ES2058512T3 - Sonda de video que alinea un objeto sobre el que se va a actuar. - Google Patents
Sonda de video que alinea un objeto sobre el que se va a actuar.Info
- Publication number
- ES2058512T3 ES2058512T3 ES89304037T ES89304037T ES2058512T3 ES 2058512 T3 ES2058512 T3 ES 2058512T3 ES 89304037 T ES89304037 T ES 89304037T ES 89304037 T ES89304037 T ES 89304037T ES 2058512 T3 ES2058512 T3 ES 2058512T3
- Authority
- ES
- Spain
- Prior art keywords
- acted
- act
- error signal
- video probe
- images
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000523 sample Substances 0.000 title 1
- 239000011159 matrix material Substances 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Image Processing (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
SISTEMA DE ALINEACION QUE INCLUYE UN OBJETO SOBRE EL QUE SE VA A ACTUAR EN UBICACIONES PREDETERMINADAS, COMO UNA PLACA DE CIRCUITO QUE RECIBE PASTA DE SOLDADURA. SE USA UN DISPOSITIVO, COMO PUEDE SER UNA MATRIZ CON UN MODELO CARACTERISTICO QUE ACTUA SOBRE EL OBJETO. SE PREPARA UN REGISTRADOR DE VIDEO (12, 13) DIRIGIDO AL DISPOSITIVO Y AL OBJETO PARA QUE PROPORCIONE SEÑALES DE IMAGENES REPRESENTATIVAS DE AMBOS. UN COMPARADOR SE ENCARGA DE COMPARAR LAS SEÑALES DE LAS IMAGENES A FIN DE OBTENER UNA SEÑAL DE ERROR REPRESENTATIVA DE LA DESALINEACION ENTRE EL DISPOSITIVO Y EL OBJETO. UN POSICIONADOR SENSIBLE A LA SEÑAL DE ERROR POSICIONA RELATIVAMENTE EL DISPOSITIVO Y EL OBJETO PARA REDUCIR EL ERROR. UN OPERADOR SE ENCARGA DE QUE EL DISPOSITIVO ACTUE SOBRE EL OBJETO EN LAS UBICACIONES PREDETERMINADAS.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/116,490 US4924304A (en) | 1987-11-02 | 1987-11-02 | Video probe aligning of object to be acted upon |
CA000596903A CA1320828C (en) | 1987-11-02 | 1989-04-17 | Aligning |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2058512T3 true ES2058512T3 (es) | 1994-11-01 |
Family
ID=25672625
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES89304037T Expired - Lifetime ES2058512T3 (es) | 1987-11-02 | 1989-04-24 | Sonda de video que alinea un objeto sobre el que se va a actuar. |
Country Status (4)
Country | Link |
---|---|
US (2) | US4924304A (es) |
EP (1) | EP0394568B1 (es) |
CA (1) | CA1320828C (es) |
ES (1) | ES2058512T3 (es) |
Families Citing this family (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2561166B2 (ja) * | 1990-03-26 | 1996-12-04 | 株式会社精工舎 | プリント基板の穴明け方法及びその装置 |
US5060063A (en) * | 1990-07-30 | 1991-10-22 | Mpm Corporation | Viewing and illuminating video probe with viewing means for simultaneously viewing object and device images along viewing axis and translating them along optical axis |
US5216804A (en) * | 1991-05-21 | 1993-06-08 | U.S. Philips Corp. | Method and device for placing a component on a printed circuit board |
US5794329A (en) * | 1995-02-27 | 1998-08-18 | Mpm Corporation | Support apparatus for circuit board |
US5669970A (en) * | 1995-06-02 | 1997-09-23 | Mpm Corporation | Stencil apparatus for applying solder paste |
JPH10128951A (ja) * | 1996-10-31 | 1998-05-19 | Sakurai Graphic Syst:Kk | スクリーン式印刷装置及び印刷位置調整方法 |
US5883663A (en) * | 1996-12-02 | 1999-03-16 | Siwko; Robert P. | Multiple image camera for measuring the alignment of objects in different planes |
US6157870A (en) | 1997-02-18 | 2000-12-05 | Zevatech Trading Ag | Apparatus supplying components to a placement machine with splice sensor |
US6077022A (en) | 1997-02-18 | 2000-06-20 | Zevatech Trading Ag | Placement machine and a method to control a placement machine |
