ES2531450B2 - Gestión térmica de un transceptor de comunicaciones en un dispositivo eléctrico de comunicaciones - Google Patents

Gestión térmica de un transceptor de comunicaciones en un dispositivo eléctrico de comunicaciones Download PDF

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Publication number
ES2531450B2
ES2531450B2 ES201490126A ES201490126A ES2531450B2 ES 2531450 B2 ES2531450 B2 ES 2531450B2 ES 201490126 A ES201490126 A ES 201490126A ES 201490126 A ES201490126 A ES 201490126A ES 2531450 B2 ES2531450 B2 ES 2531450B2
Authority
ES
Spain
Prior art keywords
communications
transceiver
communications device
segment
communication
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
ES201490126A
Other languages
English (en)
Other versions
ES2531450R1 (es
ES2531450A2 (es
Inventor
V. ACHANTA Shankar
Dennis Gammel
Mark A. Thomas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schweitzer Engineering Laboratories Inc
Original Assignee
Schweitzer Engineering Laboratories Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schweitzer Engineering Laboratories Inc filed Critical Schweitzer Engineering Laboratories Inc
Publication of ES2531450R1 publication Critical patent/ES2531450R1/es
Publication of ES2531450A2 publication Critical patent/ES2531450A2/es
Application granted granted Critical
Publication of ES2531450B2 publication Critical patent/ES2531450B2/es
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L1/00—Arrangements for detecting or preventing errors in the information received
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/38—Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807—Dismountable connectors, i.e. comprising plugs
    • G02B6/389—Dismountable connectors, i.e. comprising plugs characterised by the method of fastening connecting plugs and sockets, e.g. screw- or nut-lock, snap-in, bayonet type
    • G02B6/3893—Push-pull type, e.g. snap-in, push-on
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q1/00—Details of selecting apparatus or arrangements
    • H04Q1/02—Constructional details
    • H04Q1/11—Protection against environment
    • H04Q1/118—Protection against environment heat or sun protection
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/38—Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807—Dismountable connectors, i.e. comprising plugs
    • G02B6/3897—Connectors fixed to housings, casing, frames or circuit boards
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q1/00—Details of selecting apparatus or arrangements
    • H04Q1/02—Constructional details
    • H04Q1/025—Cabinets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0058—Casings specially adapted for optoelectronic applications

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Accessory Devices And Overall Control Thereof (AREA)

Abstract

Gestión térmica de un transceptor de comunicaciones en un dispositivo eléctrico de comunicaciones.#Se divulgan en la presente memoria diversos sistemas y procedimientos relacionados con dispositivos de comunicaciones que incluyen transceptores modulares, tales como transceptores conectables de pequeña forma. De acuerdo con una realización, un dispositivo de comunicaciones puede incluir un chasis que define un interior y un exterior del dispositivo de comunicaciones. El chasis incluye una parte superior, una parte inferior, y una pluralidad de lados que, junto con la parte superior y la parte inferior forman un recinto. Uno de los lados puede incluir un primer segmento dispuesto en un primer plano y un segundo segmento dispuesto en un segundo plano. El segundo segmento incluye una carcasa de transceptor de comunicaciones que se extiende hacia el exterior configurada para recibir un transceptor de comunicaciones. El transceptor de comunicaciones puede extenderse a través de una abertura en el segundo segmento y en el interior del dispositivo de comunicaciones para contactar con un conector eléctrico, mientras que una segunda porción del transceptor de comunicaciones en la carcasa del transceptor de comunicaciones permanece en el exterior del dispositivo de comunicaciones.

Description

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Claims (1)

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ES201490126A 2012-05-30 2013-05-28 Gestión térmica de un transceptor de comunicaciones en un dispositivo eléctrico de comunicaciones Expired - Fee Related ES2531450B2 (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261652986P 2012-05-30 2012-05-30
US61/652,986 2012-05-30
PCT/US2013/042935 WO2013181168A1 (en) 2012-05-30 2013-05-28 Thermal management of a communication transceiver in an electrical communication device

Publications (3)

Publication Number Publication Date
ES2531450R1 ES2531450R1 (es) 2015-03-16
ES2531450A2 ES2531450A2 (es) 2015-03-16
ES2531450B2 true ES2531450B2 (es) 2015-08-11

Family

ID=49670219

Family Applications (1)

Application Number Title Priority Date Filing Date
ES201490126A Expired - Fee Related ES2531450B2 (es) 2012-05-30 2013-05-28 Gestión térmica de un transceptor de comunicaciones en un dispositivo eléctrico de comunicaciones

Country Status (7)

Country Link
US (1) US9042096B2 (es)
AU (1) AU2013267607B2 (es)
BR (1) BR112014027300A2 (es)
CA (1) CA2872763C (es)
ES (1) ES2531450B2 (es)
MX (1) MX2014013156A (es)
WO (1) WO2013181168A1 (es)

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US9912107B2 (en) 2014-04-01 2018-03-06 Te Connectivity Corporation Plug and receptacle assembly having a thermally conductive interface
WO2017044825A1 (en) * 2015-09-10 2017-03-16 Samtec, Inc. Rack-mountable equipment with a high-heat-dissipation module, and transceiver receptacle with increased cooling
US10498451B2 (en) * 2015-10-01 2019-12-03 Hewlett Packard Enterprise Development Lp Removable module
US10659168B2 (en) 2016-08-23 2020-05-19 Schweitzer Engineering Laboratories, Inc. Low-power fiber optic transceiver
US10921536B2 (en) 2017-05-18 2021-02-16 Arista Networks, Inc. Heat sink for optical transceiver
CA3066003C (en) * 2017-06-07 2022-06-21 Samtec, Inc. Transceiver assembly array with fixed heatsink and floating transceivers
US10690868B1 (en) * 2018-05-29 2020-06-23 Cisco Technology, Inc. Thermal protection for modular components in a network device
US11088715B2 (en) * 2018-08-31 2021-08-10 TE Connectivity Services Gmbh Communication system having a receptacle cage with an airflow channel
CN109922382A (zh) * 2019-01-29 2019-06-21 合肥米佑信息技术有限公司 一种跨平台跨协议的集成中控设备
US10651607B1 (en) * 2019-05-21 2020-05-12 Arista Networks, Inc. Stacked optical module cage with improved airflow to bottom ports

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US6220878B1 (en) * 1995-10-04 2001-04-24 Methode Electronics, Inc. Optoelectronic module with grounding means
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Also Published As

Publication number Publication date
WO2013181168A1 (en) 2013-12-05
CA2872763C (en) 2015-10-27
ES2531450R1 (es) 2015-03-16
US9042096B2 (en) 2015-05-26
AU2013267607A1 (en) 2014-11-27
ES2531450A2 (es) 2015-03-16
BR112014027300A2 (pt) 2017-06-27
AU2013267607B2 (en) 2014-12-18
MX2014013156A (es) 2015-01-19
US20130322500A1 (en) 2013-12-05
CA2872763A1 (en) 2013-12-05

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