ES2000198A4 - Catodo de pulverizacion - Google Patents

Catodo de pulverizacion

Info

Publication number
ES2000198A4
ES2000198A4 ES87870045T ES87870045T ES2000198A4 ES 2000198 A4 ES2000198 A4 ES 2000198A4 ES 87870045 T ES87870045 T ES 87870045T ES 87870045 T ES87870045 T ES 87870045T ES 2000198 A4 ES2000198 A4 ES 2000198A4
Authority
ES
Spain
Prior art keywords
cathode
spraying
substrates
bands
spray cathode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES87870045T
Other languages
English (en)
Other versions
ES2000198B3 (es
Inventor
Roland Devigne
Jean-Paul Vranken
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Glaceries Saint Roch SA
Original Assignee
Glaceries Saint Roch SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Glaceries Saint Roch SA filed Critical Glaceries Saint Roch SA
Publication of ES2000198A4 publication Critical patent/ES2000198A4/es
Application granted granted Critical
Publication of ES2000198B3 publication Critical patent/ES2000198B3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Coating By Spraying Or Casting (AREA)

Abstract

EL INVENTO SE REFIERE A UN CATODO (1) DESTINADO A LA PULVERIZACION DE CAPAS DELGADAS DE MATERIALES SOBRE UNO O VARIOS SUBSTRADOS SIGUIENDO LA TECNICA DE PULVERIZACION CATODICA. ESTA CONSTITUIDO POR UNA ESTRUCTURA (EN V) QUE CONSTA DE UNA ALIMENTACION ELECTRICA, ELEMENTOS DE ENFRIAMIENTO Y DOS PLANOS DE PULVERIZACION (6,7) EN LOS CUALES SE HALLAN DISPUESTAS, DE LADO A LADO, DOS BANDAS DE MATERIAL BLANCO QUE FORMA CON LAS BANDAS CORRESPONDIENTES EN EL OTRO PLANO UN CIRCUITO MAGNETICO UNICO, DE FORMA QUE ES POSIBLE TRATAR SIMULTANEAMENTE DOS SUBSTRATOS (44) DISPUESTOS A AMBOS LADOS DEL CATODO (1) SOBRE SUS SOPORTES (43). EL CATODO (1), DE ACUERDO CON EL INVENTO, ES PARTICULARMENTE IDONEO PARA EL REVESTIMIENTO DE SUBSTRADOS DE GRANDES DIMENSIONES, COMO EL VIDRIO.
ES87870045T 1986-04-03 1987-04-03 Catodo de pulverizacion. Expired - Lifetime ES2000198B3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8604789A FR2596920A1 (fr) 1986-04-03 1986-04-03 Cathode de pulverisation

Publications (2)

Publication Number Publication Date
ES2000198A4 true ES2000198A4 (es) 1988-01-16
ES2000198B3 ES2000198B3 (es) 1990-02-01

Family

ID=9333858

Family Applications (1)

Application Number Title Priority Date Filing Date
ES87870045T Expired - Lifetime ES2000198B3 (es) 1986-04-03 1987-04-03 Catodo de pulverizacion.

Country Status (5)

Country Link
US (1) US4780190A (es)
EP (1) EP0241447B1 (es)
DE (2) DE3760931D1 (es)
ES (1) ES2000198B3 (es)
FR (1) FR2596920A1 (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02194171A (ja) * 1989-01-20 1990-07-31 Ulvac Corp マグネトロンスパッタリング源
DE19853943B4 (de) * 1997-11-26 2006-04-20 Vapor Technologies, Inc. (Delaware Corporation), Longmont Katode zur Zerstäubung oder Bogenaufdampfung sowie Vorrichtung zur Beschichtung oder Ionenimplantation mit einer solchen Katode
FR2842347B1 (fr) * 2002-07-10 2004-12-03 Tecmachine Cathode pour machine de traitement par pulverisation sous vide
US7678198B2 (en) * 2004-08-12 2010-03-16 Cardinal Cg Company Vertical-offset coater
JP5090911B2 (ja) * 2004-09-03 2012-12-05 カーディナル・シージー・カンパニー 断続的コンベヤシステムを有するコータ
US20070158187A1 (en) * 2006-01-12 2007-07-12 Wagner Andrew V Cathode for a vacuum sputtering system
WO2014105872A2 (en) * 2012-12-27 2014-07-03 Flir Systems, Inc. Deposition systems and methods
JP7390922B2 (ja) * 2020-02-18 2023-12-04 東京エレクトロン株式会社 カソードユニットおよび成膜装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3956093A (en) * 1974-12-16 1976-05-11 Airco, Inc. Planar magnetron sputtering method and apparatus
JPS51117933A (en) * 1975-04-10 1976-10-16 Tokuda Seisakusho Spattering apparatus
US4179351A (en) * 1976-09-09 1979-12-18 Hewlett-Packard Company Cylindrical magnetron sputtering source
US4175030A (en) * 1977-12-08 1979-11-20 Battelle Development Corporation Two-sided planar magnetron sputtering apparatus
US4194962A (en) * 1978-12-20 1980-03-25 Advanced Coating Technology, Inc. Cathode for sputtering
US4200510A (en) * 1979-03-19 1980-04-29 Delbar Products, Inc. Assembly and method to extend useful life of sputtering targets
US4356073A (en) * 1981-02-12 1982-10-26 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
JPS57145982A (en) * 1981-03-03 1982-09-09 Toshiba Corp Target for sputtering device
US4415427A (en) * 1982-09-30 1983-11-15 Gte Products Corporation Thin film deposition by sputtering
US4443318A (en) * 1983-08-17 1984-04-17 Shatterproof Glass Corporation Cathodic sputtering apparatus
US4517070A (en) * 1984-06-28 1985-05-14 General Motors Corporation Magnetron sputtering cathode assembly and magnet assembly therefor
US4564435A (en) * 1985-05-23 1986-01-14 Varian Associates, Inc. Target assembly for sputtering magnetic material

Also Published As

Publication number Publication date
DE241447T1 (de) 1988-02-25
US4780190A (en) 1988-10-25
EP0241447B1 (fr) 1989-11-02
ES2000198B3 (es) 1990-02-01
DE3760931D1 (en) 1989-12-07
EP0241447A1 (fr) 1987-10-14
FR2596920A1 (fr) 1987-10-09

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