ES2108229T3 - Revestimiento de un recipiente para la manipulacion de metales fundidos. - Google Patents
Revestimiento de un recipiente para la manipulacion de metales fundidos.Info
- Publication number
- ES2108229T3 ES2108229T3 ES93305726T ES93305726T ES2108229T3 ES 2108229 T3 ES2108229 T3 ES 2108229T3 ES 93305726 T ES93305726 T ES 93305726T ES 93305726 T ES93305726 T ES 93305726T ES 2108229 T3 ES2108229 T3 ES 2108229T3
- Authority
- ES
- Spain
- Prior art keywords
- flooring
- reusable
- coating
- training device
- cast metals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
- 
        - B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D41/00—Casting melt-holding vessels, e.g. ladles, tundishes, cups or the like
- B22D41/02—Linings
 
- 
        - B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D41/00—Casting melt-holding vessels, e.g. ladles, tundishes, cups or the like
- B22D41/02—Linings
- B22D41/023—Apparatus used for making or repairing linings
 
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Furnace Housings, Linings, Walls, And Ceilings (AREA)
- Casting Support Devices, Ladles, And Melt Control Thereby (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| GB929216079A GB9216079D0 (en) | 1992-07-28 | 1992-07-28 | Lining of molten metal handling vessel | 
Publications (1)
| Publication Number | Publication Date | 
|---|---|
| ES2108229T3 true ES2108229T3 (es) | 1997-12-16 | 
Family
ID=10719469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| ES93305726T Expired - Lifetime ES2108229T3 (es) | 1992-07-28 | 1993-07-21 | Revestimiento de un recipiente para la manipulacion de metales fundidos. | 
Country Status (13)
| Country | Link | 
|---|---|
| US (1) | US5360200A (en:Method) | 
| EP (1) | EP0581516B1 (en:Method) | 
| JP (1) | JP3197697B2 (en:Method) | 
| KR (1) | KR100267453B1 (en:Method) | 
| AU (1) | AU660556B2 (en:Method) | 
| BR (1) | BR9303019A (en:Method) | 
| CA (1) | CA2101513C (en:Method) | 
| DE (1) | DE69314406T2 (en:Method) | 
| ES (1) | ES2108229T3 (en:Method) | 
| FI (1) | FI101052B (en:Method) | 
| GB (1) | GB9216079D0 (en:Method) | 
| MX (1) | MX9304527A (en:Method) | 
| TW (1) | TW258676B (en:Method) | 
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| US5484138A (en) * | 1993-11-22 | 1996-01-16 | Magneco/Metrel, Inc. | Consumable form with adjustable walls | 
| US6143981A (en) | 1998-06-24 | 2000-11-07 | Amkor Technology, Inc. | Plastic integrated circuit package and method and leadframe for making the package | 
| US6281568B1 (en) | 1998-10-21 | 2001-08-28 | Amkor Technology, Inc. | Plastic integrated circuit device package and leadframe having partially undercut leads and die pad | 
| US6580159B1 (en) | 1999-11-05 | 2003-06-17 | Amkor Technology, Inc. | Integrated circuit device packages and substrates for making the packages | 
| US6847103B1 (en) | 1999-11-09 | 2005-01-25 | Amkor Technology, Inc. | Semiconductor package with exposed die pad and body-locking leadframe | 
| US6476478B1 (en) | 1999-11-12 | 2002-11-05 | Amkor Technology, Inc. | Cavity semiconductor package with exposed leads and die pad | 
| KR20010081199A (ko) * | 2000-02-11 | 2001-08-29 | 이영숙 | 헬멧투시창의 쉴드 회동 및 인출 장치 | 
| KR100583494B1 (ko) | 2000-03-25 | 2006-05-24 | 앰코 테크놀로지 코리아 주식회사 | 반도체패키지 | 
| US7042068B2 (en) | 2000-04-27 | 2006-05-09 | Amkor Technology, Inc. | Leadframe and semiconductor package made using the leadframe | 
| KR20020058209A (ko) | 2000-12-29 | 2002-07-12 | 마이클 디. 오브라이언 | 반도체패키지 | 
| KR100731007B1 (ko) | 2001-01-15 | 2007-06-22 | 앰코 테크놀로지 코리아 주식회사 | 적층형 반도체 패키지 | 
