ES2584429A1 - Método de fabricación de un disipador térmico poroso para dispositivos electrónicos - Google Patents
Método de fabricación de un disipador térmico poroso para dispositivos electrónicos Download PDFInfo
- Publication number
- ES2584429A1 ES2584429A1 ES201530394A ES201530394A ES2584429A1 ES 2584429 A1 ES2584429 A1 ES 2584429A1 ES 201530394 A ES201530394 A ES 201530394A ES 201530394 A ES201530394 A ES 201530394A ES 2584429 A1 ES2584429 A1 ES 2584429A1
- Authority
- ES
- Spain
- Prior art keywords
- heat sink
- porous heat
- translation
- electronic devices
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 3
- 238000000034 method Methods 0.000 abstract 3
- 238000010146 3D printing Methods 0.000 abstract 1
- 239000000654 additive Substances 0.000 abstract 1
- 230000000996 additive effect Effects 0.000 abstract 1
- 238000011960 computer-aided design Methods 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 abstract 1
- 230000006911 nucleation Effects 0.000 abstract 1
- 238000010899 nucleation Methods 0.000 abstract 1
- 238000000926 separation method Methods 0.000 abstract 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
- F23N—REGULATING OR CONTROLLING COMBUSTION
- F23N5/00—Systems for controlling combustion
- F23N5/02—Systems for controlling combustion using devices responsive to thermal changes or to thermal expansion of a medium
- F23N5/10—Systems for controlling combustion using devices responsive to thermal changes or to thermal expansion of a medium using thermocouples
- F23N5/107—Systems for controlling combustion using devices responsive to thermal changes or to thermal expansion of a medium using thermocouples using mechanical means, e.g. safety valves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T17/00—Three dimensional [3D] modelling, e.g. data description of 3D objects
- G06T17/10—Constructive solid geometry [CSG] using solid primitives, e.g. cylinders, cubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
- F23N—REGULATING OR CONTROLLING COMBUSTION
- F23N2900/00—Special features of, or arrangements for controlling combustion
- F23N2900/05101—Connections between thermocouple and magnetic valves, e.g. by plug and socket connectors
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Geometry (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Software Systems (AREA)
- Theoretical Computer Science (AREA)
- Computer Graphics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Método de fabricación de un disipador térmico poroso para dispositivos electrónicos utilizando técnicas computacionales de diseño asistido por ordenador basadas en un método basado en diagramas de Voronoi. El disipador térmico poroso obtenido se caracteriza por poseer macroporosidad variable e interconectada. Dicha macroporosidad se establece a partir de la definición del espesor trabecular de sección no constante (Tb.Th), de la separación trabecular (Tb.Sp), del número de puntos de nucleación de Voronoi y del volumen de la zona a rellenar. Dicho disipador térmico poroso se fabrica a partir de técnicas aditivas por impresión tridimensional (3D) con materiales conductores. Esta invención es aplicable en el campo dedicado a la fabricación de disipadores o intercambiadores de calor encargados de la evacuación de calor desde un elemento con elevada temperatura hacia un medio con menor temperatura con o sin circulación forzada de aire. Su elevada superficie específica y la posibilidad de conformarlo adaptándolo a un volumen predefinido permite optimizar la evacuación de calor en espacios reducidos.
Description
Claims (1)
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imagen1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES201530394A ES2584429B1 (es) | 2015-03-25 | 2015-03-25 | Método de fabricación de un disipador térmico poroso para dispositivos electrónicos |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES201530394A ES2584429B1 (es) | 2015-03-25 | 2015-03-25 | Método de fabricación de un disipador térmico poroso para dispositivos electrónicos |
Publications (2)
Publication Number | Publication Date |
---|---|
ES2584429A1 true ES2584429A1 (es) | 2016-09-27 |
ES2584429B1 ES2584429B1 (es) | 2017-07-17 |
Family
ID=55588231
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES201530394A Active ES2584429B1 (es) | 2015-03-25 | 2015-03-25 | Método de fabricación de un disipador térmico poroso para dispositivos electrónicos |
Country Status (1)
Country | Link |
---|---|
ES (1) | ES2584429B1 (es) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102020208749A1 (de) | 2020-07-14 | 2022-01-20 | Volkswagen Aktiengesellschaft | Verfahren zum Herstellen eines gekühlten Leistungselektronikmoduls |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090321045A1 (en) * | 2008-06-30 | 2009-12-31 | Alcatel-Lucent Technologies Inc. | Monolithic structurally complex heat sink designs |
WO2011060312A2 (en) * | 2009-11-12 | 2011-05-19 | Smith & Nephew, Inc. | Controlled randomized porous structures and methods for making same |
CN104028758A (zh) * | 2014-07-04 | 2014-09-10 | 成都三鼎日新激光科技有限公司 | 一种热沉的制作方法 |
-
2015
- 2015-03-25 ES ES201530394A patent/ES2584429B1/es active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090321045A1 (en) * | 2008-06-30 | 2009-12-31 | Alcatel-Lucent Technologies Inc. | Monolithic structurally complex heat sink designs |
WO2011060312A2 (en) * | 2009-11-12 | 2011-05-19 | Smith & Nephew, Inc. | Controlled randomized porous structures and methods for making same |
CN104028758A (zh) * | 2014-07-04 | 2014-09-10 | 成都三鼎日新激光科技有限公司 | 一种热沉的制作方法 |
Non-Patent Citations (3)
Title |
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Kou, Shuting. ¿Porous structure modeling with computers¿. Postgraduate Thesis. University of Hong Kong. [en línea] Noviembre 2014 [recuperado el 6-4-2016] Recuperado de Internet: < http://hub.hku.hk/handle/10722/206700 > DOI: < 10.5353/th_b5223989 > * |
V. Petrovic et al. ¿Additive layer manufacturing: state of the art in industrial applications through case studies¿. International Journal of Production research. Volume 49, issue 4, pages 1061-1079 [en línea] Febrero 2010 [recuperado el 6-4-2016] Recuperado de Internet: < http://www.tandfonline.com/doi/abs/10.1080/00207540903479786 > DOI: < * |
X.Y. Kou et al. ¿A simple and effective geometric representation for irregular porous structure modeling¿. Computer-Aided Design. Volume 42, Issue 10, October 2010, Pages 930¿941 [en línea] Octubre 2010 [recuperado el 6-4-2016] Recuperado de Internet: < http://www.sciencedirect.com/science/article/pii/S0010448510001211 > DOI: < doi:10.1016/j.cad.2010.06.006 > * |
Also Published As
Publication number | Publication date |
---|---|
ES2584429B1 (es) | 2017-07-17 |
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