ES2107010T3 - Sensor micromecanico. - Google Patents

Sensor micromecanico.

Info

Publication number
ES2107010T3
ES2107010T3 ES93906671T ES93906671T ES2107010T3 ES 2107010 T3 ES2107010 T3 ES 2107010T3 ES 93906671 T ES93906671 T ES 93906671T ES 93906671 T ES93906671 T ES 93906671T ES 2107010 T3 ES2107010 T3 ES 2107010T3
Authority
ES
Spain
Prior art keywords
sensing elements
sensing
outgoing
supported
substantially similar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES93906671T
Other languages
English (en)
Inventor
David Frank Moore
Andrew Charles Frederick Hoole
Alan Poplar Villas Heaver
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BTG International Ltd
Original Assignee
British Technology Group Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by British Technology Group Ltd filed Critical British Technology Group Ltd
Application granted granted Critical
Publication of ES2107010T3 publication Critical patent/ES2107010T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/0072—For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/14—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring distance or clearance between spaced objects or spaced apertures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)

Abstract

UN SENSOR MICROMECANICO TIENE UNA PLURALIDAD DE ELEMENTOS SENSORES (14A-14D) QUE ESTAN SOPORTADOS EN REGIONES DE SOPORTE RESPECTIVAS (12A-12D). UN PRIMER CONJUNTO DE ELEMENTOS SENSORES DEFINE UN HUECO SENSOR. EN UNA DISPOSICION ESTE ESTA DEFINIDO POR ELEMENTOS SENSORES SOPORTADOS POR REGIONES DE SOPORTE ADYACENTES. EN OTRA CONFORMACION EL HUECO SENSOR ESTA DEFINIDO ENTRE UN ELEMENTO SENSOR Y UN HAZ DE REFERENCIA FORMADO MEDIANTE LA CONEXION DE PATILLAS DE RETORNO DE DOS ELEMENTOS SENSORES DIAMETRALMENTE OPUESTOS. LOS ELEMENTOS SENSORES SON SUBSTANCIALMENTE SIMILARES ENTRE SI Y CADA UNO DE ELLOS COMPRENDE UNA PATILLA ALARGADA EXTERIOR QUE SE EXTIENDE DESDE SU REGION DE SOPORTE ASOCIADA Y UNA PATILLA DE RETORNO SUBSTANCIALMENTE PARALELA A LA PATILLA DE SALIDA QUE SE EXTIENDE HACIA LA REGION DE SOPORTE. DISPONIENDO ELEMENTOS SENSORES QUE SEAN SUBSTANCIALMENTE SIMILARES EN FORMA Y DISPOSICION, DE ESTA MANERA, SE MINIMIZAN LOS EFECTOS DE LA TENSION DE LA PELICULA FINA.
ES93906671T 1992-03-16 1993-03-15 Sensor micromecanico. Expired - Lifetime ES2107010T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB929205711A GB9205711D0 (en) 1992-03-16 1992-03-16 Micromechanical sensor

Publications (1)

Publication Number Publication Date
ES2107010T3 true ES2107010T3 (es) 1997-11-16

Family

ID=10712234

Family Applications (1)

Application Number Title Priority Date Filing Date
ES93906671T Expired - Lifetime ES2107010T3 (es) 1992-03-16 1993-03-15 Sensor micromecanico.

Country Status (7)

Country Link
EP (1) EP0632880B1 (es)
JP (1) JPH08504266A (es)
AT (1) ATE156907T1 (es)
DE (1) DE69313104T2 (es)
ES (1) ES2107010T3 (es)
GB (2) GB9205711D0 (es)
WO (1) WO1993019343A1 (es)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5658698A (en) * 1994-01-31 1997-08-19 Canon Kabushiki Kaisha Microstructure, process for manufacturing thereof and devices incorporating the same
DE4439238A1 (de) * 1994-11-03 1996-05-09 Telefunken Microelectron Kapazitiver Beschleunigungssensor
US5880369A (en) * 1996-03-15 1999-03-09 Analog Devices, Inc. Micromachined device with enhanced dimensional control
US6088463A (en) 1998-10-30 2000-07-11 Microtronic A/S Solid state silicon-based condenser microphone
US6829131B1 (en) 1999-09-13 2004-12-07 Carnegie Mellon University MEMS digital-to-acoustic transducer with error cancellation
WO2003017717A2 (en) 2001-08-17 2003-02-27 Carnegie Mellon University Method and apparatus for reconstruction of soundwaves from digital signals
US7142682B2 (en) 2002-12-20 2006-11-28 Sonion Mems A/S Silicon-based transducer for use in hearing instruments and listening devices
US7049051B2 (en) 2003-01-23 2006-05-23 Akustica, Inc. Process for forming and acoustically connecting structures on a substrate
US6936524B2 (en) 2003-11-05 2005-08-30 Akustica, Inc. Ultrathin form factor MEMS microphones and microspeakers

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4783237A (en) * 1983-12-01 1988-11-08 Harry E. Aine Solid state transducer and method of making same
FR2558263B1 (fr) * 1984-01-12 1986-04-25 Commissariat Energie Atomique Accelerometre directif et son procede de fabrication par microlithographie
US4953387A (en) * 1989-07-31 1990-09-04 The Regents Of The University Of Michigan Ultrathin-film gas detector
DE69113632T2 (de) * 1990-08-17 1996-03-21 Analog Devices Inc Monolithischer beschleunigungsmesser.

Also Published As

Publication number Publication date
WO1993019343A1 (en) 1993-09-30
GB9418784D0 (en) 1994-11-02
DE69313104T2 (de) 1997-12-11
EP0632880B1 (en) 1997-08-13
GB9205711D0 (en) 1992-04-29
DE69313104D1 (de) 1997-09-18
GB2280038A (en) 1995-01-18
JPH08504266A (ja) 1996-05-07
ATE156907T1 (de) 1997-08-15
EP0632880A1 (en) 1995-01-11
GB2280038B (en) 1995-11-22

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