ES2263384A1 - Tile bonding process comprises a stage which takes flamed the polymeric support, pre-drying of the tiles at optimal temperature, and adhesive application on the two sides facing tile and polymeric supports - Google Patents

Tile bonding process comprises a stage which takes flamed the polymeric support, pre-drying of the tiles at optimal temperature, and adhesive application on the two sides facing tile and polymeric supports

Info

Publication number
ES2263384A1
ES2263384A1 ES200501206A ES200501206A ES2263384A1 ES 2263384 A1 ES2263384 A1 ES 2263384A1 ES 200501206 A ES200501206 A ES 200501206A ES 200501206 A ES200501206 A ES 200501206A ES 2263384 A1 ES2263384 A1 ES 2263384A1
Authority
ES
Spain
Prior art keywords
polymeric
tiles
tile
stage
supports
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
ES200501206A
Other languages
Spanish (es)
Inventor
Enrique Cortes Fibla
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qmc Mexico SA de CV
Original Assignee
Qmc Mexico SA de CV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qmc Mexico SA de CV filed Critical Qmc Mexico SA de CV
Priority to ES200501206A priority Critical patent/ES2263384A1/en
Publication of ES2263384A1 publication Critical patent/ES2263384A1/en
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Finishing Walls (AREA)

Abstract

Tile bonding process to supports or substrates polymer, which being intended to unite using a tile adhesive on its underside respective polymeric supports, comprises a first stage which takes flamed the polymeric support a second stage of pre-drying of the tiles at optimal temperature, eliminating any moisture and water least on the lower surface of adhesion tile and a third stage of adhesive application on at least one of the two sides facing tile and polymeric supports. Tile bonding process to supports or substrates polymer, which being intended to unite using a tile adhesive on its underside respective polymeric supports, comprises a first stage which takes flamed the polymeric support a second stage of pre-drying of the tiles at optimal temperature, eliminating any moisture and water least on the lower surface of adhesion tile a third stage of adhesive application on at least one of the two sides facing tile and polymeric supports a fourth stage where the sets are placed tile and polymer support, respective bases of support so static for any length of time polymerization of the adhesive holding also a constant pressure and a fifth step of drying sets tile and polymer support during at least a time span of 2 hours at a given temperature. An independent claim is adhesive used in bonding process tiles to support or polymeric substrates, essentially where a product is two component, epoxy-polyamino amide formed by two compounds.

Description

Proceso de pegado de baldosas a soportes o sustratos poliméricos y adhesivo utilizado.Process of bonding tiles to supports or polymeric substrates and adhesive used.

Objeto de la invenciónObject of the invention

La presente invención, según se expresa en el enunciado de esta memoria descriptiva, se refiere a un proceso de pegado de baldosas a soportes o sustratos poliméricos y adhesivo de unión.The present invention, as expressed in the set forth in this specification, refers to a process of glued to polymeric substrates or substrates and adhesive Union.

El proceso tiene como objetivo proporcionar una unión segura y firme a la baldosa sobre el respectivo soporte o sustrato polimérico. Su aplicación es para el revestimiento de suelos.The process aims to provide a secure and firm connection to the tile on the respective support or polymeric substrate. Its application is for the coating of floors.

Además, otro objetivo de la invención es que la unión se mantenga aún cuando exista humedad, extremo este que en los sistemas actuales de pegado no es posible.In addition, another object of the invention is that the union is maintained even when there is moisture, this end that in Current gluing systems is not possible.

La composición del adhesivo de unión también es novedad.The composition of the bonding adhesive is also novelty.

Antecedentes de la invenciónBackground of the invention

En la actualidad se presenta un serio problema en los sistemas de producción, que es la incompatibilidad de los adhesivos a la humedad que puedan tener las baldosas, así como en la posterior colocación y uso final del mismo, de manera que aún consiguiendo una unión correcta de las baldosas sobre los soportes, cuando aparece la humedad se produce el despegado y separación de las baldosas.Currently there is a serious problem in production systems, which is the incompatibility of moisture adhesives that tiles may have, as well as in the subsequent placement and final use of it, so that still getting a correct union of the tiles on the supports, when moisture appears the detachment and separation of the tiles.