| US6605865B2 (en) | 2001-03-19 | 2003-08-12 | Amkor Technology, Inc. | Semiconductor package with optimized leadframe bonding strength | 
| KR100369393B1 (ko) | 2001-03-27 | 2003-02-05 | 앰코 테크놀로지 코리아 주식회사 | 리드프레임 및 이를 이용한 반도체패키지와 그 제조 방법 | 
| KR100393448B1 (ko) | 2001-03-27 | 2003-08-02 | 앰코 테크놀로지 코리아 주식회사 | 반도체 패키지 및 그 제조 방법 | 
| US6756658B1 (en) | 2001-04-06 | 2004-06-29 | Amkor Technology, Inc. | Making two lead surface mounting high power microleadframe semiconductor packages | 
| US6611047B2 (en) | 2001-10-12 | 2003-08-26 | Amkor Technology, Inc. | Semiconductor package with singulation crease | 
| US6798046B1 (en) | 2002-01-22 | 2004-09-28 | Amkor Technology, Inc. | Semiconductor package including ring structure connected to leads with vertically downset inner ends | 
| US6885086B1 (en) | 2002-03-05 | 2005-04-26 | Amkor Technology, Inc. | Reduced copper lead frame for saw-singulated chip package | 
| US6608366B1 (en) | 2002-04-15 | 2003-08-19 | Harry J. Fogelson | Lead frame with plated end leads | 
| US6627977B1 (en) | 2002-05-09 | 2003-09-30 | Amkor Technology, Inc. | Semiconductor package including isolated ring structure | 
| US6905914B1 (en) | 2002-11-08 | 2005-06-14 | Amkor Technology, Inc. | Wafer level package and fabrication method | 
| US6847099B1 (en) | 2003-02-05 | 2005-01-25 | Amkor Technology Inc. | Offset etched corner leads for semiconductor package | 
| US20040159988A1 (en) * | 2003-02-11 | 2004-08-19 | Kotyuk Mark D. | Adjustable form | 
| US7611666B2 (en) * | 2008-02-07 | 2009-11-03 | North American Refractories Company | Tundish dry vibratable form | 
| US9691734B1 (en) | 2009-12-07 | 2017-06-27 | Amkor Technology, Inc. | Method of forming a plurality of electronic component packages | 
| CN102812319A (zh) * | 2009-12-10 | 2012-12-05 | 诺维尔里斯公司 | 具有流通通风的熔融金属容纳结构 | 
| US8552548B1 (en) | 2011-11-29 | 2013-10-08 | Amkor Technology, Inc. | Conductive pad on protruding through electrode semiconductor device | 
| US9704725B1 (en) | 2012-03-06 | 2017-07-11 | Amkor Technology, Inc. | Semiconductor device with leadframe configured to facilitate reduced burr formation | 
| WO2013185223A1 (en) * | 2012-06-14 | 2013-12-19 | Les Produits Industriels De Haute Temperature Pyrotek Inc. | Receptacle for handling molten metal, casting assembly and manufacturing method | 
| US9673122B2 (en) | 2014-05-02 | 2017-06-06 | Amkor Technology, Inc. | Micro lead frame structure having reinforcing portions and method | 
| TWI750205B (zh) * | 2016-08-24 | 2021-12-21 | 美商維蘇威美國公司 | 具有包覆的金屬層的冶金容器內襯及將熔融金屬之氧化縮減到最小的方法 | 
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| US939059A (en) * | 1908-08-20 | 1909-11-02 | George C Terry | Form of mold for concrete receptacles. | 
| US992652A (en) * | 1910-03-09 | 1911-05-16 | John F Glavin | Concrete-mold. | 
| US1161356A (en) * | 1914-11-02 | 1915-11-23 | Lyman C Stewart | Core for molds. | 
| GB1469513A (en) * | 1973-07-30 | 1977-04-06 | Foseco Trading Ag | Tundishes | 
| US3944193A (en) * | 1972-08-26 | 1976-03-16 | Nippon Steel Corporation | Method and apparatus for forming by vibration a refractory lining of a container for a molten metal | 
| US3955721A (en) * | 1974-09-12 | 1976-05-11 | Bate Micheal Donald | Expendable tundish liner | 
| GB1542962A (en) * | 1976-04-07 | 1979-03-28 | Foseco Trading Ag | Tundishes | 
| GB1540090A (en) * | 1976-04-07 | 1979-02-07 | Foseco Trading Ag | Tundishes | 
| JPS57184884A (en) * | 1981-05-08 | 1982-11-13 | Fuaizaa Kuiguree Kk | Protective layer for metallurgical vessel | 
