ES2207394A1 - Heat dissipation device e.g. heat sink for e.g. semiconductor components for electronic device has thermally conductive elements, which are disposed between heat exchanger element and heat transfer plate - Google Patents

Abstract

The heat dissipation device (1) has heat transfer plates (2a,2b) for fixing e.g. the semiconductor component, and heat exchanger elements (3), which are arranged in a plane substantially parallel to the plane of contact of the semiconductor component with the heat transfer plates. Thermally conductive elements (4) are disposed between the heat exchanger element and the heat transfer plate. The heat transfer plate and heat exchanger elements are aluminum laminate.

Description

Device for heat dissipation, in Special for semiconductor components or components Similar.

The present invention relates to a device heat sink, with particular application to components semiconductors or similar components.

Background of the invention

Devices for dissipation of heat, especially for semiconductor components or components similar, comprising at least one transfer plate of heat to which the semiconductor component is attached or similar, and at least one heat exchanger element, such as fins, usually based on extruded aluminum, attached to a motherboard, separated from each other, and protruding from said base plate perpendicular or inclined, forming a certain angle with her.

It is known that the main flow of the circuit Heat sink heat is parallel to the plane above the that the semiconductor component is found, since in this plane The thermal resistance is lower. So, the elements heat exchangers, or fins, are arranged in direction perpendicular or inclined with respect to the cited plane previously, and at a certain distance from each other.

A highlight of any heatsink of Heat is the surface of the exchangers or fins. A greater surface of fins means a greater yield of refrigeration. The current designs that exist in the market, they have the main drawback that to obtain a greater surface you have to work with high fins that take up space in the box, closet or "rack" equipment container electronic.

The main drawback presented by currently known devices is the difficulty of improving the cooling performance per unit volume.

The increase in area per unit volume can be solved by providing a greater number of exchangers or fins, separated at close range, which forces to work with small fin thicknesses. Nevertheless, the manufacture of a cooling body with small fins thickness is a high cost, so manufacturing is low profitable.

On the other hand, the heatsinks that exist in the market are little flexible to the regulation of load loss of air flow, an important aspect in cases where the device uses forced ventilation. In these cases it is necessary apply relatively fin height construction forms large and relatively small thickness.

The thermal resistance of a circuit is proportional to the distance to travel between the area where generates heat and heat dissipation points (elements heat exchangers or fins). Known heatsinks feature fins arranged substantially perpendicular to the plate heat transfer base or flat on which it is arranged The heat generating element. However, said heatsinks they have a high distance between the area where the heat and dissipation points, assuming high thermal resistance

Description of the invention

With the device for heat dissipation you They manage to solve the aforementioned problems and solve other problems. drawbacks described below.

The device for heat dissipation, object of the invention, is characterized by the fact that the at least one heat exchanger element is arranged in a plane substantially parallel to the contact plane of the component semiconductor with the heat transfer plate, and by the fact that it comprises at least one thermal conductive element arranged between the at least one heat exchanger element and the heat transfer plate, and in case you understand more than one heat exchanger element, enter at least two heat exchangers.

Thanks to these features, the flow main thermal circuit is perpendicular to the plane of semiconductor component contact with transfer plate of heat In this way, the distance between the areas where find semiconductor or similar components and zones Heat dissipation (exchange elements) is much lower to that of conventional heatsinks. This fact implies a minor thermal resistance of the circuit and, consequently, greater heatsink cooling performance per unit of volume.

In the same way, the disposition of the heat exchangers, substantially parallel to the contact plane of the semiconductor component with the heat transfer plate, facilitates the location of the heatsink in the box, closet or rack of the equipment container electronic, taking up less space than heatsinks conventional.

In cases where the use of forced ventilation, the device features of the The present invention greatly facilitates the regulation of loss of air flow load, since it can be modified easily the distance between the exchange elements of hot.

Preferably, the at least one element thermal conductor is arranged in the zone or zones of the heat transfer plates where the semiconductor components or the like. Thanks to this feature, a device of the present invention enables the cooling of several semiconductor components or the like, located anywhere on the plate (s).

Advantageously, at least one end of the Thermal conductive element has an aerodynamic profile. Of this mode reduces the loss of air flow load, in cases in which the use of forced ventilation is necessary.

