conveniently, in practice, the chip module 7, 8 is placed in the cavity 11, 12 before the partial parts 3, 4, 5 are placed. In this embodiment, the cavity 12 has dimensions of length and width that are hardly more smaller than the first part 3, although it can also cover the entire surface of the part 3. In addition, a depression 13 is recognized in the front part, which was generated to reduce the thickness 22 of the card body 2 to the desired thickness 23 of the first partial piece 3. As recognized in figure 2, the depression 13 can barely exceed the dimensions of the first partial piece 3. Preferably (as shown in figures 2 and 4a-4f), the thickness is reduced 22 of the card body 2 just in the area corresponding to the dimensions of the first part 3, that is, the depression 13 (and therefore the preset area 14, see FIG. 4a) coincides with the first part 3. The reduction in thickness 22 of the c The card body 2, as well as the generation of the cavity 11, 12, preferably take place by milling the card body 2. Other procedures for removing the material from the card body 2 are also possible, such as laser treatment.

In FIGS. 4a to 4f, process steps of a process for manufacturing a chip card 1 with a part piece 3 having a reduced thickness 23 compared to the rest of the card body 2 are shown. In figure 4a an initial part of a card body 2 is represented with a front side 15 and a front side 16. The front side 15 and the back side 16 have already been printed in a previous step. A preset area 14 is indicated, in which the thickness of the card body 2 should be reduced. As mentioned above, the dimensions of the preset area 14 preferably correspond to those of the first part 3 to be generated.

As shown in figure 4b, a tool 24 is milled on the front side 15 of the card body 2, preferably already printed on both sides, in the pre-established area 14, a depression 13 to reduce the thickness 22 of the body 2 card to the desired thickness 23 of the part 3 to be generated. The impression in this area on the front side is destroyed, which, however, does not affect the appearance of the final product, since a chip module 7, 8 is placed in this place, whose contact surfaces 7 cover almost completely or they can completely cover the front side of the part 3. For this purpose, a cavity 11, 12 is milled, which is configured, for example, on two levels, to correspondingly house the chip module with the contact surfaces 7 and chip 8 (figure 4c). This is implanted according to known procedures in cavity 11, 12 (Figure 4d). Figure 4e shows the step of generating the first partial part 3 with the help of a die cutting tool 19 and a punch 20. The card body 2 is conveniently supported on a die 21. The die cutting takes place with the die cutting tool 19 from the front side 15 of the card body 2. The generated part 3 is displaced in this case in the through opening 18 generated during the punching in the direction of the front side 15 of the card body. This takes place by means of the punch 20. During the withdrawal of the die-cutting tool 19, in the same working step, the part 3 is also adjusted on the front side 15 of the card body 2 with the aid of the punch 20. Therefore , the first part 3 can be oriented aligned with the front side 15 of the card body 2, such that a depression 17 is simultaneously generated on the back side. In particular, the contact surfaces 7 of the chip module are also oriented then aligned with the front side 15 of the card body 2.

Finally, in figure 4f the final product is represented analogously to figure 2, such that after the generation of the first partial part 3, additional partial parts 4, 5 are generated correspondingly and one after the other. The partial pieces are preferably generated from the inside out, that is, the smallest partial pieces are generated first. Simultaneous die-cutting of all partial parts 3, 4, 5 is also possible. The front side of the chip card 1 is flat, so that the contacts of a terminal device, such as a mobile phone, cannot get stuck in one depression. Simultaneously, the impression on the back side 16 remains intact in the area of the first part 3, since the thickness 22 of the card body 2 is reduced from the front side and only moves just after the die-cutting process, together with the first partial piece 3, in the card body 2.

Claims (15)