| FI69259C (fi) * | 1982-02-09 | 1986-01-10 | Aikoh Co | Form foer blaosformning av infodringen i ett foer smaelt metall avsett kaerl infodringsfoerfarande i vilket naemnda form anvaends och infodringsblandning som anvaends vid naemnda infodringsfoerfarande | 
| JPS58221644A (ja) * | 1982-06-15 | 1983-12-23 | Tokyo Yogyo Co Ltd | タンデイツシユ内張保護材の施工法 | 
| US4589633A (en) * | 1984-01-26 | 1986-05-20 | Jacques Gilson | Process and installation for moulding a refractory lining of a container for liquid metal | 
| FR2657549B1 (fr) * | 1990-01-26 | 1992-04-24 | Daussan & Co | Procede pour appliquer sur les faces interieures d'un recipient metallurgique un revetement de protection comportant au moins deux couches et revetement de protection ainsi obtenu. | 
| GB9012677D0 (en) * | 1990-06-07 | 1990-08-01 | Foseco Int | Refractory composition | 
| GB9018205D0 (en) * | 1990-08-18 | 1990-10-03 | Foseco Int | Lining of metallurgical vessels | 
| DE4041610C1 (en) * | 1990-12-22 | 1992-02-20 | Intocast Gmbh Feuerfestprodukte Und Giesshilfsmittel, 4030 Ratingen, De | Prodn. of monolithic, refractory coating in metallurgical ladle - by lowering upright ladle into burner appts. having basket-like structure of pipes coated with burning medium and jets along their length | 
| US5110096A (en) * | 1991-02-15 | 1992-05-05 | Foseco International Limited | One-piece tundish lining | 
| GB2257779B (en) * | 1991-07-17 | 1995-05-17 | Foseco Int | Lining of metallurical vessels | 
- 
        1992
        - 1992-07-28 GB GB929216079A patent/GB9216079D0/en active Pending
 
- 
        1993
        - 1993-07-21 DE DE69314406T patent/DE69314406T2/de not_active Expired - Lifetime
- 1993-07-21 ES ES93305726T patent/ES2108229T3/es not_active Expired - Lifetime
- 1993-07-21 EP EP93305726A patent/EP0581516B1/en not_active Expired - Lifetime
- 1993-07-23 US US08/095,859 patent/US5360200A/en not_active Expired - Lifetime
- 1993-07-27 AU AU44233/93A patent/AU660556B2/en not_active Ceased
- 1993-07-27 JP JP20566393A patent/JP3197697B2/ja not_active Expired - Fee Related
- 1993-07-27 KR KR1019930014310A patent/KR100267453B1/ko not_active Expired - Fee Related
- 1993-07-27 MX MX9304527A patent/MX9304527A/es not_active IP Right Cessation
- 1993-07-28 FI FI933381A patent/FI101052B/fi active IP Right Grant
- 1993-07-28 BR BR9303019A patent/BR9303019A/pt not_active IP Right Cessation
- 1993-07-28 CA CA002101513A patent/CA2101513C/en not_active Expired - Fee Related
- 1993-08-03 TW TW082106181A patent/TW258676B/zh not_active IP Right Cessation
 
Also Published As
| Publication number | Publication date | 
|---|---|
| TW258676B (en:Method) | 1995-10-01 | 
| FI101052B (fi) | 1998-04-15 | 
| MX9304527A (es) | 1994-02-28 | 
| AU4423393A (en) | 1994-02-03 | 
| AU660556B2 (en) | 1995-06-29 | 
| CA2101513A1 (en) | 1994-01-29 | 
| JPH07232265A (ja) | 1995-09-05 | 
| GB9216079D0 (en) | 1992-09-09 | 
| DE69314406D1 (de) | 1997-11-13 | 
| EP0581516A1 (en) | 1994-02-02 | 
| KR100267453B1 (ko) | 2000-10-16 | 
| BR9303019A (pt) | 1994-03-15 | 
| EP0581516B1 (en) | 1997-10-08 | 
| FI933381A7 (fi) | 1994-01-29 | 
| DE69314406T2 (de) | 1998-05-07 | 
| CA2101513C (en) | 2000-01-25 | 
| JP3197697B2 (ja) | 2001-08-13 | 
| KR940001979A (ko) | 1994-02-16 | 
| FI933381A0 (fi) | 1993-07-28 | 
| US5360200A (en) | 1994-11-01 | 
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Legal Events
| Date | Code | Title | Description | 
|---|---|---|---|
| FG2A | Definitive protection | Ref document number: 581516 Country of ref document: ES |