US6066206A (en) | 1997-02-21 | 2000-05-23 | Speedline Technologies, Inc. | Dual track stenciling system with solder gathering head |
DE19728144C2 (de) | 1997-07-02 | 2001-02-01 | Ekra Eduard Kraft Gmbh | Verfahren und Vorrichtung zum Erzeugen von Testmustern |
DE59711263D1 (de) | 1997-10-30 | 2004-03-04 | Esec Trading Sa | Verfahren und Einrichtung für die Justierung des Bondkopfs einer Maschine für das Bonden von Halbleiterchips auf ein Trägermaterial |
EP0923111B1 (de) | 1997-12-07 | 2007-05-02 | Oerlikon Assembly Equipment AG, Steinhausen | Halbleiter-Montageeinrichtung mit einem hin und her geführten Chipgreifer |
US6891967B2 (en) * | 1999-05-04 | 2005-05-10 | Speedline Technologies, Inc. | Systems and methods for detecting defects in printed solder paste |
US7072503B2 (en) * | 1999-05-04 | 2006-07-04 | Speedline Technologies, Inc. | Systems and methods for detecting defects in printed solder paste |
WO2001035703A1 (en) * | 1999-11-08 | 2001-05-17 | Speedline Technologies, Inc. | Improvements in solder printers |
GB2359515B (en) * | 2000-02-23 | 2003-12-03 | Kistech Ltd | Method of printing and printing machine |
US20030021886A1 (en) * | 2000-02-23 | 2003-01-30 | Baele Stephen James | Method of printing and printing machine |
US6569248B1 (en) | 2000-09-11 | 2003-05-27 | Allen David Hertz | Apparatus for selectively applying solder mask |
US6626106B2 (en) | 2001-04-17 | 2003-09-30 | Speedline Technologies, Inc. | Cleaning apparatus in a stencil printer |
KR100428510B1 (ko) * | 2002-04-10 | 2004-04-29 | 삼성전자주식회사 | 광학 시스템을 이용한 정밀 위치 제어 장치 및 방법 |
AU2003261430A1 (en) * | 2002-08-08 | 2004-02-25 | Fry's Metals, Inc. D/B/A Alpha Metals, Inc. | System and method for modifying electronic design data |
US20040032931A1 (en) | 2002-08-13 | 2004-02-19 | International Business Machines Corporation | X-ray alignment system for fabricaing electronic chips |
US7213738B2 (en) * | 2002-09-30 | 2007-05-08 | Speedline Technologies, Inc. | Selective wave solder system |
US7293691B2 (en) | 2003-01-17 | 2007-11-13 | Speedline Technologies, Inc. | Electronic substrate printing |
US6955120B2 (en) | 2003-03-28 | 2005-10-18 | Speedline Technologies, Inc. | Pressure control system for printing a viscous material |
US7013802B2 (en) * | 2004-02-19 | 2006-03-21 | Speedline Technologies, Inc. | Method and apparatus for simultaneous inspection and cleaning of a stencil |
US7121199B2 (en) * | 2004-10-18 | 2006-10-17 | Speedline Technologies, Inc. | Method and apparatus for supporting and clamping a substrate |
US20070102477A1 (en) * | 2005-11-10 | 2007-05-10 | Speedline Technologies, Inc. | Imaging system and method for a stencil printer |
US20070102478A1 (en) * | 2005-11-10 | 2007-05-10 | Speedline Technologies, Inc. | Optimal imaging system and method for a stencil printer |
US7458318B2 (en) | 2006-02-01 | 2008-12-02 | Speedline Technologies, Inc. | Off-axis illumination assembly and method |
US7549371B2 (en) * | 2006-07-10 | 2009-06-23 | Speedline Technologies, Inc. | Method and apparatus for clamping a substrate |
US20080156207A1 (en) * | 2006-12-28 | 2008-07-03 | Dan Ellenbogen | Stencil printers and the like, optical systems therefor, and methods of printing and inspection |
CN101229711B (zh) * | 2007-01-25 | 2010-06-02 | 东莞市凯格精密机械有限公司 | 视觉印刷机中单光轴检测的方法及机构 |
US7710611B2 (en) * | 2007-02-16 | 2010-05-04 | Illinois Tool Works, Inc. | Single and multi-spectral illumination system and method |