Cuando apareció este sistema de pavimentación determinado por la combinación de baldosas y soportes poliméricos unidos mediante adhesivo, esta fuerte introducción inicial en el mercado se vio frenada por la baja calidad de la unión o pegado entre el sustrato o base de material polimérico y la baldosa, que se traduce en continuas reclamaciones de los clientes que han optado por este suelo.When this paving system appeared determined by the combination of tiles and polymeric supports attached by adhesive, this strong initial introduction into the market was slowed by the poor quality of the union or stuck between the substrate or base of polymeric material and the tile, which translates into continuous claims from customers who have opted for this floor

La Patente de Invención de solicitud internacional WO 03/040491 consiste en un suelo del tipo que se describe en la invención, pero que tiene problemas en el acoplamiento machi-hembrado de los conjuntos de baldosas y soportes, presentando también problemas de adherencia entre baldosa y soporte, sobre todo cuando aparece la humedad.Patent Application Invention International WO 03/040491 consists of a floor of the type that described in the invention, but having problems in the machi-female coupling of the sets of tiles and supports, also presenting adhesion problems between tile and support, especially when moisture appears.

Descripción de la invenciónDescription of the invention

Con el fin de alcanzar los objetivos y evitar los inconvenientes mencionados en los apartados anteriores, la invención propone un proceso de pegado de baldosas a soportes o sustratos poliméricos en el que se combinan dos técnicas que resuelven el problema de la adherencia del sustrato polimérico sobre las baldosas, aún en el caso desfavorable cuando éstas tengan agua retenida, e incluso aunque absorban esa humedad después del pegado.In order to achieve the objectives and avoid the drawbacks mentioned in the previous sections, the invention proposes a process of bonding tiles to supports or polymeric substrates in which two techniques are combined that solve the problem of adhesion of the polymeric substrate on the tiles, even in the unfavorable case when they have water retained, and even if they absorb that moisture after glued.

Se caracteriza porque comprende la combinación de una fase de flameado del soporte polimérico y unas fases posteriores en las que se aplica un adhesivo igualmente polimérico que presenta la ventaja de ser compatible con la humedad, consiguiéndose con ello la unión de las baldosas, aunque éstas tengan humedad y el soporte previamente fla-
meado.
It is characterized in that it comprises the combination of a flaming phase of the polymeric support and some later phases in which an equally polymeric adhesive is applied that has the advantage of being compatible with moisture, thereby achieving the union of the tiles, even if they have moisture and support previously fla-
piss

Así pues, el proceso de la invención incluye las siguientes fases o etapas:Thus, the process of the invention includes the  following phases or stages:

--
Una primera etapa de flameado del soporte polimérico.A first stage of flaming of the polymeric support.

--
Una segunda etapa de presecado de las baldosas, esencialmente en un horno, aunque también el secado se podría llevar a cabo con otros medios adecuados.A second stage of presecado of the tiles, essentially in a oven, although drying could also be carried out with others adequate means.

En cualquier caso se trata de conseguir una temperatura general de las baldosas entre unos valores aproximados entre 25ºC y 30ºC, y sin restos de agua y humedad en la superficie de la baldosa sobre la que se adherirá el soporte polimérico. Esos valores de temperatura podrían ser otros, tanto mayores como menores según las necesidades.In any case it's about getting a general temperature of the tiles between approximate values between 25ºC and 30ºC, and no water and moisture remains on the surface of the tile on which the polymeric support will adhere. Those temperature values could be others, both higher and lower according to the needs.

--
Una tercera etapa de aplicación del adhesivo. Se puede aplicar tanto en el soporte como en la baldosa simultáneamente, o solamente en uno de esos dos elementos principales.A third stage of adhesive application. It can be applied both in the support as in the tile simultaneously, or only in one of those two main elements.