Procedure for manufacturing a data storage medium (1), in particular a chip card, comprising the following steps: - providing a card-shaped data storage support body (2) with a first thickness (22), as well as a front side (15) and a back side (16), - reducing the first thickness (22) of the body (2) of the data storage medium to a second thickness (23) in a pre-established area (14) on the front side (15) of the body (2) of the data storage medium data and - cutting the body (2) of the data storage medium in the preset area (14) to generate a first partial part (3) of the body (2) of the data storage medium, so that the first partial part (3) fits into a through opening (18) of the body (2) of the data storage medium generated by the cut and can move in the through opening (18), characterized by the step of moving the first partial part (3) into the passage opening (18) in the direction of the front side (15) of the body (2) of the data storage medium, so that the first partial part ( 3) is aligned with the front side (15) of the body (2) of the data storage medium. The method according to claim 1, characterized by the step of printing at least the rear side (16) of the body (2) of the data storage medium before the step of reducing the first thickness (22) of the body (2 ) of the data storage medium in the pre-established area (14). Method according to claim 1 or 2, characterized by the step of printing the front side (15) of the body (2) of the data storage medium before the step of reducing the first thickness (22) of the body (2 ) of the data storage medium in the pre-established area (14). Method according to any of claims 1 to 3, characterized in that the step of cutting the body (2) of the data storage medium to generate the first partial part (3) takes place from the rear side (16) of the body (2) of the data storage medium, such that the front side (15) of the body (2) of the data storage medium is on a flat surface (21) and the first part piece (3) is pressed against the flat surface (21) for alignment with the front side (15) of the body (2) of the data storage medium. Method according to any of claims 1 to 4, characterized by the step of generating a cavity (11, 12) for a chip module (7, 8) on the front side (15) of the body (2) of the support for storing data in the pre-established area (14) and for placing a chip module (7, 8) in the cavity (11, 12), preferably before moving the first part (3) in the direction of the front side (15 ) of the body (2) of the data storage medium. Method according to any of claims 1 to 5, characterized in that the step of reducing the first thickness (22) of the body (2) of the data storage medium in the pre-established area (14) takes place by milling the side front (15) of the body (2) of the data storage medium. 7. Method according to any of claims 1 to 6, characterized in that the second thickness (23) is at least 70%, preferably between 75% and 85% of the first thickness (22). Method according to any one of claims 1 to 7, characterized by the step of generating at least a second removable part (4) from the body (2) of the data storage medium, which surrounds the first part (3). , such that the second partial piece (4) preferably has a length of 15.00 mm, a width of 12.0 mm and a thickness of 0.80 mm, and / or a third part (5) removable from the body (2) of the data storage medium, which surrounds the first part (3) and, if applicable, the second part (4), such that the third Part piece (5) preferably has a length of 25.0 mm, a width of 15.0 mm and a thickness of 0.80 mm. 9. Method according to any of claims 1 to 10, characterized in that the first partial piece (3) is generated with a length of 12.30 mm, a width of 8.8 mm and a thickness of 0.64 mm and / or the body (2) of the data storage medium has a length of 85.6 mm, a width of 53.98 mm and a thickness of 0.80 mm. The method according to any of claims 1 to 9, characterized by the step of cutting the body (2) of the data storage medium to generate the first part (3) and, optionally, the step of generating the second and / or third partial piece (4, 5) removable from the body of the data storage medium by means of die-cutting. 11. Data storage medium (1), in particular a chip card, comprising a body (2) of the data storage medium in the form of a card with a first thickness (22), as well as a front side (15) and a rear side (16), such that the data storage support (1) has at least one part (3) that is separated from the rest of the body (2) of the data storage support and is fitted into an opening (18 ) of passage of the body (2) of the data storage medium and can move in the opening (18) of passage, such that the first part (3) has a second thickness (23) reduced compared to the first thickness ( 22), characterized in that the first part (3) is arranged in the opening (18) for the body (2) of the data storage medium so that it is aligned with the front side (15) of the body (2) of the medium data storage. 12. Data storage medium, according to claim 11, characterized in that the data storage medium (1) has a chip module (7, 8) that is placed in the first partial part (3). 13. Data storage medium according to claim 11 or 12, characterized in that the second thickness (23) represents at least 70%, preferably between 73% and 85% of the first thickness (22). 14. Data storage medium according to any of claims 11 to 13, characterized in that the body (2) of the data storage medium has at least one second part (4) removable from the body of the data storage medium. , which surrounds the first part (3), such that the second part (4) preferably has a length of 15.0 mm, a width of 12.0 mm and a thickness of 0.80 mm, and / or has a third part (5) removable from the body (2) of the data storage medium, which surrounds the first part (3) and, if appropriate, the second part (4), such that the third partial piece (5) preferably has a length of 25.0 mm, a width of 15.0 mm and a thickness of 0.80 mm. 15. Data storage medium, according to any of claims 11 to 14, characterized in that the first partial piece (3) has a length of 12.30 mm, a width of 8.8 mm and a thickness of 0.64 mm and / or the body (2) of the data storage medium has a length of 85.6 mm, a width of 53.98 mm and a thickness of 0.80 mm.