In a preferred embodiment, the device comprises, between the heat transfer plate and the component semiconductor or similar, an intermediate adapter element fixed to The heat transfer plate.

Preferably the plate or plates of transfer, exchange element or elements of heat and the thermal conductor (s) are made of aluminum laminate.

This material has the advantage over the extruded aluminum, of which its uniform crystalline structure is better heat conductor than extruded aluminum. In addition, the Use of this material facilitates the manufacture of devices heat sinks with varied shapes and dimensions, which It is also cheaper.

Brief description of the drawings

For greater understanding of how much has been exposed some drawings are accompanied in which, schematically and only to non-limiting example title, two practical cases are represented of realization, in which:

Figure 1 is a perspective view of a first preferred embodiment of the dissipation device of heat of the invention;

Figure 2 is a perspective view of a exploded set of heat dissipation device represented in figure 1;

Figure 3 is a perspective view of a second preferred embodiment of the dissipation device of heat of the invention, and;

Figure 4 is a detail view of the section of the device of figure 3.

Description of preferred embodiments

As can be seen in figures 1 and 2 of the present invention, the device for heat dissipation for semiconductor components or similar components 1, it is consisting of two heat transfer plates 2a, 2b, which they cover the entire container box of the electronic equipment, on the that semiconductor components are fixed. Between these two transfer plates 2a, 2b are two aluminum plates laminate 3 that act as heat exchangers and a plurality of flat pieces 4 that exercise the function of thermal conductive elements, arranged between every two elements heat exchangers 3, and between heat transfer plates 2a , 2b and an exchange element 3.

The plates 3 are arranged parallel to the plane of the transfer plates 2a, 2b. Is arrangement of heat exchanger plates 3 allows the location of the heat sink device 1 in the central part of the box, closet or "rack" container of electronic equipment, taking up very little space.

The thermal conductive elements 4 are arranged on the heat transfer plate areas where the components to be refrigerated will be placed. In this way, the device of the present invention enables cooling of several semiconductor components or the like.

As can be seen, one of the 4a ends of the thermal conductive elements 4 has an aerodynamic profile, suitable for use with forced ventilation, since it allows decrease the loss of air flow load during refrigeration, due to the creation of turbulence.

Figure 3 shows several components semiconductors or the like 5 coupled to the device heat dissipation 6. As can be seen with greater detail in figure 4, the semiconductor components 5 are arranged on intermediate adapter elements 7 that facilitate fixing to the heat transfer plate 8. The elements thermal conductors 9 are arranged between every two elements exchangers 10, and between the face of the transfer plate 8, opposite to that of semiconductor components, and an element exchanger

Claims (5)

1. Device for heat dissipation (1, 6), especially for semiconductor components or similar components (5), comprising at least one heat transfer plate (2a, 2b, 8) to which the semiconductor component or the like (5), and at least one heat exchanger element (3, 10), characterized in that the at least one heat exchanger element (3, 10) is arranged in a substantially parallel plane to the contact plane of the semiconductor component (5) with the heat transfer plate (2a, 2b, 8), and by the fact that it comprises at least one thermal conductive element (4, 9) disposed between the at least a heat exchanger element (3, 10) and the heat transfer plate (2a, 2b, 8) and, in case it comprises more than one heat exchanger element (3, 10), enter at least two heat exchangers (3, 10). 2. Device (1.6) according to claim 1, characterized in that the at least one thermal conductive element (4, 9) is arranged in the areas of the heat transfer plate (2a, 2b, 8 ) where the semiconductor components or the like are found (5). 3. Device (1, 6) according to claim 2, characterized in that at least one end 4a of the thermal conductive element (4, 9) has an aerodynamic profile. Device (1, 6) according to claim 1, characterized in that it comprises between the heat transfer plate (8) and the semiconductor component or the like (5), an intermediate adapter element (7) fixed to the heat transfer plate (8). Device (1.6) according to claim 1, characterized in that the heat transfer plate (2a, 2b, 8), the thermal conductive elements or element (4, 9) and the elements or Heat exchanger element (3, 10), are laminated aluminum.