--
Una cuarta etapa que consiste en un apilado de cada conjunto de baldosa y soporte polimérico sobre una base soporte que asegure una unión estática durante el tiempo de polimerización del adhesivo, además de mantener una presión uniforme que asegure una unión más perfecta.A fourth stage consisting of a stack of each tile set and polymeric support on a support base that ensures a joint static during the polymerization time of the adhesive, in addition to maintain a uniform pressure that ensures more bonding perfect

--
Una quinta etapa de secado manteniendo los conjuntos de baldosa y soporte polimérico en las bases soporte, durante al menos 2 horas a una temperatura aproximada entre 40ºC y 60ºC.A fifth stage of drying keeping the tile sets and polymeric support in the support bases, for at least 2 hours at an approximate temperature between 40ºC and 60ºC.

--
Una sexta etapa de selección y embalaje de las piezas.A sixth stage of selection and packaging of the pieces.

El flameado es un proceso conocido en el campo de los materiales poliméricos. Consiste en la aplicación de una llama oxidante a 10/15 cm de la superficie del plástico a una velocidad que oscila entre 5 y 40 m/minuto, con el fin de polarizar la superficie, generar radicales libres, lo que permite una buena adherencia en superficies que antes no la tenían.Flaming is a known process in the field of polymeric materials. It consists in the application of a oxidizing flame 10/15 cm from the surface of the plastic at a speed that oscillates between 5 and 40 m / minute, in order to polarize the surface, generate free radicals, which allows a good adhesion on surfaces that did not have it before.

El adhesivo se caracteriza porque consiste en un producto y componente tipo epoxy-poliaminoamida.The adhesive is characterized in that it consists of a  product and component type epoxy-polyaminoamide.

Descripción de la forma de realización preferidaDescription of the preferred embodiment

El proceso de pegado de baldosas a soportes o sustratos poliméricos comprende una primera etapa de flameado del soporte polimérico, una segunda etapa de calentamiento de las baldosas hasta alcanzar una temperatura entre 25ºC y 30ºC, asegurándose así la eliminación de restos de agua, al menos sobre la superficie de la baldosa que se unirá después al soporte polimérico respectivo.The process of bonding tiles to supports or polymeric substrates comprises a first flaming stage of the polymeric support, a second stage of heating the tiles until reaching a temperature between 25ºC and 30ºC, thus ensuring the elimination of traces of water, at least on the surface of the tile that will then be attached to the support respective polymer.

En una etapa posterior se aplica el adhesivo y se unen las dos piezas (baldosa y soporte polimérico) por sus caras enfrentadas.At a later stage the adhesive is applied and the two pieces (tile and polymeric support) are joined by their faces faced.

A continuación se colocará cada conjunto unido de baldosa y soporte polimérico sobre una base soporte que asegure una unión estática durante el tiempo preciso de polimerización del adhesivo, además de mantener una presión uniforme.Each set will be placed next of tile and polymeric support on a support base that ensures a static bond during the precise polymerization time of the adhesive, in addition to maintaining a uniform pressure.

Después se procede al secado de los conjuntos de baldosa y soporte polimérico manteniéndolos en las bases soporte durante al menos 2 horas a una temperatura aproximada de 50ºC.Then the drying of the sets of  tile and polymeric support keeping them in the support bases for at least 2 hours at an approximate temperature of 50 ° C.

El adhesivo utilizado es un producto bicomponente, epoxy-poliaminoamida formado por una primera parte y una segunda parte.The adhesive used is a product bicomponent, epoxy-polyaminoamide formed by a First part and a second part.

La primera parte es un compuesto de la siguiente composición:The first part is a compound of the following composition:

--
Resina epoxy de PM < 700.Resin PM epoxy <700.

--
Diluyente reactivo funcional, con funcionalidad epoxy, resultado de la reacción de la epicloridina y un alcohol.Functional reactive diluent, with epoxy functionality, result of the reaction of epichloridine and an alcohol

--
Cargas inertes.Loads inert

--
Aditivos (reológicos y antiespumantes).Additives (rheological and defoamers).