US7861650B2 (en) * | 2007-04-13 | 2011-01-04 | Illinois Tool Works, Inc. | Method and apparatus for adjusting a substrate support |
US7827909B2 (en) * | 2007-04-17 | 2010-11-09 | Illinois Tool Works Inc. | Stencil printer with multiplexed control of multi-axis machine having distributed control motor amplifier |
TWI394088B (zh) * | 2007-12-26 | 2013-04-21 | Altek Corp | The adjustment method of the size of the selection of the image object |
US20090255426A1 (en) * | 2008-02-14 | 2009-10-15 | Illinois Tool Works Inc. | Method and apparatus for placing substrate support components |
JP4941422B2 (ja) * | 2008-07-14 | 2012-05-30 | パナソニック株式会社 | 部品実装システム |
IT1398427B1 (it) * | 2009-09-03 | 2013-02-22 | Applied Materials Inc | Procedimento ed apparato di rilevazione dell'allineamento di un substrato |
CN102001242B (zh) * | 2010-10-14 | 2012-06-20 | 吴江迈为技术有限公司 | 一种用于太阳能电池片印刷的偏差测定方法、印刷方法及其装置 |
CN102092179B (zh) * | 2010-12-30 | 2012-07-04 | 东莞市科隆威自动化设备有限公司 | 一种全自动锡膏印刷机 |
CN102706302B (zh) * | 2011-07-04 | 2014-12-10 | 东莞市卓安精机自动化设备有限公司 | 印刷钢网自动检测装置 |
US9299118B1 (en) * | 2012-04-18 | 2016-03-29 | The Boeing Company | Method and apparatus for inspecting countersinks using composite images from different light sources |
US9370925B1 (en) | 2015-03-25 | 2016-06-21 | Illinois Tool Works Inc. | Stencil printer having stencil shuttle assembly |
US9370924B1 (en) | 2015-03-25 | 2016-06-21 | Illinois Tool Works Inc. | Dual action stencil wiper assembly for stencil printer |
US10723117B2 (en) | 2015-04-07 | 2020-07-28 | Illinois Tool Works Inc. | Lift tool assembly for stencil printer |
US10703089B2 (en) | 2015-04-07 | 2020-07-07 | Illinois Tool Works Inc. | Edge lock assembly for a stencil printer |
US9370923B1 (en) | 2015-04-07 | 2016-06-21 | Illinois Tool Works Inc. | Lift tool assembly for stencil printer |
EP3735807B1 (en) * | 2018-01-02 | 2023-09-13 | Illinois Tool Works Inc. | Edge lock assembly for a stencil printer and method and system therefor |
US11318549B2 (en) | 2019-06-13 | 2022-05-03 | Illinois Tool Works Inc. | Solder paste bead recovery system and method |
US11247286B2 (en) * | 2019-06-13 | 2022-02-15 | Illinois Tool Works Inc. | Paste dispensing transfer system and method for a stencil printer |
US11351804B2 (en) | 2019-06-13 | 2022-06-07 | Illinois Tool Works Inc. | Multi-functional print head for a stencil printer |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60103700A (ja) * | 1983-11-11 | 1985-06-07 | 株式会社日立製作所 | 部品の位置決め装置 |
JPS60247106A (ja) * | 1984-05-22 | 1985-12-06 | Fujitsu Ltd | 形状検査装置 |
US4672437A (en) * | 1985-07-08 | 1987-06-09 | Honeywell Inc. | Fiber optic inspection system |
DE3689406T2 (de) * | 1985-10-11 | 1994-06-16 | Hitachi Ltd | Verfahren zur Plazierung eines oberflächenmontierten Teiles und eine Vorrichtung dazu. |
-
1987
- 1987-11-02 US US07/116,490 patent/US4924304A/en not_active Ceased
-
1989
- 1989-04-17 CA CA000596903A patent/CA1320828C/en not_active Expired - Lifetime
- 1989-04-24 ES ES89304037T patent/ES2058512T3/es not_active Expired - Lifetime
- 1989-04-24 EP EP89304037A patent/EP0394568B1/en not_active Expired - Lifetime
-
1992
- 1992-01-31 US US07/829,727 patent/USRE34615E/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0394568B1 (en) | 1994-09-07 |
USRE34615E (en) | 1994-05-24 |
CA1320828C (en) | 1993-08-03 |
EP0394568A1 (en) | 1990-10-31 |
US4924304A (en) | 1990-05-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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