ES2110948T3 - Contacto de alimentacion de energia a un circuito integrado. - Google Patents
Contacto de alimentacion de energia a un circuito integrado.Info
- Publication number
- ES2110948T3 ES2110948T3 ES89309221T ES89309221T ES2110948T3 ES 2110948 T3 ES2110948 T3 ES 2110948T3 ES 89309221 T ES89309221 T ES 89309221T ES 89309221 T ES89309221 T ES 89309221T ES 2110948 T3 ES2110948 T3 ES 2110948T3
- Authority
- ES
- Spain
- Prior art keywords
- power supply
- integrated circuit
- substrate
- supply contact
- epitaxial layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/4824—Pads with extended contours, e.g. grid structure, branch structure, finger structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
- H01L23/5286—Arrangements of power or ground buses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Bipolar Transistors (AREA)
Abstract
UN CIRCUITO INTEGRADO FORMADO EN UN SUSTRATO TIENE TRANSISTORES DE EFECTO DE CAMPO CONFORMADOS EN UNA CAPA EPITAXIAL RELATIVAMENTE IMPURIFICADA (ES DECIR, CON ALTA RESISTIVIDAD), TIPICAMENTE EN UN "TUBO" FORMADO EN LA MISMA. LA CORRIENTE DE FUNCIONAMIENTO PARA LOS TRANSISTORES DE PROPORCIONA AL MENOS EN PARTE A TRAVES DE UNA CAPA METALICA SITUADA EN LA PARTE TRASERA DEL SUSTRATO. SORPRENDENTEMENTE, LA CONDUCTIVIDAD ES SUFICIENTEMENTE ALTA A TRAVES DE LA CAPA EPITAXIAL Y EL SUSTRATO QUE EL NUMERO DE ZONAS DE UNION EN LA PARTE FRONTAL PUEDE REDUCIRSE, O ELIMINARSE COMPLETAMENTE EN ALGUNOS CASOS. ADEMAS SE OBTIENE UNA REDUCCION EN LA INDUCTANCIA DE CONDUCCION DE LA FUENTE DE ALIMENTACION, REDUCIENDO LOS PROBLEMAS DEL SALTO A TIERRA Y DE OSCILACION
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/246,713 US4947228A (en) | 1988-09-20 | 1988-09-20 | Integrated circuit power supply contact |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2110948T3 true ES2110948T3 (es) | 1998-03-01 |
Family
ID=22931887
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES89309221T Expired - Lifetime ES2110948T3 (es) | 1988-09-20 | 1989-09-12 | Contacto de alimentacion de energia a un circuito integrado. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4947228A (es) |
EP (1) | EP0360477B1 (es) |
JP (1) | JP2738416B2 (es) |
DE (1) | DE68928483T2 (es) |
ES (1) | ES2110948T3 (es) |
HK (1) | HK1002542A1 (es) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5181094A (en) * | 1988-09-29 | 1993-01-19 | Mitsubishi Denki Kabushiki Kaisha | Complementary semiconductor device having improved device isolating region |
US5574633A (en) * | 1994-02-23 | 1996-11-12 | At&T Global Information Solubions Company | Multi-phase charge sharing method and apparatus |
US5985724A (en) * | 1996-10-01 | 1999-11-16 | Advanced Micro Devices, Inc. | Method for forming asymmetrical p-channel transistor having nitrided oxide patterned to selectively form a sidewall spacer |
US5877930A (en) * | 1997-03-27 | 1999-03-02 | Digital Equipment Corporation | Input and output noise reduction circuit |
US5970347A (en) * | 1997-07-18 | 1999-10-19 | Advanced Micro Devices, Inc. | High performance mosfet transistor fabrication technique |
US6794978B2 (en) * | 2002-05-15 | 2004-09-21 | John C. Tung | Accurate multi-ground inductors for high-speed integrated circuits |
US7400047B2 (en) * | 2004-12-13 | 2008-07-15 | Agere Systems Inc. | Integrated circuit with stacked-die configuration utilizing substrate conduction |