--
Colorantes.Dyes.

La segunda parte del producto bicomponente es un compuesto de la siguiente composición:The second part of the bicomponent product is a  compound of the following composition:

--
Poliaminoamida con funcionalidad amínica (-NH).Polyaminoamide with amine functionality (-NH).

--
Cargas inertes.Loads inert

--
Aditivos (reológicos y antiespumantes).Additives (rheological and defoamers).

--
Colorantes.Dyes.

Claims (8)

1. Proceso de pegado de baldosas a soportes o sustratos poliméricos, que estando destinado para unir mediante un adhesivo baldosas por su cara inferior sobre respectivos soportes poliméricos, se caracteriza porque comprende:1. Process of bonding tiles to polymeric substrates or substrates, which being destined to bond by means of an adhesive tile by its lower face on respective polymeric supports, is characterized in that it comprises:
--
una primera etapa en la que se realiza un flameado del soporte polimérico;a first stage in which a flaming of the support is performed polymeric;
--
una segunda etapa de presecado de las baldosas a una temperatura óptima, eliminándose cualquier resto de humedad y agua al menos sobre la superficie inferior de adherencia de las baldosas;a second stage of drying of the tiles at an optimum temperature, removing any remaining moisture and water at least on the lower surface of tile adhesion;
--
una tercera etapa de aplicación del adhesivo sobre al menos una de las dos caras enfrentadas de las baldosas y soportes poliméricos;a third stage of application of the adhesive on at least one of the two facing faces of the tiles and supports polymeric;
--
una cuarta etapa donde se colocan los conjuntos de baldosa y soporte polimérico, sobre respectivas bases soporte de forma estática durante un espacio de tiempo de polimerización del adhesivo manteniendo además una presión constante;a fourth stage where tile and support assemblies are placed polymeric, on respective support bases in a static way during a period of polymerization time of the adhesive also maintaining a constant pressure;
--
una quinta etapa de secado de los conjuntos de baldosa y soporte polimérico, durante al menos un espacio de tiempo de 2 horas a una temperatura determinada.a fifth stage of drying of tile and support assemblies polymeric, for at least a period of 2 hours at a time set temperature
2. Proceso de pegado de baldosas a soportes o sustratos poliméricos, según reivindicación 1, caracterizado porque la temperatura óptima del presecado de las baldosas se encuentra esencialmente entre 25ºC y 30ºC.2. Process of bonding tiles to polymeric substrates or substrates, according to claim 1, characterized in that the optimum temperature of the drying of the tiles is essentially between 25 ° C and 30 ° C. 3. Proceso de pegado de baldosas a soportes o sustratos poliméricos, según una cualquiera de las reivindicaciones anteriores, caracterizado porque el presecado de las baldosas se realiza esencialmente en un horno.3. Process of bonding tiles to supports or polymeric substrates, according to any one of the preceding claims, characterized in that the drying of the tiles is carried out essentially in an oven. 4. Proceso de pegado de baldosas a soportes o sustratos poliméricos, según una cualquiera de las reivindicaciones anteriores, caracterizado porque el adhesivo se aplica sobre la cara inferior de las baldosas.4. Process of bonding tiles to supports or polymeric substrates, according to any one of the preceding claims, characterized in that the adhesive is applied on the underside of the tiles. 5. Proceso de pegado de baldosas a soportes o sustratos poliméricos, según una cualquiera de las reivindicaciones 1 a 3, caracterizado porque el adhesivo se aplica sobre los soportes poliméricos.5. Process of bonding tiles to polymeric substrates or substrates, according to any one of claims 1 to 3, characterized in that the adhesive is applied on the polymeric supports. 6. Proceso de pegado de baldosas a soportes o sustratos poliméricos, según una cualquiera de las reivindicaciones 1 a 3, caracterizado porque el adhesivo se aplica sobre la cara inferior de las baldosas y también sobre la cara superior de los soportes poliméricos.6. Process of bonding tiles to polymeric substrates or substrates, according to any one of claims 1 to 3, characterized in that the adhesive is applied on the lower face of the tiles and also on the upper face of the polymeric supports. 7. Proceso de pegado de baldosas a soportes o sustratos poliméricos, según una cualquiera de las reivindicaciones anteriores, caracterizado porque la temperatura de secado del conjunto de las baldosas y soportes poliméricos ronda los 40ºC a 60ºC.7. Process of bonding tiles to supports or polymeric substrates, according to any one of the preceding claims, characterized in that the drying temperature of the set of tiles and polymeric supports is around 40 ° C to 60 ° C. 8. Adhesivo utilizado en el proceso de pegado de baldosas a soportes o sustratos poliméricos, esencialmente caracterizado porque consiste en un producto bicomponente, epoxy-poliaminoamida formado por dos compuestos.8. Adhesive used in the process of bonding tiles to supports or polymeric substrates, essentially characterized in that it consists of a two-component product, epoxy-polyaminoamide formed by two compounds.
ES200501206A 2005-05-18 2005-05-18 Tile bonding process comprises a stage which takes flamed the polymeric support, pre-drying of the tiles at optimal temperature, and adhesive application on the two sides facing tile and polymeric supports Pending ES2263384A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
ES200501206A ES2263384A1 (en) 2005-05-18 2005-05-18 Tile bonding process comprises a stage which takes flamed the polymeric support, pre-drying of the tiles at optimal temperature, and adhesive application on the two sides facing tile and polymeric supports

