Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia Spain SA
Original Assignee
Alcatel Espana SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB22187/51Aexternal-prioritypatent/GB743404A/en
Application filed by Alcatel Espana SAfiledCriticalAlcatel Espana SA
Publication of ES204869A1publicationCriticalpatent/ES204869A1/en
Procedure for the manufacture of tin-plated copper wire comprising the operations of electrolytically depositing tin in a copper wire and drawing the wire to the required diameter with the specified tin thickness. (Machine-translation by Google Translate, not legally binding)
ES0204869A1951-09-211952-08-05A procedure for the manufacture of tinned copper wire (Machine-translation by Google Translate, not legally binding)
ExpiredES204869A1
(en)