US8159809B2 (en) * | 2007-12-07 | 2012-04-17 | METAMEMS Corp. | Reconfigurable system that exchanges substrates using coulomb forces to optimize a parameter |
US8018009B2 (en) * | 2007-12-07 | 2011-09-13 | METAMEMS Corp. | Forming large planar structures from substrates using edge Coulomb forces |
US7812336B2 (en) * | 2007-12-07 | 2010-10-12 | METAMEMS Corp. | Levitating substrate being charged by a non-volatile device and powered by a charged capacitor or bonding wire |
US7965489B2 (en) * | 2007-12-07 | 2011-06-21 | METAMEMS Corp. | Using coulomb forces to form 3-D reconfigurable antenna structures |
US8008070B2 (en) * | 2007-12-07 | 2011-08-30 | METAMEMS Corp. | Using coulomb forces to study charateristics of fluids and biological samples |
US8531848B2 (en) * | 2007-12-07 | 2013-09-10 | METAMEMS Corp. | Coulomb island and Faraday shield used to create adjustable Coulomb forces |
US7728427B2 (en) * | 2007-12-07 | 2010-06-01 | Lctank Llc | Assembling stacked substrates that can form cylindrical inductors and adjustable transformers |
US7946174B2 (en) * | 2007-12-07 | 2011-05-24 | METAMEMS Corp. | Decelerometer formed by levitating a substrate into equilibrium |
US7863651B2 (en) | 2007-12-07 | 2011-01-04 | METAMEMS Corp. | Using multiple coulomb islands to reduce voltage stress |
US20090149038A1 (en) * | 2007-12-07 | 2009-06-11 | Metamems Llc | Forming edge metallic contacts and using coulomb forces to improve ohmic contact |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57162360A (en) * | 1981-03-31 | 1982-10-06 | Nec Corp | Complementary insulated gate field effect semiconductor device |
JPS58157151A (ja) * | 1982-03-15 | 1983-09-19 | Mitsubishi Electric Corp | 半導体集積回路装置 |
EP0117867A4 (en) * | 1982-08-26 | 1985-04-23 | Mitsubishi Electric Corp | SEMICONDUCTOR ARRANGEMENT. |
US4572972A (en) * | 1983-01-18 | 1986-02-25 | At&T Laboratories | CMOS Logic circuits with all pull-up transistors integrated in separate chip from all pull-down transistors |
JPS60152055A (ja) * | 1984-01-20 | 1985-08-10 | Matsushita Electric Ind Co Ltd | 相補型mos半導体装置 |
US4631570A (en) * | 1984-07-03 | 1986-12-23 | Motorola, Inc. | Integrated circuit having buried oxide isolation and low resistivity substrate for power supply interconnection |
US4675717A (en) * | 1984-10-09 | 1987-06-23 | American Telephone And Telegraph Company, At&T Bell Laboratories | Water-scale-integrated assembly |
JPS62286268A (ja) * | 1986-06-04 | 1987-12-12 | Sharp Corp | 半導体集積回路装置 |
-
1988
- 1988-09-20 US US07/246,713 patent/US4947228A/en not_active Expired - Lifetime
-
1989
- 1989-09-12 EP EP89309221A patent/EP0360477B1/en not_active Expired - Lifetime
- 1989-09-12 DE DE68928483T patent/DE68928483T2/de not_active Expired - Fee Related
- 1989-09-12 ES ES89309221T patent/ES2110948T3/es not_active Expired - Lifetime
- 1989-09-20 JP JP1242389A patent/JP2738416B2/ja not_active Expired - Lifetime
-
1998
- 1998-02-26 HK HK98101488A patent/HK1002542A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0360477A2 (en) | 1990-03-28 |
EP0360477B1 (en) | 1997-12-10 |
EP0360477A3 (en) | 1991-11-21 |
DE68928483T2 (de) | 1998-04-02 |
US4947228A (en) | 1990-08-07 |
DE68928483D1 (de) | 1998-01-22 |
HK1002542A1 (en) | 1998-08-28 |
JPH02114661A (ja) | 1990-04-26 |
JP2738416B2 (ja) | 1998-04-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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