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES200501206A ES2263384A1 (en) 2005-05-18 2005-05-18 Tile bonding process comprises a stage which takes flamed the polymeric support, pre-drying of the tiles at optimal temperature, and adhesive application on the two sides facing tile and polymeric supports

Publications (1)

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ES2263384A1 true ES2263384A1 (en) 2006-12-01

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ES200501206A Pending ES2263384A1 (en) 2005-05-18 2005-05-18 Tile bonding process comprises a stage which takes flamed the polymeric support, pre-drying of the tiles at optimal temperature, and adhesive application on the two sides facing tile and polymeric supports

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3140566A (en) * 1960-08-09 1964-07-14 Tile Council Of America Adhesive compositions
US3311515A (en) * 1963-10-18 1967-03-28 Tile Council Of America Thixotropic, non-flowing adhesive bonding and jointing compositions and methods of bonding ceramic tiles to substrates using thixotropic, non-flowing adhesive bonding and jointing compositions
JPH0295846A (en) * 1988-09-30 1990-04-06 Sekaicho Rubber Co Ltd Ceramic tile mat
JPH03230950A (en) * 1990-02-02 1991-10-14 Hanamoto Kk Bonding method of laminated material for building material
ES2145155T3 (en) * 1994-09-13 2000-07-01 Perga Plastic Gmbh USE OF A PLASTIC SHEET THAT CAN BE APPLIED DURING THE PERFORMANCE OF PAINT APPLICATION WORK ON A SURFACE BASED TO TREAT WITH PAINT AS A COATING MEANS TO DEFINE THE SURFACE.

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3140566A (en) * 1960-08-09 1964-07-14 Tile Council Of America Adhesive compositions
US3311515A (en) * 1963-10-18 1967-03-28 Tile Council Of America Thixotropic, non-flowing adhesive bonding and jointing compositions and methods of bonding ceramic tiles to substrates using thixotropic, non-flowing adhesive bonding and jointing compositions
JPH0295846A (en) * 1988-09-30 1990-04-06 Sekaicho Rubber Co Ltd Ceramic tile mat
JPH03230950A (en) * 1990-02-02 1991-10-14 Hanamoto Kk Bonding method of laminated material for building material
ES2145155T3 (en) * 1994-09-13 2000-07-01 Perga Plastic Gmbh USE OF A PLASTIC SHEET THAT CAN BE APPLIED DURING THE PERFORMANCE OF PAINT APPLICATION WORK ON A SURFACE BASED TO TREAT WITH PAINT AS A COATING MEANS TO DEFINE THE SURFACE.

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